JPWO2025204095A1 - - Google Patents
Info
- Publication number
- JPWO2025204095A1 JPWO2025204095A1 JP2026510252A JP2026510252A JPWO2025204095A1 JP WO2025204095 A1 JPWO2025204095 A1 JP WO2025204095A1 JP 2026510252 A JP2026510252 A JP 2026510252A JP 2026510252 A JP2026510252 A JP 2026510252A JP WO2025204095 A1 JPWO2025204095 A1 JP WO2025204095A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024053114 | 2024-03-28 | ||
| PCT/JP2025/002775 WO2025204095A1 (ja) | 2024-03-28 | 2025-01-29 | エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025204095A1 true JPWO2025204095A1 (https=) | 2025-10-02 |
Family
ID=97220036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026510252A Pending JPWO2025204095A1 (https=) | 2024-03-28 | 2025-01-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025204095A1 (https=) |
| TW (1) | TW202544108A (https=) |
| WO (1) | WO2025204095A1 (https=) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004108825A1 (ja) * | 2003-06-09 | 2004-12-16 | Kaneka Corporation | 変性エポキシ樹脂の製造方法 |
| JP2012162585A (ja) * | 2011-02-03 | 2012-08-30 | Namics Corp | 半導体樹脂封止材 |
| JP2013151642A (ja) * | 2011-12-27 | 2013-08-08 | Hitachi Chemical Co Ltd | 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置 |
| JP2015137299A (ja) * | 2014-01-21 | 2015-07-30 | 住友ベークライト株式会社 | 樹脂組成物、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、バックグラインドテープ兼ダイシングテープ一体型接着シート、および電子装置 |
| JP2016138051A (ja) * | 2015-01-27 | 2016-08-04 | 四国化成工業株式会社 | 新規なグリコールウリル類とその利用 |
| WO2016182077A1 (ja) * | 2015-05-13 | 2016-11-17 | 三菱レイヨン株式会社 | シートモールディングコンパウンド及び繊維強化複合材料 |
| JP2018172603A (ja) * | 2017-03-31 | 2018-11-08 | 三菱ケミカル株式会社 | 樹脂組成物及びその製造方法、プリプレグ、並びに成型体 |
| JP2023032370A (ja) * | 2021-08-27 | 2023-03-09 | 田岡化学工業株式会社 | エポキシ樹脂組成物 |
| WO2023140382A1 (ja) * | 2022-01-24 | 2023-07-27 | 株式会社クラレ | 硬化性樹脂組成物、接着剤、成形材料、硬化物 |
| WO2023171028A1 (ja) * | 2022-03-11 | 2023-09-14 | ナミックス株式会社 | 樹脂組成物、半導体装置、およびそれらの製造方法 |
-
2025
- 2025-01-29 WO PCT/JP2025/002775 patent/WO2025204095A1/ja active Pending
- 2025-01-29 JP JP2026510252A patent/JPWO2025204095A1/ja active Pending
- 2025-02-12 TW TW114105137A patent/TW202544108A/zh unknown
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004108825A1 (ja) * | 2003-06-09 | 2004-12-16 | Kaneka Corporation | 変性エポキシ樹脂の製造方法 |
| JP2012162585A (ja) * | 2011-02-03 | 2012-08-30 | Namics Corp | 半導体樹脂封止材 |
| JP2013151642A (ja) * | 2011-12-27 | 2013-08-08 | Hitachi Chemical Co Ltd | 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置 |
| JP2015137299A (ja) * | 2014-01-21 | 2015-07-30 | 住友ベークライト株式会社 | 樹脂組成物、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、バックグラインドテープ兼ダイシングテープ一体型接着シート、および電子装置 |
| JP2016138051A (ja) * | 2015-01-27 | 2016-08-04 | 四国化成工業株式会社 | 新規なグリコールウリル類とその利用 |
| WO2016182077A1 (ja) * | 2015-05-13 | 2016-11-17 | 三菱レイヨン株式会社 | シートモールディングコンパウンド及び繊維強化複合材料 |
| JP2018172603A (ja) * | 2017-03-31 | 2018-11-08 | 三菱ケミカル株式会社 | 樹脂組成物及びその製造方法、プリプレグ、並びに成型体 |
| JP2023032370A (ja) * | 2021-08-27 | 2023-03-09 | 田岡化学工業株式会社 | エポキシ樹脂組成物 |
| WO2023140382A1 (ja) * | 2022-01-24 | 2023-07-27 | 株式会社クラレ | 硬化性樹脂組成物、接着剤、成形材料、硬化物 |
| WO2023171028A1 (ja) * | 2022-03-11 | 2023-09-14 | ナミックス株式会社 | 樹脂組成物、半導体装置、およびそれらの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025204095A1 (ja) | 2025-10-02 |
| TW202544108A (zh) | 2025-11-16 |
Similar Documents
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| A621 | Written request for application examination |
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| A871 | Explanation of circumstances concerning accelerated examination |
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| A131 | Notification of reasons for refusal |
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