TW202526396A - 積層體之製造方法 - Google Patents

積層體之製造方法 Download PDF

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Publication number
TW202526396A
TW202526396A TW113129364A TW113129364A TW202526396A TW 202526396 A TW202526396 A TW 202526396A TW 113129364 A TW113129364 A TW 113129364A TW 113129364 A TW113129364 A TW 113129364A TW 202526396 A TW202526396 A TW 202526396A
Authority
TW
Taiwan
Prior art keywords
layer
substrate
manufacturing
resin composition
resin
Prior art date
Application number
TW113129364A
Other languages
English (en)
Chinese (zh)
Inventor
阿部智行
高橋良平
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202526396A publication Critical patent/TW202526396A/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
TW113129364A 2023-08-08 2024-08-06 積層體之製造方法 TW202526396A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-129065 2023-08-08
JP2023129065 2023-08-08

Publications (1)

Publication Number Publication Date
TW202526396A true TW202526396A (zh) 2025-07-01

Family

ID=94534773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113129364A TW202526396A (zh) 2023-08-08 2024-08-06 積層體之製造方法

Country Status (3)

Country Link
JP (1) JP7652349B1 (https=)
TW (1) TW202526396A (https=)
WO (1) WO2025033281A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5195558B2 (ja) * 2009-03-19 2013-05-08 日立化成株式会社 光電気複合部材の製造方法
US9513434B2 (en) * 2012-01-11 2016-12-06 Hitachi Chemical Company, Ltd. Optical waveguide and manufacturing method thereof
JP6859136B2 (ja) * 2017-03-03 2021-04-14 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
JP2019113704A (ja) * 2017-12-22 2019-07-11 住友ベークライト株式会社 光導波路の製造方法

Also Published As

Publication number Publication date
WO2025033281A1 (ja) 2025-02-13
JP7652349B1 (ja) 2025-03-27
JPWO2025033281A1 (https=) 2025-02-13

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