JPWO2025099883A1 - - Google Patents

Info

Publication number
JPWO2025099883A1
JPWO2025099883A1 JP2025556117A JP2025556117A JPWO2025099883A1 JP WO2025099883 A1 JPWO2025099883 A1 JP WO2025099883A1 JP 2025556117 A JP2025556117 A JP 2025556117A JP 2025556117 A JP2025556117 A JP 2025556117A JP WO2025099883 A1 JPWO2025099883 A1 JP WO2025099883A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025556117A
Other languages
Japanese (ja)
Other versions
JPWO2025099883A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025099883A1 publication Critical patent/JPWO2025099883A1/ja
Publication of JPWO2025099883A5 publication Critical patent/JPWO2025099883A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
JP2025556117A 2023-11-08 2023-11-08 Pending JPWO2025099883A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/040303 WO2025099883A1 (ja) 2023-11-08 2023-11-08 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2025099883A1 true JPWO2025099883A1 (https=) 2025-05-15
JPWO2025099883A5 JPWO2025099883A5 (https=) 2026-04-30

Family

ID=95695333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025556117A Pending JPWO2025099883A1 (https=) 2023-11-08 2023-11-08

Country Status (3)

Country Link
JP (1) JPWO2025099883A1 (https=)
TW (1) TW202528446A (https=)
WO (1) WO2025099883A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016069498A (ja) * 2014-09-29 2016-05-09 旭化成イーマテリアルズ株式会社 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP2020050864A (ja) * 2018-09-20 2020-04-02 住友化学株式会社 組成物
JP2023035992A (ja) * 2021-08-30 2023-03-13 エスケー イノベーション カンパニー リミテッド ポリイミドフィルム形成用組成物の製造方法、それから製造されたポリイミドフィルム形成用組成物およびその用途
WO2023171679A1 (ja) * 2022-03-08 2023-09-14 Ｋｊケミカルズ株式会社 高安全性アミド化合物を含有する組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016069498A (ja) * 2014-09-29 2016-05-09 旭化成イーマテリアルズ株式会社 樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP2020050864A (ja) * 2018-09-20 2020-04-02 住友化学株式会社 組成物
JP2023035992A (ja) * 2021-08-30 2023-03-13 エスケー イノベーション カンパニー リミテッド ポリイミドフィルム形成用組成物の製造方法、それから製造されたポリイミドフィルム形成用組成物およびその用途
WO2023171679A1 (ja) * 2022-03-08 2023-09-14 Ｋｊケミカルズ株式会社 高安全性アミド化合物を含有する組成物

Also Published As

Publication number Publication date
TW202528446A (zh) 2025-07-16
WO2025099883A1 (ja) 2025-05-15

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