204399 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（1 ) 〔技術領域〕 本發明，僳有關在表面上備有釉部之陶瓷基板及其製 造方法，並且，關於使用該陶瓷基板而能發揮良好待性的 磁阻元件等之磁傳感器，印字機用的熱印頭，薄膜之電阻 器或電容器等的電子設備者。 〔背景技術〕 陶瓷基板，在品質之安定性及加工的容易性很優異， 自先前，就在電子構件之領域，以各種形式被使用。 其中，施釉的陶瓷基板，主要傈被使用在以薄膜做為 機能部用之電子設備。 做為先前例之一，有在特開昭61—94383號公 報所掲示的應用強磁性薄膜之磁阻元件。在第1圖（A) ,顯示在同公報被掲示的磁阻元件之平面圖。同時，雖在 同公報未被記載，但是根據一般性的釉基板之剖面構造， 在第1圖（B)顯示前述（A)圖的沿A — A線之剖面圖 。圖中1為陶瓷片，2為釉部。在該釉部2的表面，被形 成有強磁性薄膜4所成之傳感器部4S。再者，4T傺表 示端子部。通常，磁阻元件，係傳感器部以0.1撤米以 下的薄膜被形成。因此，至少在傳感器形成領域之表面， 傺該表面的粗撻度之值儘可能小較佳。通常，如果未使該 表面粗糙度之值成為膜厚值以下時，無法得到所希望的元 件特性。然而，陶瓷之表面粗糙度，通常傺在數撤米前後 。因此，直接使用時，即使形成傳感器部也不能得到做為 (請先閲讀背面之注意事項再填寫本頁) 丁 本紙張尺度遑用中B 家標準(CNS)甲4規格(210X297公釐) 81. 5. 20.000(H) -3 - 2 04399 A6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（2 ) 元件所需要的特性。所以，如第1圓所示，為了減低被形 成傳感器部4 S的部位之表面粗糙度，將被進行上釉。此 時，為了使表面粗糙度充份地小，得到沒有針孔等之安定 的表面狀態，釉部2之厚度，通常需要25〜60微米程 度。如此，將可以使釉部2的表面粗度，成為0.1撤米 以下。通常，釉部2之表面，傜從其終端部向内側彎曲到 1〜2咖程度，25〜60徹米的段差，被從釉部2之終 端部缓和地形成。 在第2圖（A),顯示形成元件前的陶瓷基板1 12 之平面圖，在同圖（B)顯示（A)圖的沿A — A線之剖 面圖。第2圖（A)的虛線a所包圍之領域，相當於在第 1圖所示構造的元件1個之份。 第3圖，像使陶瓷基板112的釉部2之厚度為大約 3 0 w m ,寬為約2 ran時的釉部2之表面形狀測定例。由 同圈可知，釉寬為2 ran程度時，表面幾乎没有平坦的領域 Ο 如在第1圖所示之磁阻元件的傳感器部4S,通常， 係以將線寬10徹米程度之細線折返數個的圃案被形成， 而被要求高的圖案精確度。因此，傳感器部僳盡可能形成 平坦之領域為理想。相對地，如果釉面窄時，如第3圖所 示，釉部面全體將會彎曲，而不能得到圖案用的平坦領域 ，故將無法形成精確度高之圏案。為了消除如此的問題， 先前，像由於使第2團（A)及（B)所示之基板1 12 的釉部2,成為例如5ηππ至10mm程度地加大，而在從釉 (請先閱讀背面之注意事項再填寫本頁) 丁 本紙張尺度逍用中國國家搮準(CNS)甲4規格(210x297公*) 81. 5. 20.000(H) -4 - 204399 A 6 B6 經濟部中央標準局貝工消費合作社印製 五、發明説明（3 ) 部終端充份離開之釉部的中央，形成釉部之平坦領域，在 此平坦的部位形成傅感器部。 然而，此時由於必須把釉部取宽，且把傅感器形成在 離開釉部終端的領域，所以元件必然會變大。近年來，隨 著在電子製品的馬逹之薄型化，而被要求元件的小型化。 然而，由於如上述之理由，在如第2園所示的先前之基板 ，釉部的端部將會簿曲很大，想要確保能形成良好的傅感 器部之平坦領域，將必須使釉部的面稹加寬，結果，無法 使元件小型化。 再者，即使為了小型化而勉強把釉部領域縮小，也將 會如第3圖所示地，釉部表面弯曲很大，變成將在此彎曲 面形成圖案，而不能得到形狀精確度，結果，镉離電壓會 變大，難以製作有實用性的具有特性之元件。 對此，有時將釉部面以研磨，使表面成為平坦，但是 ，要把基板表面全駸一樣地研磨非常困難，且工程複雑而 將增加成本。並且，即使是經過研磨，也不能去除釉部終 端部之彎曲。 做為另一先前例，有特開平1—293676號公報 所掲示的磁傅感器。在第4圃（A),顯示在同公報所掲 示的磁傅慼器之剖面。和前例一樣，圖中1為陶瓷片，2 為釉部。同時，在形成磁傅感器的基板，在釉部2和厚膜 電極7之間，有擴散層8。由將Ni条合金膜4，被著形 成在釉部2,擴散層8及厚膜電極7之上，而完成磁傳感 器。再者，圖中像將保護膜，導線等的記載省略。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度边用中國家樣準(CNS)甲4規格(210X297公釐) 81. 5. 20,000(H) -5 - 204389 A6 B6 經濟部中央標準局貝工消費合作社印製 五、發明説明（4 ) 根據該特開平1一293676號公報時，磁傳感器 用基板，係如第4圈（B)所示•在氧化鋁等的絶緣基板 1上，把厚膜電極材料7 —和釉材料2 >使一部份會重疊 地塗敷，同時予以燒成而形成。該重叠部份X,相當於（ A)圖的擴散層8之形成域，被記載為由於互相擴散，而 在形狀上将會缓和地接合，在同公報的圈面（前述第4國 (A)),好像是釉部2,擴散層8,厚膜霄極7分別被 平坦地形成同一高度地被畫出。然而，在實際上，把第4 圖（4)的以虛a被包園之領域，卽擴散層8的周圔放大 來看時，如在第4圖（C)所示，即使能夠使之成為缓和 ,但是對於釉部2,將會産生約電極材料7/的膜厚份之 起伏，而不能使擴散層8本身成為平坦。為了使之成為平 坦，雖然也有以比平常的燒成溫度高之高溫燒成，或一面 加以振動而燒成的方法，但是，因此將會使釉部材料和電 極材料之擴散到達更大的範圍，而使基板沒有利用價值。 再者，由於如第4圖（B)所示，把釉部材料2 <和厚膜 電極材料7 /重叠，予以同時燒成，故在擴散層8也不能 控制其形狀及擴散的程度。並且，由於擴散層8並非绝緣 層，故在其部位形成磁傅感器時之傅慼器部時，將會降低 炙敏度或提高偏移電壓等，對其特性會有不良影鬱。因此 ，在此情況，傳感器部也需要設在比擴散層8充份内側的 釉部領域，而不適合元件之小型化。同時，由於像將厚膜 電極材料和釉部材料的線膨脹僳數相差很大之材料予以重 叠而予以燒成，所以也有會在其間斷線之虡。 (請先閲讀背面之注意事項再填窝本頁) τ 本紙張尺度遑用中《 _家樣準(CNS)甲4規格(210x297公釐) 81. 5 . 20.000(H) -6 - 204399 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（5 ) 並且，做為其他的先前例，有在待開昭 6 3 — 349 8 6號所掲示之應用備有貫通孔的陶瓷基板 之磁阻元件。 在第5園，顯示製作在該公報所掲示的磁阻元件前之 陶磁基板1 13的構造。第5圖（A)將其平面圖，同圔 (B)將（A)圖中以虛線a被包園的領域之沿A — A線 的剖面圖分別顯示。在該公報中，釉部2雖被畫成平坦， 但是，實際上傺和前述第1之先前例一樣，其終端部有很 大的彎曲。同時，（A)圖中以虛線b被包圃之領域，相 當於製作磁阻元件時的1個傅感器晶片部份。在基板 113,以所定之間隔有貫通孔，使基板的表面和背面經 由導電材料7被電性連接。同時，在基板113表面之其 他領域被施以上釉2。 第6圖（A),顯示在如第5圖所示的基板，使用將 貫通孔之孔距節減少到例如2mm程度而製作之貢通孔基板 ，形成磁阻元件晶片時的平面圖，而在同画（B)顯示前 述（A)圖之沿A_A線的剖面國。該基板構造，也和前 述基板一樣地釉部2彎曲。因此，在此情況，也是如果未 把第5圖所示的基板上之孔節距取大，將虛線b所包園的 1晶片部份之釉部領域設成寬大，就無法在平坦的部位形 成傳感器部。因此，和前述之先前例一樣，想要使元件小 型化時，有很大的陣礙。 如此地，先前像無法在狹窄的釉部領域或以細小之節 距有孔的基板，未經研磨無法得到平坦之釉部面。因此， (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度逍用中《國家榣準(CNS)甲4規格(210X297公釐) 81. 5. 20.000(H) -7 - A 6 B6 204399 五、發明説明（6 ) (請先閲讀背面之注意事項再填寫本頁) 使用如此的基板時，很難使元件小型化。再者，也有將厚 膜電極材料和釉部材料重疊，由於同時燒成，而使釉部面 和電極材料之境界缓和的方法。然而，此時在釉部和m棰 之間有擴散層，其境界不清楚。同時，在形狀上雖然也會 變為缓和，但是將會産生電棰材料的膜厚份之起伏。因此 ,將和前例一樣地無法有效利用到釉部終端，故對元件的 小型化有障礙。 經濟部中央標準局員工消費合作社印製 再者，雖非與本發明有鼸的技術領域之發明，但在特 開平3—35506號公報被記載有，在基板上設置對向 電極和在此等電極間設置複數的霄阻膜之基板，想要實現 前述電阻膜的高密度配置之發明。該發明之目的，你在為 了實現電阻膜的高密度配置，而防止電極漿和電阻漿在印 刷將之滲出。因此，採取在绝緣基板上事先印刷釉部，予 以燒成，將之做為其後形成的前述電極漿和霄阻漿之防止 滲出帶而使用的構成。如此地，在該公報，釉部並非為了 形成機能部，而只是完成做為電極漿和霣阻漿之防止滲出 帶的功能，而且，釉部本身係在印刷到基板上後，直接予 以燒成，故在本發明做為問題的釉部終端部之防止彎曲， 還是維持未解決。 再者，相反地也有釉部成為彎曲突出的形狀較理想之 情況。那是，把基板適用到熱印頭的情況。如果把發熱層 形成在彎曲突出之釉部上，則能得到凸狀的發熱體，而能 把發熱體部所産生之熱有效率地傳到記錄紙之故。然而， 在先前的基板，雖能得到彎曲突出之釉部，但是不可能把 81. 5. 20,000(H) 本紙張尺度遑用中國家揉準(CNS)甲4規格(210 x 297公*) -8 - Α6 Β6 204399 五、發明説明（7 ) 一定形狀的釉部安定地形成。 (請先閲讀背面之注意事項再填寫本頁) 〔發明之掲示〕 本發明之目的，傺在消除如上述的問題點，提供雖然 小型化但是圖案形成之精確度高，能製作寓於量産性及可 靠性的機能元件之基板構造，亦即，在狹窄的釉部領域或 以細密之節距有孔的基板，也到釉部終端部為止備有平坦 之釉部的電子設備用陶瓷基板及其製造方法，以及使用該 陶瓷基板之電子設備者。 並且，本發明之其他目的，你在提供，由諝整釉部材 料的量，而將釉部之弯曲任意地設定的陶瓷基板，其製造 方法以及使用該陶瓷基板之電子設備者。 為了達成如此之目的，本發明的陶瓷基板，其特徽像 ，在陶瓷片之表面上被形成隆起部，鄰接在該隆起部的至 少一部份，在前述陶瓷Η之表面被形成釉部，構成前述睡 起部的材料和構成前述釉部之材料不同者。 經濟部中央標準局員工消費合作社印製 在此，前述隆起部也可以被形成在前述釉部的終端之 全域。 再者，前述隆起部也可以為線狀，且被形成複數，也 可以為長方體狀，且被形成複數。 同時，以前述釉部和鄰接在該釉部的前述隆起部，被 形成為大約同一高度，同時，前述釉部之表面成為平坦者 為理想。相對地，前述釉部也可以在大約全域同樣地突出 而彎曲。 81. 5. 20,000(Η) 本紙張尺度遑用中《家樣準(CNS)甲4規格(210X297公*) -9 - £04399 A 6 B6 經濟部中央標準局貝工消費合作社印製 五、發明説明（8 ) 再者，前述陶瓷片具有貫通孔或凹部，在該貫通孔或 凹部的周園被形成有前述隆起部也可以。在此，以具有前 述凹部之陶瓷片上的釉部表面，和前述凹部之底面的段差 有50wm以上，前述釉部之平均表面粗糙度為0. 2 wm以下，比較理想。 同時，前述隆起部，可由和構成基板主鼸的陶瓷同一 材料被形成，也可由和構成基板主《的陶瓷不同之陶瓷材 料被形成，並且，也可以用導電性材料被形成。 本發明的陶瓷基板之製造方法，其待徴為，至少包含 下述的工程 (1) 在平滑之陶瓷胚板的表面上所定部位，將糊狀 的可燒成材料印刷塗佈，同時予以燒成，而得到在表面有 隆起部之陶瓷片的工程， (2) 在包含前述陶瓷片上之隆起部的一端之所定部 位，將玻璃糊印刷塗佈，予以燒成而形成釉部之工程。 在此，前述胚板可以為以所定的節距被設置貫通孔或 凹部之胚板，在前述貫通孔或凹部的開口部周圍，形成前 述隆起部。在此情況，也可以把前述被設置凹部的胚板， 將以所定節距被開孔之胚板，和平坦的胚板貼合而形成。 更且，也可以使前述被設置凹部之胚板，將以所定節距被 開孔的胚板，和平坦的旺板經由玻璃曆貼合而形成。 同時，可以將前述隆起部，由和構成前述胚板的材料 同一之陶瓷糊構成，也可以由和構成前述胚板的材料不同 之陶瓷糊構成，更且，也可以由導電材料所成的糊形成。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中國國家標準(CNS)甲4規格(210X297公釐) 81. 5. 20,000(fl) -10 - 2〇43δ9 a 6 ___Β6_ 五、發明説明（9 ) (請先閲讀背面之注意事項再填寫本頁) 做為本發明之電子設備，可以考盧其特激為，在陶瓷 片的表面上被形成隆起部，鄰接在該隆起部在前述陶瓷片 之表面被形成平坦的釉部，構成前述隆起部之材料和構成 前述釉部的材料不同，在前述平坦之釉部及陶瓷Η表面上 被形成強磁性薄膜，在前述釉部上將被形成傅感器部，同 時在前述的陶瓷片上被形成有端子電極之磁阻元件。 做為本發明的其他電子設備，可以考盧其特徴為，在 陶瓷片之表面上被形成導電性的隆起部，鄰接在該睡起部 在前述陶瓷片之表面被形成平坦的釉部，在前述平坦之釉 部上被形成霄阻，在該霣阻被連接有前述導電性的隆起部 之晶片電阻元件。 做為本發明的更其他之霄子設備，可以考慮其特徽為 ，在陶瓷片之表面上被形成隆起部，鄰接在該隆起部在前 述陶瓷Μ之表面被形成彎曲狀地突出的釉部，構成前述隆 起部的材料和構成前述釉部之材料不同，在前述釉部的爾 曲之突出面上被形成發熱層，而被形成有和該發熱層連接 的端子電極之熱印頭。 經濟部中央標準局貝工消費合作社印製 〔實施例〕 以下，將本發明之實施例參照圔面予以說明。 實施例1 第7圖為顯示本發明的第1實施例者。 本實施例的基板101,傺主要構成部由陶瓷片1所成， 81. 5. 20.000(H) 本紙張尺度逋用中國國家標準(CNS)甲4規格(210X297公釐) 11 204399 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（10) 以一定之間隔被施以線狀之釉部2的構成。第7圖（A) 為其平面圃，同圖（B)係（A)晒之沿A — A線的剖面 圖。本實施例中，在主要構成部之陶瓷片1的表面，僳除 了釉部2被形成之處以外為隆起。然後，該陲起部3和將 被設在其鄰接部份的前述釉部2之境界部附近，傺以大約 同一高度被形成，鄰接在釉部2的端部之隆起部3成為堵 住釉部材料的構造。釉部2之表面像和陲起部3的表面在 同一水平，且成為平坦。再者，釉部2的厚度為約40 μχη,釉部2之表面的平均粗柢度為大約0. 〇2wm程 度。 以下，關於本實施例基板之製造法，參照第8圖予以 說明。 首先，製作如第8園（A)及（B)所示的平坦之陶 瓷胚板1。接著，如（C)圖及（D)圖所示，以一定節 距在胚板1上，將同一材料所成的陶瓷糊（隆起部）3, 以網販印刷等手法塗佈的40 Aim厚度。其後，進行同時 燒成，把陶瓷燒固，而得到備有隆起部3之陶瓷片1。接 著，在以前述工程被形成的隆起部3以外之陶瓷表面將玻 瑰漿印刷塗佈，予以燒成而得到如第7圖所示的備有線狀 釉部2之陶瓷基板101。此時，由將釉部材料，即玻班 漿塗佈適切量，而能使釉部燒成後的釉部2之表面，形成 和隆起部3同一水平而且平坦。 做為構成基板101的主要部份之陶瓷片1的材料， 雖無特別規定，但以氧化鋁，氮化鋁，碩化矽為理想之材 (請先閱讀背面之注意事項再填寫本頁) -裝. 訂_ -線· 本紙》尺度逍用中國國家樣準(CNS)甲4規格(210X297公*) 81. 5. 20.000(H) -12 - 204399 A6 B6 經濟部中央標準局貝工消費合作社印製 五、發明説明（11) 料。 在本例中，係將隆起部3以和基板主要構成材料同一 材料予以形成，但是，陲起部之材料也沒有特別限定。再 者，本例中，隆起部3的燒成，你和主要部的陶瓷H1同 時進行，但是，隆起部3之塗佈，燒成也可以在陶瓷片1 的燒成後進行。但是，此時之燒成溫度，以和主要部陶瓷 1的燒成溫度同等，或其以下為理想。 釉部2之材質雖然也没有特別規定，但是由於需要將 釉部以隆起部堵住，所以熔點或燒成溫度，像比陶瓷及隆 起部之材料低者為理想。尤其是，要在釉部的表面上形成 薄膜，故以無碱条材料特別理想。含有碱時，在高濕度環 境等容易産生圖案的腐蝕，而容易損害可靠性。並且，為 了防止在釉部界面發生龜裂，陶瓷1的材質和釉部2之材 質的線膨脹像數之差愈小愈理想。 實施例2 把使用前述實施例1的基板1〇1,製作磁阻元件時 之實施例示如第9圖。再者，做為基板的陶瓷材料係使用 氧化鋁，做為釉部材料傜使用無碱条材料。基板僳使釉部 會成平坦地，將釉部材料適量地塗佈，燒成者。第9圖( A)為磁阻元件的平面圖，同圖（B)為（A)圖之沿A 一 A線的剖面圖。圖中，4S僳將傅感器部，5像將端子 電極部分別顯示。第7圖（A)之以虚線a被圍的領域， 相當於第9圖之1僱元件份的領域。本實施例之磁阻元件 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中困家檫準(CNS)f 4規格(210x297公釐) 81. 5 . 20,000(H) -13 - 204399 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（12) ，可由在陶瓷基板101的表面全體，將具有磁阻效果之 強磁性薄膜4噴鍍成膜厚50OA程度後，使用導電材料 的塗佈或電鍍等手法形成端子電極部5,其後，經照相製 販工程形成所霈形狀之圃案而予以製作。通常，像再形成 保護膜，但在圖面中予以省略。 如前述基板101的構造時，由於釉部面之端部未如 先前例地彎曲，而到陶瓷境界部都是平坦，故能有效地使 用到該境界部附近。因此，根據該基板101時，能把傳 感器部4S形成到釉部2的終端部，故能容易地使元件小 型化。同時，由於釉部2偽平坦，所以設法使元件小型化 也能形成高精確度之圖案，做為元件特性將成不利要因的 偏移電壓之值，將能抑制為低值。 實施例3 第10圖，條顯示本發明的第3實施例者。該實施例 之基板102,係在釉部2的終端部備有陶瓷所成之細線 狀的隆起部3,且以一定之間隔被施以線狀的釉部2之構 成。第10圖（A)為其平面圖，同圔（B)為（A)圖 的沿A — A線之剖面圖。在此例的情形，也是釉部2和鄰 接釉部2的終端部之陶瓷製線狀隆起部3,被形成大約同 一高度，使釉部2的表面成為平坦。 第11圖，傜使釉部2之厚度成為約25wm,寬度 約2皿1，使陶瓷隆起部3之厚度為約25wm,宽度約 0. 1皿1而製作基板102時的釉部附近之表面狀態的測 (請先閲讀背面之注意事項再填窝本頁) 裝- 線· 本紙張尺度遑用中困家樣準(CNS)甲4規格(210X297公釐) 81. 5. 20,000(H) -14 - η Λ 04399 Α6 Β6 經濟部中央標準局貝工消費合作社印製 五、發明説明（13) 定例。再者，本測定例之基板，未施以研磨處理。如第 11圖所示，釉面你到釉部終端部為止成為平坦，可知在 釉部的終端部，隆起部3和基板上之底部1b的段差被陡 急地形成。和第3圖所示的先前之基板的拥定例比較時， 本發明的基板之釉部領域非常平坦。因此，該情況也和前 例一樣，將由於把電極部形成在釉部2上，而能容易地把 元件小型化。 該基板構造，可由在表面平滑的陶瓷胚板1之所定部 位，把同一材料所成的陶瓷漿印刷塗佈成線狀，形成線狀 之隆起部3,予以同時燒成後，在包含隆起部3的端部之 所定部位將玻璃漿印刷塗佈，予以燒成而得到。 實施例4 第12圖，為顯示本發明的第4實施例者。本實施例 之基板103,俱在陶瓷Η 1上的所定部位以一定之間隔 被形成長方型的隆起部3之構成。第12圖（Α)為其平 面圔，同圖（Β)為（Α)圖的沿A — Α線之剖面圖，同 圖（C)為（A)國的沿B — B線之剖面圖。此例的情況 ，也是釉部2之終端部和隆起部3,係以大約同一高度被 形成，釉面成為平坦。 該基板構造，係在表面平滑的陶瓷胚板1之所定部位 ，以網販印刷等手法，把和前述陶瓷不同材料所成的漿印 刷塗布成長方型，予以同時燒成後，在以該工程被形成的 包含隆起部3之終端面的所定部位，把玻璃漿予以印刷塗 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中Β 家標準(CNS)甲4規格(210X297公釐) -15 - 81. 5. 20.000(H) 204399 A6 B6 經濟部中央標準局员工消费合作社印製 五、發明説明（14) 佈，再度燒成而得到。如此地，把隆起部3以和基板的主 要構成材料之陶瓷Ml不同的材料形成，也沒有任何不妥 。再者，此時也可以如前述，睡起部3在陶瓷Η 1的燒成 後再予以形成。 做為隆起部3之材料，在本例中僳為陶瓷材料，但也 可以用導電性材料形成。但是，以導電性材料形成隆起部 3時，做為其材質，以和釉部材料之間難以産生擴散者為 理想，因此，熔點或燒成溫度比釉部材料离者為理想。再 者，也可以做為導電材料使用Pt等高溫燒成，高耐熱材 料，而將陶瓷和導霄材料予以同時燒成。 做為釉部材料，使用熔點或燒成溫度比隆起部3低的 材料時，做為逹成堵住釉的功用之構成隆起部3的材料， 即使是導電性者，也能使用更一般性的Ag条，Pd条者 0 第13圈，偽顯示本發明的電子設備用之陶瓷基板的 釉部2之終端部的剖面構迪例。第13園（A)〜（C) ,為前述實施例的陶瓷基板之釉部終端部附近的剖面放大 圖。亦即，（A)圔為前述第1實施例基板101的主要 部份剖面圖，（B)圖為前述第3實施例基板102之主 要部份剖面圖，（C)圖為前述第4實施例基板103的 主要部份剖面圖。再者，（C)圖傺把前述（B)圖之隆 起部3，以和基板材料1不同的陶瓷或導電材料形成時之 陶瓷基板104的主要部份剖面構造。並且，（E)圔為 (B)圖的基板表面上之陶瓷露出部105b比釉部2的 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逍用中家檫準(CNS)甲4規格(210x297公*) 81. 5. 20.000(H) _ 16 _ 04399 A6 B6 經濟部中央標準局员工消費合作社印製 五、發明説明（15) 下面If低，釉部材料2以陶瓷隆起部3被堵住的構成之 基板105的剖面構造。該基板構造，可由將平坦的陶瓷 胚板1 a和在所定部位已開孔加工之陶瓷胚板1 b層暖後 ，把陶瓷漿塗佈在所定部位形成隆起部3,—起同時燒成 後，在面1 f上把玻璃漿2塗佈，燒成而得到。再者，園 (F)傲在前述（E)豳的隆起部3,以和基板材料1不 同之陶瓷，或導電材料被形成的基板106的剖面構造。 此等（E) , (F)圃之基板105, 106,像和後述 實施例10所示的基板同一構造。 此等在第13國所示之基板101〜106,僳釉部 2的表面成為和隆起部3同一水平之高度，釉部2的全面 成為平坦。此點，可由設置隆起部3,再加上把釉部材料 塗佈適切量，予以燒成而實現。 實施例5 第14画，條顯示本發明的第5實施例者，本實施例 之基板107,俗在如第7圖或第8圖所示的備有隆起部 3之陶瓷片1把釉材料塗佈隆起部3的厚度以上，予以燒 成時之備有釉部基板。釉部材料像通常表面張力也大，因 此，只要有隆起部，即使熔融也不易從堵住的部位溢出， 而流到外面。所以，也能形成如此大的突出，彎曲之釉部 2。此時之彎曲量，主要是可以根據釉的塗佈量或燒成溫 度，在某範園設定為需要之值。 如前所述，根據本發明之製造方法時，由於選當選擇 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度遑用中困家樣準(CHS)甲4規格(210X297公釐) 81. 5. 20,000(H) -17 - 204399 Α6 Β6 五、發明説明（16) 釉部材料的量，也能在所定之釉部領域，將釉部的簿曲任 意地設定。 實施例6 第15圖，為備有貫通孔的本發明之陶瓷基板108 的實施例。第15圖（A)像其平面圖，同圖（B)為（ A)圖之以虛線a被園的領域之沿A — A線的剖面圖。在 本實施例中，陶瓷Ml有貫通孔，陶瓷片1的表面和背面 傺經由在貫通孔側面也被塗佈1之導電材料3/,被電性 地導通。該導電材料3/條延出到陶瓷片1的表面，此部 份傺從表面隆起。然後，釉部2被形成到該導轚性的隆起 部3之端部，使釉部2能變為平坦地，釉部材料被適量塗 佈，所以釉部2的表面偽到其終端部為止成為平坦。 經濟部中央標準局員工消費合作社印製 接著，蘭於前述基板108之製造方法，參照第16 圖予以說明。首先，製作平坦的陶瓷胚板1。接著，使用 由模具之沖孔等手法，如在第16園（A)及（B)所示 ，形成貫通孔。其後，如在第16圖（C)及（D)所示 ，把由導電材料所成的漿3>在貫通孔及其周圍以網販印 刷等手法予以塗佈。此時，做為導電材料，使用能和陶瓷 同時燒成的Pt等离耐熱材料。接著，以同時燒成，把陶 瓷片1及導電材料3 /予以燒固。接著，在導霣材料3 / 之隆起部3的周圍之陶瓷片1的霉出部份把玻璃漿印刷塗 佈，予以燒成而完成如第15圖所示之陶瓷基板108。 此時，將成為貫通孔厚膜電極的導電材料3 /之陶瓷Η 1 81. 5 . 20.000(H) (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中家樑準(CNS)甲4規格(210x297公*) -18 - 04399 A6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（17) 表面上的隆起部3,達成堵住釉部2之任務。 實施例7 把使用前述實施例6的陶瓷基板108,製作磁阻元 件時之實施例示如第17圖。第17園（A)為其平面國 。同時圃（B)為（A)圖的沿A — A線之剖面圖。園中 ,4S表示傅感器部，5像表示端子電極部。第15圔（ A)的虛線b所圍之領域，相當於該第17圖的元件1値 份之領域。 本實施例的磁阻元件，僳和實施例一樣，可以在陶瓷 基板108之整體表面，把具有磁阻效果的強磁性薄膜噴 鍍後，使用導電材料之塗佈或電鍍等手法形成端子電棰部 5後，由經過照相製販工程形成所需形狀的圓案而予製作 。再者，此後將被形成保護膜，但是省略其圖示。 該構造的基板108,也使釉部2能成為平坦，設置 隆起部3,同時使之能成為和隆起部3同樣高度，將釉部 材料適量地塗佈，故和實施例1一樣，釉部面不像先前例 一樣地彎曲。因此，到陶瓷境界部（隆起部）都是平坦， 故能容易地使元件小型化，設法使之小型化也能形成精確 度高的圓案，不易産生偏移電壓等問題。在第1表顯示， 包含偏移電壓把顯示相同特性之磁阻元件，使用如第5圄 所示的先前之基板及本實施例的基板製作時之需要面稹的 比較例。從第1表可知，由使用本發明之基板，將能把顯 示和先前相同特性的元件，以大約1/4之面積製作。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中B 家樣準(CNS)甲4規格(210x297公釐) 81. 5. 20,000(H) -19 - 204399 Α6 Β6 經濟部中央標準局員工消費合作社印製 五、發明説明（18) 相對地，使用先前的基板時，將必須加大元件之尺寸 ，其原因如下。逭是，為了得到能發揮和本發明的元件一 樣之良好特性的傳感器部，必須在平坦之面上設置傅感器 部，但在先前之基板，由於釉部的端部將會彎曲，所以為 了得到平坦的釉部領域，必須擴大釉部之故。 第1表 外形尺寸 以本發明基板製作 2 wd X 2 mm 以先前基板製作 4 an X 4 mm 實施例8 在第18圖，使用前述第15圃所示構造之基板 108,製作晶Η電阻元件時的實施例。第18圖（A) 為其平面圖，同圖（Β)為（Α)圖的沿A — Α線之剖面 圖。圖中，6為被設在釉部2上的NiCr或丁&21^等 電阻材料所成之電阻部，逋接在貫通孔電極的導電材料 3 /之隆起部3。第15圖（A)的虛線c所包園之領域 ，相當於該第1 8圖的元件1傾份。如此地，也可以使用 本發明之基板製作晶Η電阻元件。 實施例9 在第19圖，顯示備有貫通孔構造的備有釉部陶瓷基 板之本發明的其他實施例。第1 9圖（Α)為其平面圖， 面積比 1 4 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度遑用中困家標準(CNS)甲4規格(210X297公*) 81. 5. 20.000(H) -20 - 204399 A 6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（19) 同圖（B)為（A)圓的沿A — A線之剖面圖。此時，陶 瓷基板109上的釉部2,僳成為釉部材料由陶瓷所形成 之隆起部3被堵住的構造。 接著，說明關於本實施例基板之製造方法。在平滑的 陶瓷胚板1以模具打孔形成貫通孔為止，你和前例相同。 其後，在貫通孔周圍（包含以後将成為皤起部3釣部位） 塗佈陶瓷漿。接著，把陶瓷由同時燒成予以燒結。然後， 將玻瑰漿適量地，使之在燒成後會和隆起部3成為相同高 度地，在除去由陶瓷所成的隆起部3及貫通孔部以外之基 板表面予以印刷塗佈，再予以燒成，而完成如第19圖所 示的備有釉部基板109。 此時，也因釉部面成為平坦，所以和前製作例時一樣 ，適用在製作磁阻元件時，將能不招致特性之劣化而設法 使元件小型化。 實施例1 〇 第2 0圖，為顯示具有如前述第13圖（E)所示的 剖面構造之本發明的備有釉部之陶瓷基板110的實施例 者。第20圖（A)為其平面圖，同圖（B)為（A)圖 之沿A — A線的剖面圖。在本實施例中，僳凹部成為四方 型。如此地，凹部之形狀也可以為四方型。 以下，説明該基板110的製法之一例。 首先，把平滑的陶瓷胚板1 a和以模具沖床等在所定 部位以一定間隔開四方型孔之陶瓷胚板lb予以層壓。接 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂- 線- 本紙張尺度遑用中家樣準(CNS)甲4規格(210X297公*) 81. 5 . 20,000(H) -21 - η 04399 A6 B6 經濟部中央標準局員工消費合作社印製 五、發明説明（20) 著，把相同材料所成的陶瓷漿在所定部位，亦即在開四方 型孔部之周園印刷塗佈形成隆起部3, —起同時燒成。其 後，在前述四方型孔的内部和隆起部3以外之陶瓷片1上 塗佈玻瑰漿2,予以燒成而能得到本實施例基板110。 再者，前述製造方法，偽把平滑的陶瓷胚板1 a,和 以模具沖床等在所定部位隔著一定間隔開四方型孔之陶瓷 胚板lb予以層壓，而做為陶瓷片1,但是，也可以將前 述胚板1 a和1 b的層壓，以結晶化玻瑰予以粘接。 實施例1 1 把使用前述實施例的基板110,製作磁阻頭之實施 例示如第2 1圖。第2 1圖（A)為其平面圃，同圖（B )為（A)圔的沿A — A線之剖面圔。圖中，4S表示傳 感器部，表示配線部，5像表示端子電棰。第20圖 (A)的虛線所圍領域，相當於第21圓之元件1個份的 領域。因此，前述端子電極5偽位於前述基板110之四 方型孔的内部。 如此構造的磁阻頭，由於把端子部5連接導線，進行 塑模時，也將能對傅感器部4S表面把塑模表面形成較低 ，故能製作面對向型之磁阻頭。 在如此的電子設備，將傅感器之機能部設在釉部上， 把端子部形成在凹部，進行端子部補強用的塑模，其樹脂 對傳感器機能部不會突出之構造，所使用的陶瓷基板，自 釉部之最上面到凹部之底面為止之段差尺寸，需要5 0 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度遑用中家樣準(CNS)甲4規格(210x297公*) -22- 81. 5. 20.000(H) % 04399 Α6 Β6 經濟部中央標準局員工消費合作社印製 五、發明説明（21) w m以上而以1 0 0 «m以上為理想。 同時，由於傳感器機能部的膜厚，通常為1wm以下 ，所以釉部的表面粗糙度之值，以0. 2以下為理想 ，如此，將能得到良好的傳感器。本發明之基板的平坦之 釉部，像符合該條件者。 實施例1 2 第22圖，俗使用具有如前述第14画所示的剖面構 造之本發明的備有釉部之陶瓷基板107的熱印頭之剖面 圖。 本實施例的熱印頭，傈在前述陶瓷基板107之釉部 2上及陶瓷Η 1表面上，有發熱電咀膜6連續地被覆蓋。 然後，在除去前述釉部2的中央部份上之前述發熱電阻膜 6上被形成端子電極膜5,並且，做為最上層有耐磨損保 護膜10覆蓋前述釉部2上地被形成。 根據前述構成的熱印頭時，由於發熱部僳由彎曲突出 之釉部2成為凸出形狀，故能把發熱部所産生的熱有效率 地傳給記錄紙。 如以上所述，由於本發明之基板，你使之成為釉部以 隆起部被堵住的構造，故能由選擇釉部材料之塗佈量，而 使其到終端都非常平坦。同時，根據本發明時，由於把睡 起部形成線狀，將能夠不需要研磨工程，而形成釉部面平 坦，且在終端部有銳利段差之釉部面。 再者，由於將釉部材料的塗佈量設定成較多。也能夠 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度遑用中國國家#準(0胳)甲4規格(210X297公*) 81. 5. 20.000(H) -23 - 2 04399 A6 B6 經濟部中央標準局貝工消费合作社印製 五、發明説明（22) 在所定之釉部領域任意地設定釉部的爾曲。 由使用釉部到其終螭都平坦的本發明之基板，將能夠 把需要在釉部面形成傳感器部的磁阻元件等電子設備小型 化，並且小型化之後也能形成精確度良好的園案。同時， 該基板也能適用在薄膜之磁阻頭等電子構件，也能夠適用 在其他需要在基板表面形成高精確度圓案的各種電子設備 Ο 釉部彎曲的本發明之基板，可以適用在熱印頭等，在 釉部有凸出較理想的電子設備。 〔産業上之利用領域〕 如在以上所述，根據本發明時，由於在基板的表面上 被形成隆起部，而該睡起部像位於釉部之終端，故由選擇 釉部材料的塗佈量，即使未經研磨，也能使釉部面到其終 端部為止平坦地形成。同時，能夠形成釉部面平坦，且在 釉部和底子的陶瓷部之境界具有銳利的段差之基板。因此 ,能夠把在基板表面具有機能部的磁阻元件等之磁傅感器 ，或由薄膜的電阻等所成之薄膜晶片元件等機能設備，不 招致特性的劣化而容易地小型化。 同時，根據本發明時，將能夠由於把釉部材料塗佈成 隆起部的厚度以上予以燒成，而在所定之釉部領域，得到 具有弯曲的釉部之基板。再者，其彎曲形狀，能由蘧擇袖 部材料的量而任意設定。如此構造之基板，能夠應用在熱 印頭等的電子設備。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逍用中家楳準(CNS)甲4規格(210X297公*) 81. 5. 20,000(H) -24 - 2〇43θ9 A 6 Β6 經濟部中央標準局貝工消費合作社印製 五、發明説明（23) 園面之簡單說明 第1圖（A) , ( B ),像顯示使用先前的陶瓷基板 製作之磁阻元件者，（A)圈為同元件的平面園，（B) 圖為（A)圖之沿A — A線的剖面圏， 第2圖（A) , (B),像顯示先前的玻璃釉陶瓷基 板者，（A )圖為同基板之平面圖，（B)圈為（A)圖 的沿A—A線之剖面圖， 第3圖為使前述先前的基板之釉部寬度成為大約2mm 時的釉部表面狀態之測定例， 第4圖（A), ( B ) , (C),像顯示備有厚膜電 極的先前之陶瓷基板者，（A)圃為同陶瓷基板的側剖面 圖，（B )圖為顯示同陶瓷基板上之釉部形成過程的製造 中之基板的側剖面圔，（C)圖為在（A)圖之a部的實 際上之放大剖面圖， 第5圖（A) , (B),為潁示先前的備有貫通孔之 陶瓷基板者，（A)圖為同先前的陶瓷基板之平面圖，（ B)圖為（A)圖的沿A — A線之剖面圖， 第6圖（A) , ( B ),為顯示使用第5園所示的先 前之貫通孔基板製作的磁阻元件者，（A)圖為同先前之 貫通孔基板的平面圖，（B)圖為（A)圓之沿A — A線 的剖面圖， 第8圖（A)至（D),僳為了說明本發明的第1實 施例陶瓷基板之製造法用者，（A)圖為構成同陶瓷基板 (請先閲讀背面之注意事項再填寫本頁) -裝· 訂· 線. 本紙張尺度遑用中國國家標準(CNS)甲4規格(210X297公*) 81. 5. 20,000(H) _ 25 - A 6 B6 204399 五、發明説明（24) (請先閲讀背面之注意事項再填寫本頁) 的陶瓷片之平面圖，（B)圈為（A)圃的沿A — A線之 剖面圖，（C)圖為形成隆起部的狀態之前述陶瓷片的平 面圖，（D)圖為（C)圖之沿A — A線的剖面圖， 第9圖（A) , (B),為顯示本發明的第2實施例 者，（A)圖為使用前述第1實施例之陶瓷基板製作的磁 阻元件之平面圖，（B)圖為（A)圈的沿A — A線之剖 面圖， 第10圖（A) , (B),為顯示本發明的第3實施 例者，（A)圃為本發明的陶瓷基板之平面園，（B)圖 為（A)國的沿A — A線之剖面圏， 第11圖，為使前述第3實施例的陶瓷基板之釉部寬 度成為約2mm時的表面狀態'之測定例， 第12圖（A)至（C),為顯示本發明的第4實施 例者，（A)圖為備有導霄部之本發明陶瓷基板的平面圖 ,(B)圖為（A)圖之沿A — A線的剖面圃，（C)圖 為（A)圖之沿B — B線的剖面圈， 經濟部中央標準局貝工消費合作社印製 第13圖（A)至（F),分別為本發明的實施例之 陶瓷基板及其變形例的釉部終端部近邊之剖面圖， 第14圖為顯示本發明的第5實施例者，條釉部全體 為突出彎曲形狀之陶瓷基板的主要部份剖面圖， 第15圖（A), (B),為顯示本發明的第6實施 例者，（A)圖為備有貫通孔之陶瓷基板的平面圖，（B )圖為（A)圖之沿A — A線的剖面圓， 第16圖（A)至（D),偽為了說明第15圔所示 81. 5. 20.000(H) 本紙張尺度遑用中國家標準(CNS)甲4規格(210X297公釐） -26 - 經濟部中央標準局員工消費合作社印製 2〇4油9__B6 __ 五、發明説明（25) 的本發明之陶瓷基板的製造法用者，（A)画為構成同陶 瓷基板之陶瓷片的平面園，（B )圖為（A)圖之沿A — A線的剖面圖，（C)圖為塗佈貫通孔導電材料後之前述 陶瓷片的平面圖，（D)圖為（C)圖之沿A — A線的剖 面圖， 第17圖（A) , (B),為顯示本發明的第7實施 例者，（A)圖為使用備有前述貫通孔之陶瓷基板製作的 磁阻元件之平面圖，（B)圖為（A)圃的沿A — A線之 剖面圖， 第18_ (A) , (B),為顯示本發明的第8實施 例者，（A)圖為使用備有前述貫通孔之陶戔基板製作的 晶片電阻元件之平面圖，（B)圈為（A)園的沿A — A 線之剖面圖， 第19圖（A), (B),為顯示本發明的第9實施 例者，（A)圖為備有和前述貫通孔不同形狀之貫通孔的 陶瓷基板之'平面圖，（B)圖為（A)圖的沿A — A線之 剖面圃， 第20圓（A), (B),為顯示本發明的第10實 施例者，（A)圖為備有凹部之陶瓷基板的平面圖，（B )圖為（A)圖之沿A — A線的剖面圖， 第21圖（A), (B),為顯示本發明的第11實 施例者，（A)圖為使用前述備有凹部之陶瓷基板製作的 磁阻頭之平面圖，（B)圖為（A)圖的沿A — A線之剖 面圖， (請先閲讀背面之注意事項再填寫本頁) 裝. 訂- 線< 本紙張尺度遑用中國目家樣準(CNS)甲4規格(210X297公*) 81. 5. 20,000(H) -27 - 204399 A 6 B6 五、發明説明（26)第22圖，為顯示本發明的第12實施例者，你使用 第14圖所示之備有彎曲凸狀的釉部之陶瓷基板製作的熱 印頭之剖面圖。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度逍用中8國家標準(CNS)甲4規格(210X297公龙) 81. 5. 20.000(H) -28 -204399 A 6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the Invention (1) [Technical Field] The present invention relates to a ceramic substrate with a glazed portion on the surface and a manufacturing method thereof, and It is a ceramic substrate and a magnetic sensor that can exert good waitability, such as a magnetic sensor, a thermal head for a printing machine, a thin film resistor or a capacitor, and other electronic equipment. [Background Art] Ceramic substrates are excellent in quality stability and ease of processing. Since the beginning, they have been used in various forms in the field of electronic components. Among them, glazed ceramic substrates are mainly used in electronic devices that use thin films as functional parts. As one of the previous examples, there is a magnetoresistive element using a ferromagnetic thin film shown in Japanese Patent Publication No. 61-94383. Figure 1 (A) shows a plan view of the magnetoresistive element shown in the same publication. At the same time, although not described in the same publication, according to the general cross-sectional structure of the glaze substrate, FIG. 1 (B) shows the cross-sectional view along line A-A of the aforementioned (A). In the figure, 1 is a ceramic piece, and 2 is a glazed part. On the surface of the glaze portion 2, a sensor portion 4S formed of a ferromagnetic thin film 4 is formed. In addition, 4T Ye represents the terminal part. Normally, the magnetoresistive element is formed as a thin film of 0.1 m or less in the sensor part. Therefore, at least on the surface where the sensor is formed, it is better that the roughness of the surface is as small as possible. Normally, if the value of the surface roughness is not less than the film thickness value, the desired device characteristics cannot be obtained. However, the surface roughness of ceramics is usually around a few meters. Therefore, when it is used directly, even if the sensor part is formed, it cannot be used (please read the precautions on the back and then fill out this page) Dingben paper size is used in the B standard (CNS) A 4 specification (210X297 mm) 81 . 5 20.000 (H) -3-2 04399 A6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (2) Features required by the components. Therefore, as shown in the first circle, in order to reduce the surface roughness of the portion where the sensor portion 4 S is formed, it will be glazed. At this time, in order to make the surface roughness sufficiently small, and to obtain a stable surface state free of pinholes, etc., the thickness of the glaze portion 2 usually needs to be 25-60 microns. In this way, the surface roughness of the glaze 2 can be made 0.1 m or less. Normally, the surface of the glaze portion 2 is curved inwardly from its terminal portion to a degree of 1 to 2 coffee, and a step of 25 to 60 cm is gradually formed from the terminal end of the glaze portion 2. Fig. 2 (A) shows a plan view of the ceramic substrate 1 12 before forming the device, and Fig. 2 (B) shows a cross-sectional view taken along line A-A of Fig. (A). The area enclosed by the dotted line a in Fig. 2 (A) corresponds to one component of the structure shown in Fig. 1. Fig. 3 shows an example of measuring the surface shape of the glaze portion 2 when the thickness of the glaze portion 2 of the ceramic substrate 112 is about 30 mm and the width is about 2 ran. From the same circle, it can be seen that when the glaze width is about 2 ran, there is almost no flat area on the surface. As shown in the sensor section 4S of the magnetoresistive element shown in FIG. 1, usually, a thin line with a line width of about 10 cm is folded back Several garden plans are formed, and high pattern accuracy is required. Therefore, it is desirable that the sensor section be as flat as possible. On the contrary, if the glaze surface is narrow, as shown in Fig. 3, the entire glaze surface will be bent, and a flat area for patterns cannot be obtained, so a high-precision coil cannot be formed. In order to eliminate such a problem, previously, the glaze portion 2 of the substrate 1 12 shown in the second group (A) and (B) was increased to, for example, 5ηππ to 10 mm, and the slave glaze (please read Note on the back and then fill out this page) Dingben paper size is easy to use China National Standard (CNS) A 4 specifications (210x297 g *) 81. 5. 20.000 (H) -4-204399 A 6 B6 Central Bureau of Standards, Ministry of Economic Affairs Printed by Beigong Consumer Cooperative V. Description of the invention (3) The center of the glaze part where the terminal is fully separated forms a flat area of the glaze part, and a flat sensor part is formed on this flat part. However, at this time, since the glaze portion must be widened and the Fu sensor is formed in an area away from the terminal of the glaze portion, the element must become larger. In recent years, as electronic products have become thinner, miniaturization of components has been demanded. However, due to the above reasons, in the previous substrate as shown in the second circle, the end of the glaze part will be greatly curved. To ensure that a good flat area of the sensor part can be formed, it will be necessary to The surface of the glaze is widened, and as a result, the element cannot be miniaturized. Furthermore, even if the area of the glaze portion is narrowed for miniaturization, as shown in FIG. 3, the surface of the glaze portion is greatly curved, and a pattern will be formed on the curved surface, and the shape accuracy cannot be obtained. The cadmium ionization voltage will become larger, making it difficult to produce practical and characteristic components. In this regard, sometimes the surface of the glaze is polished to make the surface flat, but it is very difficult to polish the surface of the substrate as a whole, and the cost of the engineering will increase. Also, even after grinding, the curvature of the end of the glaze cannot be removed. As another previous example, there is a magnetic sensor shown in Japanese Patent Laid-Open No. 1-293676. In the fourth garden (A), the cross section of the magnetic filter shown in the same communiqué is shown. As in the previous example, 1 in the figure is a ceramic sheet, and 2 is a glazed part. At the same time, a diffusion layer 8 is provided between the glaze portion 2 and the thick film electrode 7 on the substrate forming the magnetic sensor. The Ni stripe alloy film 4 is formed on the glaze portion 2, the diffusion layer 8 and the thick film electrode 7 to complete the magnetic sensor. In the figure, the description of the protective film, wires, etc. is omitted. (Please read the precautions on the back before filling in this page) This paper uses the Chinese National Standard (CNS) A4 specifications (210X297 mm) 81. 5. 20,000 (H) -5-204389 A6 B6 Central Ministry of Economic Affairs Printed by Beigong Consumer Cooperative of the Bureau of Standards 5. Description of the invention (4) According to Japanese Patent Application Laid-Open No. 1-293676, the substrate for the magnetic sensor is shown in the fourth circle (B) On top, the thick-film electrode material 7 and the glaze material 2 are applied so as to overlap and fire at the same time. This overlapping portion X, which corresponds to the formation area of the diffusion layer 8 in (A), is described as due to mutual diffusion, it will be gently joined in shape, on the ring surface of the same publication (the aforementioned )) It seems that the glaze part 2, the diffusion layer 8, and the thick film electrode 7 are flatly formed and drawn at the same height. However, in practice, when the area surrounded by the virtual a in Figure 4 (4) is enlarged, the circumference of the diffusion layer 8 is enlarged, as shown in Figure 4 (C), even if it can be made It becomes gentle, but for the glaze portion 2, the thickness of the electrode material 7 / will fluctuate, and the diffusion layer 8 itself cannot be flattened. In order to make it flat, there are also methods of firing at a higher temperature than usual, or vibrating on one side, but this will spread the glaze material and electrode material to a larger range , And make the substrate useless. Furthermore, as shown in Figure 4 (B), the glaze material 2 < It overlaps with the thick-film electrode material 7 and is fired at the same time. Therefore, the shape and degree of diffusion of the diffusion layer 8 cannot be controlled. In addition, since the diffusion layer 8 is not an insulating layer, the formation of a magnetic sensor part at the part thereof will reduce the burning sensitivity, increase the offset voltage, etc., and will adversely affect its characteristics. Therefore, in this case, the sensor portion also needs to be provided in the glaze portion area inside the diffusion layer 8, which is not suitable for miniaturization of the device. At the same time, materials such as thick-film electrode materials and glaze materials that have very different linear expansion coefficients are overlapped and fired, so there may also be gaps between the lines. (Please read the precautions on the back before filling in the nest page) τ This paper uses the "_Home Sample Standard (CNS) A4 specification (210x297mm) 81. 5. 20. 000 (H) -6-204399 A 6 B6 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (5) And, as other previous examples, there are pending opening of Zhao 6 3 — 349 8 6 The application shown is a magnetoresistive element with a through-hole ceramic substrate. In the fifth circle, the structure of the ceramic substrate 1 13 before the magnetoresistive element shown in this publication is shown. Figure 5 (A) shows the plan view, and Tong (B) shows the cross-sectional view along the line A-A of the area enclosed by the dotted line a in the figure (A). In this publication, although the glaze portion 2 is drawn flat, in fact, as in the previous example of the first example, the terminal portion has a large curvature. At the same time, the area covered by the dotted line b in (A) in the figure is equivalent to the part of a susceptor chip when manufacturing a magnetoresistive element. The substrate 113 has through holes at predetermined intervals, so that the front and back surfaces of the substrate are electrically connected via the conductive material 7. At the same time, glaze 2 is applied to other areas of the surface of the substrate 113. Figure 6 (A) shows the plan view of the substrate shown in Figure 5, using a tributary through-hole substrate made by reducing the pitch of the through-holes to, for example, 2 mm to form a magnetoresistive element wafer, and The same picture (B) shows the section country along the line A_A in the aforementioned (A) picture. This substrate structure also bends the glaze 2 in the same manner as the aforementioned substrate. Therefore, in this case, if the hole pitch on the substrate shown in FIG. 5 is not large, and the glaze area of the 1 wafer portion enclosed by the dotted line b is set to be wide, it cannot be in a flat portion The sensor part is formed. Therefore, as in the previous example described above, there is a great hindrance when the device is to be downsized. As such, in the past, it was impossible to obtain a flat glaze surface without polishing in a narrow glaze area or a substrate with holes at a fine pitch. Therefore, (please read the precautions on the back and then fill out this page) This paper is used in the "National Standard (CNS) A 4 specifications (210X297mm)" 81. 5. 20. 000 (H) -7-A 6 B6 204399 V. Description of invention (6) (Please read the precautions on the back before filling in this page) When using such a substrate, it is difficult to miniaturize the components. In addition, there is also a method of overlapping the thick-film electrode material and the glaze portion material by firing at the same time, thereby relaxing the boundary between the glaze portion surface and the electrode material. However, at this time, there is a diffusion layer between the glaze and m, and its state is unclear. At the same time, although the shape will become gentle, it will cause fluctuations in the film thickness of the electrical material. Therefore, as in the previous example, the terminal of the glaze cannot be effectively used, so there is an obstacle to miniaturization of the device. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. Although it is not an invention in the technical field related to the present invention, it is described in Japanese Patent Laid-Open No. 3-35506, where a counter electrode is provided on the substrate A substrate in which a plurality of resistive films are provided between electrodes is an invention in which a high-density arrangement of the resistive film is realized. The purpose of this invention is to prevent the electrode paste and the resistive paste from oozing out in order to realize the high-density configuration of the resistive film. Therefore, the glaze portion is printed on the insulating substrate in advance and fired, and it is used as a leaching prevention tape for the electrode paste and the slag resist formed later. In this way, in this gazette, the glaze part is not intended to form a functional part, but only fulfills the function of preventing the seepage zone as an electrode paste and an anti-paste paste. Furthermore, the glaze part itself is directly fired after being printed on the substrate Therefore, the problem of preventing the bending of the terminal portion of the glaze in the present invention remains unresolved. In addition, on the contrary, there is a case where the shape of the glaze portion is bent and protruded more preferably. That is the case where the substrate is applied to the thermal head. If the heat generating layer is formed on the curved glaze portion, a convex heating element can be obtained, and the heat generated by the heating element portion can be efficiently transferred to the recording paper. However, in the previous substrate, although it is possible to obtain a curved protruding glaze, it is impossible to put 81. 5. 20,000 (H) This paper scale is made of China National Standard (CNS) Grade 4 (210 x 297 g *) -8-Α6 Β6 204399 V. Description of the invention (7) The glaze of a certain shape is formed stably. (Please read the precautions on the back before filling in this page) [Indications of the invention] The purpose of the present invention is to eliminate the above-mentioned problems, to provide a small pattern but with high accuracy of pattern formation, which can be produced in mass production and Reliable substrate structure of functional elements, that is, ceramic substrates for electronic devices with flat glazed parts up to the end of the glazed part in narrow glazed parts or substrates with holes at a fine pitch, and Manufacturing method, and electronic equipment using the ceramic substrate. Also, for other objects of the present invention, you are providing a ceramic substrate whose glaze portion curvature is arbitrarily set according to the amount of glaze portion material, its manufacturing method, and an electronic device using the ceramic substrate. In order to achieve such a purpose, the ceramic substrate of the present invention, the special emblem image, is formed with a raised portion on the surface of the ceramic sheet, adjacent to at least a part of the raised portion, a glazed portion is formed on the surface of the aforementioned ceramic H, The material constituting the aforementioned sleeping portion is different from the material constituting the aforementioned glazed portion. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Here, the aforementioned uplift can also be formed in the entire area of the terminal of the aforementioned glaze. In addition, the above-mentioned protruding portion may be linear and formed in plural, or may be rectangular parallelepiped and formed in plural. At the same time, it is desirable that the glaze portion and the raised portion adjacent to the glaze portion are formed at approximately the same height, and at the same time, the surface of the glaze portion becomes flat. On the other hand, the aforementioned glaze portion may protrude and bend in a similar manner over the entire area. 81. 5. 20,000 (Η) This paper scale is used in the "Home Sample Standard (CNS) A4 Specification (210X297) *) -9-£ 04399 A 6 B6 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (8 ) In addition, the ceramic sheet has a through hole or a recessed portion, and the raised portion may be formed on the circumference of the through hole or the recessed portion. Here, the glaze surface on the ceramic sheet having the aforementioned recessed portion, and the bottom surface of the recessed portion have a step difference of more than 50wm, the average surface roughness of the aforementioned glazed portion is 0. 2 wm or less, ideal. Meanwhile, the aforementioned raised portion may be formed of the same material as the ceramic constituting the main substrate of the substrate, or may be formed of a ceramic material different from the ceramic constituting the main substrate of the substrate, and may also be formed of a conductive material. The method for manufacturing a ceramic substrate of the present invention includes the following steps: (1) printing and coating a paste-like sinterable material on a predetermined portion of the surface of a smooth ceramic blank while burning The process of obtaining a ceramic sheet having a raised portion on the surface, (2) Printing and coating a glass paste on a predetermined portion including one end of the raised portion on the ceramic sheet, and firing to form a glazed portion. Here, the green plate may be a green plate provided with through holes or recesses at a predetermined pitch, and the aforementioned raised portions are formed around the openings of the through holes or recesses. In this case, it is also possible to form the green plate provided with the recessed portion by bonding the green plate with a predetermined pitch to a flat green plate. Furthermore, the green sheet provided with the recessed portion may be formed by laminating the green sheet which is perforated at a predetermined pitch with a flat plate through a glass calendar. At the same time, the raised portion may be composed of the same ceramic paste as the material constituting the blank, or may be composed of a ceramic paste different from the material constituting the blank, and may also be a paste made of a conductive material form. (Please read the precautions on the back before filling in this page) This paper uses the Chinese National Standard (CNS) Grade 4 (210X297mm) 81. 5. 20,000 (fl) -10-2〇43δ9 a 6 ___ Β6_ V. Description of the invention (9) (please read the precautions on the back before filling in this page) As an electronic device of the present invention, you can take Lu Qi's special experience as A bump is formed on the surface of the ceramic sheet, and a flat glaze is formed on the surface of the ceramic sheet adjacent to the bump. The material constituting the bump is different from the material constituting the glaze. The flat glaze and A ferromagnetic thin film is formed on the surface of the ceramic H, a sensor part is formed on the glaze part, and a magnetoresistive element of a terminal electrode is formed on the ceramic sheet. As another electronic device of the present invention, it may be considered that the conductive ridge is formed on the surface of the ceramic sheet, and the flat glaze is formed on the surface of the ceramic sheet adjacent to the sleeping portion. A chip resistor is formed on the flat glaze portion, and the chip resistor element to which the conductive bump is connected is connected to the corner resistor. As a further Xiaozi device of the present invention, it can be considered that its special emblem is that a ridge is formed on the surface of the ceramic sheet, and a glazed portion protruding curvedly is formed on the surface of the ceramic M adjacent to the ridge The material constituting the protruding portion is different from the material constituting the glaze portion. A heat generating layer is formed on the protruding surface of the curved portion of the glaze portion, and a thermal head of the terminal electrode connected to the heat generating layer is formed. Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs [Embodiments] Hereinafter, the embodiments of the present invention will be described with reference to the side. Embodiment 1 FIG. 7 shows a first embodiment of the present invention. The substrate 101 of this embodiment, the main constituent part of Ye is made of ceramic sheet 1, 81. 5. 20. 000 (H) This paper scale is printed in China National Standard (CNS) Grade 4 (210X297 mm) 11 204399 A 6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention Instructions (10) The configuration of the linear glaze 2 is applied. Figure 7 (A) is its flat garden, and the same figure (B) is (A) the cross-sectional view along the line A-A. In the present embodiment, the surface of the ceramic sheet 1 which is the main constituent part is raised except where the glaze part 2 is formed. Then, the raised portion 3 and the boundary portion of the aforementioned glaze portion 2 to be provided at the adjacent portion thereof are formed at approximately the same height, and the raised portion 3 adjacent to the end of the glazed portion 2 becomes a blocked glaze The construction of the materials. The surface image of the glaze portion 2 and the surface of the raised portion 3 are at the same level and flat. Furthermore, the thickness of the glaze portion 2 is about 40 μχη, the average roughness of the surface of the glaze portion 2 is about 0. 〇2wm degree. Hereinafter, the method of manufacturing the substrate of this embodiment will be described with reference to FIG. 8. First, a flat ceramic blank plate 1 as shown in the eighth garden (A) and (B) is produced. Next, as shown in Figures (C) and (D), apply a ceramic paste (protrusion) 3 made of the same material to the blank plate 1 at a constant pitch, and apply 40 Aim by web printing, etc. thickness. Thereafter, simultaneous firing is performed to sinter the ceramics to obtain a ceramic sheet 1 provided with ridges 3. Next, a glass paste is printed on the surface of the ceramic other than the bump 3 formed by the above-mentioned process, and fired to obtain a ceramic substrate 101 having a linear glaze 2 as shown in FIG. At this time, the surface of the glaze 2 after firing the glaze can be formed at the same level and flat as the ridge 3 by applying a proper amount of glaze material, i.e., Banban slurry. As the material of the ceramic sheet 1 that constitutes the main part of the substrate 101, although there are no special regulations, alumina, aluminum nitride, and silicon silicon are ideal materials (please read the precautions on the back before filling this page) -Install. Order_ -Line · This paper "standard Chinese standard (CNS) Grade 4 specifications (210X297 g *) 81. 5. 20. 000 (H) -12-204399 A6 B6 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (11). In this example, the raised portion 3 is formed of the same material as the main constituent material of the substrate, but the material of the raised portion is not particularly limited. Furthermore, in this example, the firing portion 3 is fired at the same time as the ceramic H1 of the main portion. However, the firing portion 3 may be applied and fired after the firing of the ceramic sheet 1. However, the firing temperature at this time is preferably the same as the firing temperature of the main portion ceramic 1 or less. Although the material of the glaze portion 2 is not specifically defined, since the glaze portion needs to be blocked by the raised portion, the melting point or firing temperature is preferably lower than the material of the ceramic and the raised portion. In particular, since a thin film is to be formed on the surface of the glaze, it is particularly preferable to use an alkali-free strip material. When it contains alkali, it is easy to cause pattern corrosion in a high-humidity environment, etc., and it is easy to damage reliability. In addition, in order to prevent cracks at the interface of the glaze, the difference between the linear expansion images of the material of the ceramic 1 and the material of the glaze 2 is preferably as small as possible. Example 2 An example of manufacturing a magnetoresistive element using the substrate 101 of the foregoing Example 1 is shown in FIG. 9. Furthermore, alumina is used as the ceramic material of the substrate, and alkali-free strip material is used as the glaze material. The substrate will flatten the glaze, and apply a proper amount of glaze to the sinter. Figure 9 (A) is a plan view of the magnetoresistive element, and the same figure (B) is a cross-sectional view taken along line A-A of (A). In the figure, the sensor part of 4S is shown, and the terminal electrode part is shown as 5 images. The area enclosed by the dotted line a in FIG. 7 (A) is equivalent to the area occupied by components in FIG. The magnetoresistive element of this embodiment (please read the precautions on the back before filling in this page). This paper uses the CNS f 4 specification (210x297 mm) 81. 5. 20,000 (H) -13-204399 A 6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of invention (12) The ferromagnetic thin film 4 with magnetoresistive effect can be sprayed on the entire surface of the ceramic substrate 101 After the film thickness is about 50 OA, the terminal electrode part 5 is formed by a method such as coating or electroplating of a conductive material, and thereafter, it is formed by forming a nursery shape with a photographic manufacturing process. Normally, the protective film is formed again, but it is omitted in the drawing. In the structure of the aforementioned substrate 101, since the end of the glaze surface is not bent as before, and the ceramic boundary is flat, it can be effectively used near the boundary. Therefore, according to this substrate 101, the sensor portion 4S can be formed to the terminal portion of the glaze portion 2, so that the element can be easily downsized. At the same time, since the glaze portion 2 is pseudo-flat, it is possible to form a high-precision pattern by miniaturizing the device. As a device characteristic, the value of the offset voltage which becomes an unfavorable factor can be suppressed to a low value. Embodiment 3 FIG. 10 is a bar showing the third embodiment of the present invention. The substrate 102 of this embodiment is composed of a thin wire-shaped ridge portion 3 made of ceramics at the terminal portion of the glaze portion 2, and the wire-shaped glaze portion 2 is applied at regular intervals. Figure 10 (A) is a plan view, and Tong (B) is a cross-sectional view taken along line A-A of (A). In the case of this example, the glaze portion 2 and the ceramic linear protrusion 3 adjacent to the terminal portion of the glaze portion 2 are formed at approximately the same height, so that the surface of the glaze portion 2 becomes flat. Figure 11, Yan makes the thickness of the glaze portion 2 becomes about 25wm, the width of about 2 dish 1, the thickness of the ceramic ridge 3 is about 25wm, the width of about 0. The measurement of the surface state near the glaze part when making the substrate 102 for 1 dish 1 (please read the precautions on the back before filling the nest page) Packing-Line · This paper standard is not used in the home-like standard (CNS) A 4 Specifications (210X297mm) 81. 5. 20,000 (H) -14-η Λ 04399 Α6 Β6 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Description of the invention (13) Regular case. In addition, the substrate of this measurement example was not subjected to polishing treatment. As shown in Fig. 11, the glaze is flat until the end of the glaze. It can be seen that at the end of the glaze, the step between the ridge 3 and the bottom 1b on the substrate is sharply formed. When compared with the previous example of substrate support shown in FIG. 3, the glaze area of the substrate of the present invention is very flat. Therefore, in this case, as in the previous example, since the electrode portion is formed on the glaze portion 2, the element can be easily miniaturized. In this substrate structure, a ceramic paste made of the same material can be printed and applied to a linear shape at a predetermined portion of a ceramic blank plate 1 with a smooth surface to form a linear raised portion 3, which is fired at the same time and includes the raised portion A predetermined portion of the end of 3 is obtained by printing and applying glass paste and firing it. Embodiment 4 FIG. 12 shows a fourth embodiment of the present invention. The substrate 103 of this embodiment is formed with rectangular ridges 3 at predetermined intervals on a predetermined portion of the ceramic H1. Figure 12 (Α) is its plane, the same picture (Β) is the cross-sectional view along line A-A of (Α), and the same picture (C) is the cross-sectional view along line B-B of (A) country . In the case of this example, the terminal portion of the glaze portion 2 and the raised portion 3 are formed at approximately the same height, and the glaze surface becomes flat. The substrate structure is fixed on a predetermined part of the ceramic blank 1 with a smooth surface, and the paste printing made of different materials from the above-mentioned ceramics is applied to a rectangular shape by means of net printing, etc., and fired at the same time. The formed part including the terminal surface of the bulge 3 is printed with glass paste (please read the precautions on the back before filling in this page). The paper standard uses the CNB Standard 4 (210X297 Mm) -15-81. 5. 20. 000 (H) 204399 A6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (14) The cloth is obtained by firing it again. In this way, there is nothing wrong with forming the bump 3 from a material different from the ceramic M1, which is the main constituent material of the substrate. In this case, as described above, the sleeping portion 3 may be formed after firing the ceramic H1. As the material of the raised portion 3, in this example, it is a ceramic material, but it may be formed of a conductive material. However, when the protruding portion 3 is formed of a conductive material, it is desirable to use a material that is less likely to diffuse from the material of the glaze portion, and therefore, the melting point or firing temperature is preferably separated from the material of the glaze portion. Furthermore, it is also possible to use Pt or other high-temperature firing and high heat-resistant materials as the conductive material, while firing ceramics and conductive materials at the same time. As a material for the glaze part, when a material having a lower melting point or firing temperature than the bulge part 3 is used, as a material for the bulge part 3 that functions to block the glaze, even a conductive one can be used more generally The Ag strips and Pd strips are 0 thirteenth circle, which pseudo-shows an example of the cross-sectional configuration of the terminal portion of the glaze portion 2 of the ceramic substrate of the electronic device of the present invention. The thirteenth circles (A) to (C) are enlarged cross-sectional views near the terminal portions of the glaze portion of the ceramic substrate of the foregoing embodiment. That is, (A) is a cross-sectional view of the main part of the substrate 101 of the first embodiment, (B) is a cross-sectional view of the main part of the substrate 102 of the third embodiment, and (C) is the foregoing fourth embodiment A cross-sectional view of the main part of the example substrate 103. Furthermore, (C) shows the cross-sectional structure of the main part of the ceramic substrate 104 when the raised portion 3 of the aforementioned (B) image is formed of a ceramic or conductive material different from the substrate material 1. In addition, (E) is the ceramic exposed part 105b on the substrate surface of (B) figure than the glaze part 2 (please read the precautions on the back before filling in this page). This paper standard is easy to use. A 4 specifications (210x297 g *) 81. 5. 20. 000 (H) _ 16 _ 04399 A6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Description of the invention (15) The cross section of the substrate 105 is composed of a material with a low glaze part 2 and a ceramic bulge part 3 which is blocked structure. The substrate structure can be formed by applying a flat ceramic blank 1a and a ceramic blank 1b that has been perforated at a predetermined location to form a bulge 3 after applying ceramic paste to the predetermined location. , The glass paste 2 is coated on the surface 1 f and fired. Furthermore, the cross-sectional structure of the substrate 106 formed by the ceramic (or the conductive material) different from the substrate material 1 in the raised portion 3 of the (E) protagonist. The substrates 105 and 106 of (E) and (F) have the same structure as the substrate shown in Example 10 described later. In the substrates 101 to 106 shown in the 13th country, the surface of the glazed portion 2 becomes the same level as the raised portion 3, and the entire surface of the glazed portion 2 becomes flat. This can be achieved by providing the raised portion 3, applying a proper amount of glaze material, and firing it. Embodiment 5 Picture 14 shows the fifth embodiment of the present invention. The substrate 107 of this embodiment is generally composed of a ceramic sheet with a raised portion 3 as shown in FIG. 7 or FIG. 8 The glaze portion substrate is prepared when the thickness of the coating bump 3 or more is baked. The material of the glaze part has a large surface tension as usual, so if there is a bulge, even if it melts, it will not easily overflow from the blocked part and flow outside. Therefore, the glazed portion 2 with such a large protrusion and bending can also be formed. The amount of bending at this time can be set to a desired value in a certain range based on the amount of glaze applied or the firing temperature. As mentioned before, according to the manufacturing method of the present invention, due to the choice of the choice (please read the precautions on the back and then fill out this page), the paper size is used in the middle of the poor home sample (CHS) A 4 specifications (210X297 mm ) 81. 5. 20,000 (H) -17-204399 Α6 Β6 V. Description of the invention (16) The amount of glaze material can also be set arbitrarily in the glaze area in the field of glaze. Embodiment 6 FIG. 15 is an embodiment of the ceramic substrate 108 of the present invention provided with through holes. Figure 15 (A) is like a plan view, and the same figure (B) is a cross-sectional view of the area enclosed by the broken line a along line A-A in (A). In this embodiment, the ceramic M1 has a through hole, and the surface and the back surface of the ceramic sheet 1 are electrically connected via the conductive material 3 / which is also coated 1 on the side of the through hole. The conductive material 3 / stripe extends to the surface of the ceramic sheet 1, and this part bulges from the surface. Then, the glaze portion 2 is formed to the end of the conductive ridge portion 3, so that the glaze portion 2 can be flattened, and the glaze portion material is applied in an appropriate amount, so the surface of the glaze portion 2 is pseudo to the end portion thereof Become flat. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. Next, Lan Yu described the manufacturing method of the aforementioned substrate 108 with reference to FIG. 16. First, a flat ceramic blank 1 is produced. Next, using methods such as punching by the die, as shown in the 16th circle (A) and (B), a through hole is formed. Thereafter, as shown in Figs. 16 (C) and (D), the paste 3 made of a conductive material is applied to the through hole and its surroundings by means of net printing or the like. At this time, as a conductive material, a Pt plasma heat-resistant material that can be fired simultaneously with ceramics is used. Next, the ceramic sheet 1 and the conductive material 3 are fired by simultaneous firing. Next, a glass paste is printed and coated on the moldy part of the ceramic sheet 1 around the raised portion 3 of the guide material 3 / and fired to complete the ceramic substrate 108 shown in FIG. At this time, it will become the conductive material of the through-hole thick film electrode 3 / ceramic Η 1 81. 5. 20. 000 (H) (Please read the precautions on the back before filling in this page) This paper uses the Zhongjia Liangzhun (CNS) A4 specification (210x297 g *) -18-04399 A6 B6 Employee consumption of the Central Bureau of Standards of the Ministry of Economic Affairs Printed by the cooperative. 5. Description of the invention (17) The raised portion 3 on the surface achieves the task of blocking the glaze portion 2. Embodiment 7 An example of manufacturing a magnetoresistive element using the ceramic substrate 108 of the foregoing embodiment 6 is shown in FIG. 17. The 17th garden (A) is its flat country. At the same time, the garden (B) is a sectional view along the line A-A of (A). In the garden, 4S indicates the sensor part, and 5 indicates the terminal electrode part. The area enclosed by the dotted line b of the 15th circle (A) corresponds to the area of the component 1 of FIG. 17. The magnetoresistive element of this embodiment, like the embodiment, can be formed on the entire surface of the ceramic substrate 108 by spraying a ferromagnetic thin film with a magnetoresistance effect, and then using a method such as coating or plating of a conductive material to form a terminal electrode. After the part 5, it is made from a round form that has been formed into a desired shape through a photo production and sales process. Furthermore, a protective film will be formed thereafter, but its illustration is omitted. The substrate 108 of this structure also enables the glaze portion 2 to be flat, provides the ridge portion 3, and at the same time enables it to have the same height as the ridge portion 3, and applies a proper amount of glaze portion material. Therefore, as in Example 1, the glaze portion The surface is not curved like the previous example. Therefore, it is flat up to the ceramic boundary (bump), so it is easy to miniaturize the device, and it can also form a high-accuracy round if it is miniaturized, and problems such as offset voltage are less likely to occur. Table 1 shows a comparative example that requires surface masking when using a magneto-resistive element exhibiting the same characteristics with an offset voltage and using the previous substrate shown in the fifth frame and the substrate of this embodiment. As can be seen from the first table, by using the substrate of the present invention, it is possible to manufacture devices showing the same characteristics as before with an area of about 1/4. (Please read the precautions on the back before filling out this page) This paper uses the Chinese B standard (CNS) A4 specifications (210x297 mm) 81. 5. 20,000 (H) -19-204399 Α6 Β6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (18) In contrast, when using the previous substrate, the size of the component will have to be increased for the following reasons. In order to obtain a sensor part that can exhibit the same good characteristics as the device of the present invention, it is necessary to provide the sensor part on a flat surface. However, in the previous substrate, the end of the glaze part will be bent, so in order to To get a flat glaze area, it is necessary to expand the glaze area. Table 1 External dimensions: 2 wd X 2 mm made with the substrate of the present invention 4 an X 4 mm made with the previous substrate Example 8 In FIG. 18, the substrate 108 of the structure shown in the 15th garden was used to produce a crystalline resistance element的 实施 例。 Examples. Figure 18 (A) is a plan view, and the same figure (B) is a cross-sectional view taken along line A-A of (Α). In the figure, 6 is a resistance portion formed of a resistance material such as NiCr or D & 21 ^ provided on the glaze portion 2, and a bump 3 connected to the conductive material 3 of the through-hole electrode. The area enclosed by the dotted line c in FIG. 15 (A) corresponds to the component 1 in FIG. 18. In this manner, the substrate of the present invention can also be used to produce a crystalline resistance element. Embodiment 9 Fig. 19 shows another embodiment of the present invention having a ceramic substrate with a glaze portion having a through-hole structure. Figure 19 (Α) is a plan view with an area ratio of 1 4 (please read the precautions on the back before filling in this page). The paper size is not in the middle standard (CNS) Grade 4 (210X297) *. 81. 5. 20. 000 (H) -20-204399 A 6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (19) The same figure (B) is (A) a cross-sectional view taken along line A-A of circle (A). At this time, the glaze portion 2 on the ceramic substrate 109 has a structure in which the ridge portion 3 made of ceramic material is blocked. Next, the manufacturing method of the substrate of this embodiment will be described. You are the same as the previous example until the smooth ceramic blank 1 is perforated with a mold to form through holes. Thereafter, a ceramic slurry is applied around the through-hole (including the fishing site that will become the raised portion 3 later). Next, the ceramics are sintered by simultaneous firing. Then, apply a proper amount of glass paste to the same height as the bump 3 after firing, print and apply it on the surface of the substrate except for the bump 3 and the through hole made of ceramic, and then apply After firing, the glazed portion substrate 109 as shown in FIG. 19 is completed. At this time, since the surface of the glaze portion becomes flat, it is possible to miniaturize the device without incurring deterioration of characteristics when applying it to the production of the magnetoresistive element as in the previous production example. Example 1 〇 FIG. 20 shows an example of the ceramic substrate 110 with a glazed portion of the present invention having a cross-sectional structure as shown in FIG. 13 (E). Figure 20 (A) is a plan view, and the same figure (B) is a cross-sectional view taken along line A-A of (A). In this embodiment, the concave portion has a rectangular shape. In this way, the shape of the concave portion may be a square shape. Hereinafter, an example of the manufacturing method of the substrate 110 will be described. First, a smooth ceramic blank 1a and a ceramic blank 1b with a square-shaped hole at predetermined intervals in a predetermined portion are laminated with a die punch or the like. (Please read the precautions on the back before filling in this page) Binding · Binding-This paper is standard (CNS) Grade 4 (210X297) *. 81. 5. 20,000 (H) -21-η 04399 A6 B6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Invention Instructions (20) The ceramic paste made of the same material is placed in a predetermined part, that is, in a square hole The ridges 3 are printed and coated by Zhiyuan, and fired at the same time. Thereafter, the glass sheet paste 2 is coated on the ceramic sheet 1 other than the inside of the square hole and the bulge 3, and fired to obtain the substrate 110 of this embodiment. Furthermore, in the aforementioned manufacturing method, a smooth ceramic blank 1a, and a ceramic blank 1b with square holes spaced at predetermined intervals at a predetermined location by a die punch or the like are laminated as the ceramic sheet 1. It is also possible to laminate the aforementioned embryonic plates 1 a and 1 b with crystallized glass. Embodiment 1 1 An example of manufacturing a magnetoresistive head using the substrate 110 of the foregoing embodiment is shown in FIG. 21. Figure 21 (A) is a plane nursery, and the same figure (B) is (A) 圔 's section along the line A-A. In the figure, 4S indicates the sensor part and the wiring part, and 5 indicates the terminal electrical connection. The area enclosed by the dotted line in Fig. 20 (A) corresponds to the area of one component of the 21st circle. Therefore, the terminal electrode 5 is pseudo-located inside the square hole of the substrate 110. The magnetoresistive head structured in this manner can connect the terminal portion 5 to the lead wire and mold the surface of the susceptor portion 4S to lower the mold surface, so that the face-to-face magnetoresistive head can be manufactured. In such electronic equipment, the functional part of the Fu sensor is provided on the glaze part, the terminal part is formed in the concave part, and the mold for reinforcing the terminal part is formed, and the resin does not protrude from the sensor functional part. For ceramic substrates, the step size from the top of the glazed part to the bottom of the concave part requires 5 0 (please read the precautions on the back and then fill out this page). The paper size uses CNS A4 specifications ( 210x297g *) -22- 81. 5. 20. 000 (H)% 04399 Α6 Β6 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Invention description (21) w m or more and ideally 100 0 «m or more. At the same time, because the film thickness of the sensor function part is usually 1wm or less, the value of the surface roughness of the glaze part is 0. 2 The following is ideal, so, you will get a good sensor. The flat glaze portion of the substrate of the present invention is like those meeting this condition. Embodiment 1 Fig. 22 is a cross-sectional view of a thermal head having a ceramic substrate 107 with a glazed portion according to the present invention having a cross-sectional structure as shown in the aforementioned 14th drawing. In the thermal head of this embodiment, the heating nozzle film 6 is continuously covered on the glaze portion 2 of the ceramic substrate 107 and the surface of the ceramic H1. Then, the terminal electrode film 5 is formed on the heating resistor film 6 on the central portion where the glaze portion 2 is removed, and is formed by covering the glaze portion 2 with an abrasion-resistant protective film 10 as the uppermost layer. According to the thermal head constructed as described above, since the heat generating portion is protruded from the curved glaze portion 2, the heat generated by the heat generating portion can be efficiently transferred to the recording paper. As described above, since the substrate of the present invention has a structure in which the glaze portion is blocked by the raised portion, the amount of coating of the glaze portion material can be selected to make it very flat to the terminal. At the same time, according to the present invention, since the sleeping portion is formed into a linear shape, it is possible to form a flat glazed surface without a grinding process and a sharp glazed surface at the terminal portion. Furthermore, the application amount of the glaze material is set to be large. It is also possible (please read the precautions on the back and then fill out this page). The paper size is the Chinese National #quasi (0) A4 specification (210X297 public *) 81. 5. 20. 000 (H) -23-2 04399 A6 B6 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (22) Arbitrary setting of the glaze section in the glaze section area specified. The substrate of the present invention, which is flat from the use of the glaze to the end, will enable miniaturization of electronic devices such as magnetoresistive elements that require the formation of the sensor on the glaze, and after miniaturization, a good accuracy can also be formed . At the same time, the substrate can also be applied to electronic components such as thin-film magnetoresistive heads, and can also be applied to other electronic devices that need to form a high-precision round on the surface of the substrate. The substrate of the present invention with a curved glaze can be applied to thermal In the print head, etc., there are ideal electronic devices protruding from the glaze. [Industrial Application Field] As described above, according to the present invention, since the raised portion is formed on the surface of the substrate and the sleeping portion is located at the terminal of the glaze portion, the coating of the glaze portion material is selected Even if it is not polished, the surface of the glaze portion can be formed flatly up to the terminal portion. At the same time, it is possible to form a substrate having a flat glaze surface and a sharp step at the boundary between the glaze portion and the ceramic portion of the substrate. Therefore, a magnetic sensor such as a magnetoresistive element having a functional portion on the surface of the substrate, or a functional device such as a thin-film wafer element made of thin-film resistors can be easily miniaturized without deterioration of characteristics. At the same time, according to the present invention, it is possible to obtain a substrate having a curved glaze portion in a predetermined glaze area by applying the glaze portion material to a thickness greater than the thickness of the raised portion and firing. Furthermore, the curved shape can be arbitrarily set by selecting the amount of sleeve material. The substrate thus constructed can be applied to electronic equipment such as thermal heads. (Please read the precautions on the back before filling out this page) This paper standard is easy to use Chinese Family Standard (CNS) A 4 specifications (210X297 public *) 81. 5. 20,000 (H) -24-2〇43θ9 A 6 Β6 Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (23) A brief description of the garden surface. Figure 1 (A), (B), like display use For the magneto-resistive element produced by the previous ceramic substrate, (A) the circle is a plane circle of the same element, (B) The figure is the cross-section along the line A-A of (A), Figure 2 (A), (B ), As shown in the previous glass-glazed ceramic substrate, (A) is a plan view of the same substrate, (B) circle is a cross-sectional view along line A-A of (A), and FIG. 3 is the previous substrate The measurement example of the surface state of the glaze when the width of the glaze is about 2mm, Figure 4 (A), (B), (C), the image shows the previous ceramic substrate with thick film electrodes, (A) Is a side cross-sectional view of the same ceramic substrate, (B) is a side cross-sectional view of the substrate showing the manufacturing process of the glaze portion on the same ceramic substrate, (C) is the actual part of (A) The enlarged cross-sectional view, Figure 5 (A), (B), shows the previous ceramic substrate with through-holes, (A) is a plan view of the previous ceramic substrate, (B) is (A ) A — A cross-sectional view of line A, Figure 6 (A), (B), to show the magnetoresistive element manufactured using the previous through-hole substrate shown in the fifth circle, (A) is the same as the previous through-hole A plan view of the substrate, (B) is a cross-sectional view taken along the line A-A of (A) circle, FIGS. 8 (A) to (D), for explaining the manufacturing method of the ceramic substrate according to the first embodiment of the present invention In addition, (A) the picture shows the structure of the same ceramic substrate (please read the precautions on the back before filling in this page) -installation · order · line. This paper uses the Chinese National Standard (CNS) A4 specifications (210X297g *) 81. 5. 20,000 (H) _ 25-A 6 B6 204399 V. Invention description (24) (please read the precautions on the back before filling in this page). The plan view of the ceramic sheet, (B) circle is (A) along the edge of the garden A — A cross-sectional view of line A, (C) is a plan view of the aforementioned ceramic sheet in the state of forming a bulge, (D) is a cross-sectional view along line A-A of (C), FIG. 9 (A), ( B), to show the second embodiment of the present invention, (A) is a plan view of a magnetoresistive element fabricated using the ceramic substrate of the first embodiment, (B) is (A) along the circle A-A The cross-sectional view of the line, Figure 10 (A), (B), to show the third embodiment of the present invention, (A) the garden is a planar garden of the ceramic substrate of the present invention, (B) is (A) country Fig. 11 is a cross-sectional view along the line A-A, FIG. 11 is a measurement example of the surface state when the width of the glaze portion of the ceramic substrate of the third embodiment is approximately 2 mm, and FIG. 12 (A) to (C) In order to show the fourth embodiment of the present invention, (A) is a plan view of the ceramic substrate of the present invention provided with a guide portion, (B) is a cross-sectional garden along line A-A of (A), ( C) The picture shows the section along line B-B of (A) Circle, Printed in Figures 13 (A) to (F) by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, which are cross-sectional views near the end of the glaze section of the ceramic substrate and its modification according to the embodiment of the present invention. 14 is a cross-sectional view showing the main part of the ceramic substrate of the fifth embodiment of the present invention, the stripe glaze part is a protruding curved ceramic substrate, Figure 15 (A), (B), showing the sixth embodiment of the present invention For example, (A) is a plan view of a ceramic substrate with through-holes, (B) is a cross-sectional circle along line A-A of (A), and Figure 16 (A) to (D) The description shows the 15th 圔 shown 81. 5. 20. 000 (H) This paper uses the Chinese National Standard (CNS) Grade 4 (210X297 mm) -26-Printed 2〇4 oil 9__B6 __ by the Workers ’Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. 5. Description of the invention (25) For the manufacturing method of the ceramic substrate of the present invention, (A) is drawn as a plane circle constituting a ceramic sheet of the same ceramic substrate, (B) is a cross-sectional view taken along line A-A of (A), (C) It is a plan view of the aforementioned ceramic sheet after the through-hole conductive material is applied, (D) is a cross-sectional view taken along line A-A of (C), and FIG. 17 (A), (B) is for showing the present invention. In the seventh embodiment, (A) is a plan view of a magnetoresistive element fabricated using a ceramic substrate provided with the aforementioned through-holes, (B) is a cross-sectional view of (A) a garden along the line A-A, and the 18th ( A), (B), to show the eighth embodiment of the present invention, (A) is a plan view of a chip resistance element fabricated using a ceramic substrate provided with the through-hole, (B) circle is (A) garden The cross-sectional view along the line A-A, Figure 19 (A), (B), to show the ninth embodiment of the present invention, (A) is a through hole with a different shape of the ceramic through hole The 'plan view of the substrate, (B) is the cross-section along the line A-A of (A), the 20th circle (A), (B) is the tenth embodiment of the present invention, (A) For a plan view of a ceramic substrate provided with a recessed part, (B) is a cross-sectional view taken along line A-A of (A), and FIG. 21 (A), (B) shows an eleventh embodiment of the present invention. , (A) is a plan view of a magneto-resistive head made using the aforementioned ceramic substrate with recesses, (B) is a cross-sectional view taken along line A-A of (A), (please read the precautions on the back first (Fill in this page) Book-line < This paper uses the Chinese Musketeer Standard (CNS) Grade 4 (210X297 g *) 81. 5. 20,000 (H) -27-204399 A 6 B6 V. Description of invention (26), Figure 22, is To show the twelfth embodiment of the present invention, you use a cross-sectional view of a thermal head manufactured by using a ceramic substrate with a curved convex glazed portion as shown in FIG. (Please read the precautions on the back before filling out this page) Printed on this paper by the Consumers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The paper is used in the 8 National Standard (CNS) A 4 specifications (210X297 male dragon) 81. 5. 20.000 (H ) -28-