TW228579B - - Google Patents

Info

Publication number
TW228579B
TW228579B TW081106275A TW81106275A TW228579B TW 228579 B TW228579 B TW 228579B TW 081106275 A TW081106275 A TW 081106275A TW 81106275 A TW81106275 A TW 81106275A TW 228579 B TW228579 B TW 228579B
Authority
TW
Taiwan
Application number
TW081106275A
Original Assignee
Okukatsu Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okukatsu Seisakusho Kk filed Critical Okukatsu Seisakusho Kk
Application granted granted Critical
Publication of TW228579B publication Critical patent/TW228579B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Projection-Type Copiers In General (AREA)
TW081106275A 1991-08-28 1992-08-08 TW228579B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3217198A JP2769753B2 (ja) 1991-08-28 1991-08-28 画像形成用露光装置

Publications (1)

Publication Number Publication Date
TW228579B true TW228579B (zh) 1994-08-21

Family

ID=16700401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081106275A TW228579B (zh) 1991-08-28 1992-08-08

Country Status (6)

Country Link
US (1) US5258808A (zh)
EP (1) EP0534598B1 (zh)
JP (1) JP2769753B2 (zh)
KR (1) KR0139408B1 (zh)
DE (1) DE69210520T2 (zh)
TW (1) TW228579B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323209A (en) * 1993-04-30 1994-06-21 Sony Electronics Inc. Apparatus for precision alignment of plates used in two-sided contact printing
IL106892A0 (en) * 1993-09-02 1993-12-28 Pierre Badehi Methods and apparatus for producing integrated circuit devices
IL108359A (en) * 1994-01-17 2001-04-30 Shellcase Ltd Method and device for creating integrated circular devices
JP3334569B2 (ja) * 1996-09-27 2002-10-15 ウシオ電機株式会社 照射角度を変えられるプロキシミティ露光装置
US5923403A (en) * 1997-07-08 1999-07-13 Anvik Corporation Simultaneous, two-sided projection lithography system
KR100490577B1 (ko) * 1997-12-27 2005-08-25 우시오덴키 가부시키가이샤 조사각도를바꿀수있는프록시미터노광장치
JP2002099095A (ja) * 2000-09-25 2002-04-05 Orc Mfg Co Ltd 自動両面露光装置およびその方法
JP2006011371A (ja) * 2004-05-26 2006-01-12 Fuji Photo Film Co Ltd パターン形成方法
JP4816367B2 (ja) 2006-09-27 2011-11-16 ウシオ電機株式会社 光照射器およびインクジェットプリンタ
JP2008103143A (ja) * 2006-10-18 2008-05-01 Ushio Inc 光照射器およびインクジェットプリンタ
KR100915452B1 (ko) * 2008-04-28 2009-09-04 주식회사 프로텍 Ｓｌｍ을 이용한 상 하부 동시 노광 방식의 빔 미러 픽셀영상 위치정렬방법 및 장치
KR100922203B1 (ko) * 2008-04-28 2009-10-20 주식회사 프로텍 레이저 디렉트 이미징 시스템용 상하부 노광 엔진의위치정렬방법 및 장치
KR20090116333A (ko) * 2008-05-07 2009-11-11 주식회사 프로텍 상하 독립구동 방식의 양면 동시 노광시스템
US8610986B2 (en) 2009-04-06 2013-12-17 The Board Of Trustees Of The University Of Illinois Mirror arrays for maskless photolithography and image display
GB201217991D0 (en) * 2012-10-08 2012-11-21 Rainbow Technology Systems Ltd Registration system for phototools
US10204807B2 (en) * 2017-04-25 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for processing wafer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1282816A (en) * 1970-05-20 1972-07-26 Marconi Co Ltd Improvements in or relating to apparatus for the manufacture or printed circuits
US3877808A (en) * 1973-08-30 1975-04-15 Jr Carl R Jasperson Printed circuit board exposure holding device
US4389115A (en) * 1981-08-06 1983-06-21 Richter Thomas A Optical system
DE3238495C2 (de) * 1982-10-18 1985-07-11 Wilhelm Staub Gmbh, 6078 Neu-Isenburg Anlage zum beidseitigen Belichten von lichtempfindlichen Platten
DE3340653A1 (de) * 1983-11-10 1985-05-23 Hans 6250 Limburg Haus Vorrichtung zum gleichzeitigen oder aufeinanderfolgenden belichten von, auf beide seiten von leiterplatten o. dgl. aufgelegten ebenen kopiervorlagen
US4614425A (en) * 1984-04-20 1986-09-30 Western Litho Plate & Supply Co. Photographic printing method and apparatus
US4666294A (en) * 1984-12-31 1987-05-19 Klimsch & Co Kg Apparatus for exposure of both sides of printed circuit plates
JPS62212657A (ja) * 1986-03-14 1987-09-18 Oak Seisakusho:Kk 移送式の両面露光装置
JPS6346466A (ja) * 1986-08-13 1988-02-27 Oak Seisakusho:Kk 両面露光用ワ−クアライメント装置
JPH02254456A (ja) * 1989-03-29 1990-10-15 Orc Mfg Co Ltd フォトレジスト露光方法およびその装置
JPH02254455A (ja) * 1989-03-29 1990-10-15 Orc Mfg Co Ltd フォトレジスト露光方法およびその装置
US5147760A (en) * 1989-07-21 1992-09-15 Mitsubishi Denki Kabushiki Kaisha Method of exposing printed wiring boards having through holes
JP2769748B2 (ja) * 1991-05-13 1998-06-25 株式会社オーク製作所 画像形成用露光装置

Also Published As

Publication number Publication date
US5258808A (en) 1993-11-02
DE69210520T2 (de) 1996-09-19
EP0534598B1 (en) 1996-05-08
KR0139408B1 (ko) 1998-06-15
JP2769753B2 (ja) 1998-06-25
KR930004805A (ko) 1993-03-23
JPH0553321A (ja) 1993-03-05
DE69210520D1 (de) 1996-06-13
EP0534598A1 (en) 1993-03-31

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