TW214031B - - Google Patents
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- Publication number
- TW214031B TW214031B TW080106762A TW80106762A TW214031B TW 214031 B TW214031 B TW 214031B TW 080106762 A TW080106762 A TW 080106762A TW 80106762 A TW80106762 A TW 80106762A TW 214031 B TW214031 B TW 214031B
- Authority
- TW
- Taiwan
- Prior art keywords
- laminate
- item
- patent application
- resin
- ministry
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0253—Polyolefin fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
- B32B2262/062—Cellulose fibres, e.g. cotton
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
- Y10T428/249972—Resin or rubber element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
- Y10T428/249974—Metal- or silicon-containing element
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/654—Including a free metal or alloy constituent
- Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/635,087 US5098781A (en) | 1990-12-28 | 1990-12-28 | Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
TW214031B true TW214031B (US06969756-20051129-C00007.png) | 1993-10-01 |
Family
ID=24546397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW080106762A TW214031B (US06969756-20051129-C00007.png) | 1990-12-28 | 1991-08-26 |
Country Status (9)
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5346751A (en) * | 1988-12-19 | 1994-09-13 | W. R. Grace & Co.-Conn. | Electronic package using closed pore composites |
US5239956A (en) * | 1991-06-07 | 1993-08-31 | Detroit Diesel Corporation | Internal combustion engine cylinder heads and similar articles of manufacture and methods of manufacturing same |
US5391247A (en) * | 1992-01-24 | 1995-02-21 | Revlon Consumer Products Corporation | Hot stamping glass |
US5785789A (en) * | 1993-03-18 | 1998-07-28 | Digital Equipment Corporation | Low dielectric constant microsphere filled layers for multilayer electrical structures |
US5385778A (en) * | 1993-07-19 | 1995-01-31 | Southwest Research Institute | Toughened thermosetting resin composites and process |
AU645739B3 (en) * | 1993-08-19 | 1994-01-20 | Martial Armour Pty Limited | Bullet resistant material |
US5889104A (en) * | 1996-01-11 | 1999-03-30 | W. L. Gore & Associates, Inc. | Low dielectric constant material for use as an insulation element in an electronic device |
SG72708A1 (en) * | 1995-10-31 | 2000-05-23 | Sumitomo Bakelite Co | Multilayer printed circuit board and process for producing and using the same |
US5691059A (en) * | 1995-11-21 | 1997-11-25 | Minnesota Mining And Manfacturing Company | Glass and glass-ceramic bubbles having an aluminum nitride coating |
EP0972303A1 (en) * | 1997-04-03 | 2000-01-19 | W.L. Gore & Associates, Inc. | Low dielectric constant material with improved dielectric strength |
DE19742327A1 (de) * | 1997-09-19 | 1999-04-15 | Soenke Lucht | Verfahren zur Beschichtung von Metallteilen und anderen starren Gegenständen |
US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
US20050244954A1 (en) * | 1998-06-23 | 2005-11-03 | Blackburn Gary F | Binding acceleration techniques for the detection of analytes |
US7087148B1 (en) | 1998-06-23 | 2006-08-08 | Clinical Micro Sensors, Inc. | Binding acceleration techniques for the detection of analytes |
US6761816B1 (en) * | 1998-06-23 | 2004-07-13 | Clinical Micro Systems, Inc. | Printed circuit boards with monolayers and capture ligands |
CA2376697C (en) * | 1999-09-16 | 2004-10-26 | Ga-Tek Inc. | An adhesion promoting layer for use with epoxy prepregs |
US6906120B1 (en) * | 2000-06-20 | 2005-06-14 | General Electric | Poly(arylene ether) adhesive compositions |
US6495244B1 (en) * | 2000-09-07 | 2002-12-17 | Oak-Mitsui, Inc. | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
US6632511B2 (en) | 2001-11-09 | 2003-10-14 | Polyclad Laminates, Inc. | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards |
USRE44893E1 (en) | 2004-03-26 | 2014-05-13 | Hanwha Azdel, Inc. | Fiber reinforced thermoplastic sheets with surface coverings |
US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
CN102471590B (zh) * | 2009-07-14 | 2015-05-20 | 花王株式会社 | 低介电树脂组合物 |
US8617702B2 (en) | 2010-04-28 | 2013-12-31 | Sabic Innovative Plastics Ip B.V. | Thermally insulated structural members, and doors and windows incorporating them |
CN104559126B (zh) * | 2013-10-23 | 2017-09-05 | 深圳光启创新技术有限公司 | 聚苯醚组合物、板材、基板及基板的制作方法 |
CN103756252B (zh) * | 2013-12-03 | 2016-09-28 | 惠州市集和光电科技有限公司 | 一种热固性树脂基导热复合材料及其制备方法和应用 |
US10143973B2 (en) * | 2016-06-30 | 2018-12-04 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Metallopolyimide precursor fibers for aging-resistant carbon molecular sieve hollow fiber membranes with enhanced selectivity |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL141536B (nl) * | 1970-12-04 | 1974-03-15 | Fmc Corp | Werkwijze ter bereiding van een vlamvertragend, thermohardend materiaal. |
JPS5758396A (en) * | 1980-09-25 | 1982-04-08 | Kanegafuchi Chemical Ind | Method of producing metal foil lined laminated board |
JPS61943A (ja) * | 1984-06-14 | 1986-01-06 | Matsushita Electric Ind Co Ltd | 光メモリデイスク |
DE3688798T2 (de) * | 1985-01-23 | 1993-12-23 | Toyo Boseki | Mittels einer nichtgewobenen Stoffbahn aus Polyaramid verstärkte biegsame Folie und Verwendung derselben. |
US4963425A (en) * | 1985-03-05 | 1990-10-16 | Unisys Corporation | Printed wiring board substrate for surface mounted components |
DE3567140D1 (en) * | 1985-08-14 | 1989-02-02 | Toray Industries | Laminate board containing uniformly distributed filler particles and method for producing the same |
US5162450A (en) * | 1989-02-17 | 1992-11-10 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
KR920701362A (ko) * | 1989-10-06 | 1992-08-11 | 아더 엠.킹 | 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계 |
-
1990
- 1990-12-28 US US07/635,087 patent/US5098781A/en not_active Expired - Lifetime
-
1991
- 1991-08-26 TW TW080106762A patent/TW214031B/zh not_active IP Right Cessation
- 1991-11-21 CA CA002055982A patent/CA2055982C/en not_active Expired - Lifetime
- 1991-11-26 DE DE69127177T patent/DE69127177T2/de not_active Expired - Lifetime
- 1991-11-26 ES ES91120125T patent/ES2104648T3/es not_active Expired - Lifetime
- 1991-11-26 EP EP91120125A patent/EP0492154B1/en not_active Expired - Lifetime
- 1991-12-13 BR BR919105444A patent/BR9105444A/pt not_active IP Right Cessation
- 1991-12-20 JP JP35429091A patent/JP3256255B2/ja not_active Expired - Fee Related
- 1991-12-27 KR KR1019910024637A patent/KR100218023B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5098781A (en) | 1992-03-24 |
KR920011714A (ko) | 1992-07-24 |
DE69127177D1 (de) | 1997-09-11 |
BR9105444A (pt) | 1992-08-25 |
ES2104648T3 (es) | 1997-10-16 |
EP0492154A1 (en) | 1992-07-01 |
DE69127177T2 (de) | 1998-02-26 |
JP3256255B2 (ja) | 2002-02-12 |
CA2055982C (en) | 2002-03-05 |
JPH04302494A (ja) | 1992-10-26 |
CA2055982A1 (en) | 1992-06-29 |
KR100218023B1 (ko) | 1999-09-01 |
EP0492154B1 (en) | 1997-08-06 |
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