TW202544108A - 環氧樹脂組成物、硬化物、半導體裝置，及半導體裝置之製造方法 - Google Patents

環氧樹脂組成物、硬化物、半導體裝置，及半導體裝置之製造方法

Info

Publication number
TW202544108A
TW202544108A TW114105137A TW114105137A TW202544108A TW 202544108 A TW202544108 A TW 202544108A TW 114105137 A TW114105137 A TW 114105137A TW 114105137 A TW114105137 A TW 114105137A TW 202544108 A TW202544108 A TW 202544108A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
mass
core
rubber particles
Prior art date
Application number
TW114105137A
Other languages
English (en)
Chinese (zh)
Inventor
瀬能幹央
Original Assignee
日商納美仕股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202544108A publication Critical patent/TW202544108A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW114105137A 2024-03-28 2025-02-12 環氧樹脂組成物、硬化物、半導體裝置，及半導體裝置之製造方法 TW202544108A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-053114 2024-03-28
JP2024053114 2024-03-28

Publications (1)

Publication Number Publication Date
TW202544108A true TW202544108A (zh) 2025-11-16

Family

ID=97220036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114105137A TW202544108A (zh) 2024-03-28 2025-02-12 環氧樹脂組成物、硬化物、半導體裝置，及半導體裝置之製造方法

Country Status (3)

Country Link
JP (1) JPWO2025204095A1 (https=)
TW (1) TW202544108A (https=)
WO (1) WO2025204095A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8222324B2 (en) * 2003-06-09 2012-07-17 Kaneka Corporation Process for producing modified epoxy resin
JP2012162585A (ja) * 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
CN103183925B (zh) * 2011-12-27 2017-09-08 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
JP2015137299A (ja) * 2014-01-21 2015-07-30 住友ベークライト株式会社 樹脂組成物、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、バックグラインドテープ兼ダイシングテープ一体型接着シート、および電子装置
JP6335807B2 (ja) * 2015-01-27 2018-05-30 四国化成工業株式会社 新規なグリコールウリル類とその利用
EP3696209B1 (en) * 2015-05-13 2023-08-02 Mitsubishi Chemical Corporation Sheet-molding compound and fiber-reinforced composite material
JP2018172603A (ja) * 2017-03-31 2018-11-08 三菱ケミカル株式会社 樹脂組成物及びその製造方法、プリプレグ、並びに成型体
JP7680158B2 (ja) * 2021-08-27 2025-05-20 田岡化学工業株式会社 エポキシ樹脂組成物
JPWO2023140382A1 (https=) * 2022-01-24 2023-07-27
WO2023171028A1 (ja) * 2022-03-11 2023-09-14 ナミックス株式会社 樹脂組成物、半導体装置、およびそれらの製造方法

Also Published As

Publication number Publication date
WO2025204095A1 (ja) 2025-10-02
JPWO2025204095A1 (https=) 2025-10-02

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