TW202528446A - 感光性樹脂組成物、圖案硬化物的製造方法、圖案硬化物及電子零件 - Google Patents

感光性樹脂組成物、圖案硬化物的製造方法、圖案硬化物及電子零件

Info

Publication number
TW202528446A
TW202528446A TW113141634A TW113141634A TW202528446A TW 202528446 A TW202528446 A TW 202528446A TW 113141634 A TW113141634 A TW 113141634A TW 113141634 A TW113141634 A TW 113141634A TW 202528446 A TW202528446 A TW 202528446A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
group
resin composition
film
represented
Prior art date
Application number
TW113141634A
Other languages
English (en)
Chinese (zh)
Inventor
阿部悟志
Original Assignee
日商艾曲迪微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾曲迪微系統股份有限公司 filed Critical 日商艾曲迪微系統股份有限公司
Publication of TW202528446A publication Critical patent/TW202528446A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
TW113141634A 2023-11-08 2024-10-30 感光性樹脂組成物、圖案硬化物的製造方法、圖案硬化物及電子零件 TW202528446A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/040303 WO2025099883A1 (ja) 2023-11-08 2023-11-08 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WOPCT/JP2023/040303 2023-11-08

Publications (1)

Publication Number Publication Date
TW202528446A true TW202528446A (zh) 2025-07-16

Family

ID=95695333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113141634A TW202528446A (zh) 2023-11-08 2024-10-30 感光性樹脂組成物、圖案硬化物的製造方法、圖案硬化物及電子零件

Country Status (3)

Country Link
JP (1) JPWO2025099883A1 (https=)
TW (1) TW202528446A (https=)
WO (1) WO2025099883A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6935982B2 (ja) * 2014-09-29 2021-09-15 旭化成株式会社 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP2020050864A (ja) * 2018-09-20 2020-04-02 住友化学株式会社 組成物
KR20230032069A (ko) * 2021-08-30 2023-03-07 에스케이이노베이션 주식회사 폴리이미드 필름 형성용 조성물의 제조방법, 이로부터 제조된 폴리이미드 필름 형성용 조성물 및 이의 용도
CN118765309A (zh) * 2022-03-08 2024-10-11 科巨希化学股份有限公司 含有高安全性酰胺化合物的组合物

Also Published As

Publication number Publication date
JPWO2025099883A1 (https=) 2025-05-15
WO2025099883A1 (ja) 2025-05-15

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