WO2025033281A1 - 積層体の製造方法 - Google Patents

積層体の製造方法 Download PDF

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Publication number
WO2025033281A1
WO2025033281A1 PCT/JP2024/027333 JP2024027333W WO2025033281A1 WO 2025033281 A1 WO2025033281 A1 WO 2025033281A1 JP 2024027333 W JP2024027333 W JP 2024027333W WO 2025033281 A1 WO2025033281 A1 WO 2025033281A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
adhesive
laminate
resin
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Pending
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PCT/JP2024/027333
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English (en)
French (fr)
Japanese (ja)
Inventor
智行 阿部
良平 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2024566443A priority Critical patent/JP7652349B1/ja
Publication of WO2025033281A1 publication Critical patent/WO2025033281A1/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a method for manufacturing a laminate.
  • optical/electrical composite substrate is one in which an optical waveguide is provided on a substrate.
  • Techniques relating to the optical/electrical composite substrate include those described in, for example, Patent Documents 1 and 2.
  • Patent Document 1 describes an opto-electrical hybrid board comprising a flexible circuit board in which electrical wiring having mounting pads is formed on the surface of an insulating layer, an element mounted on the mounting pad, and an optical waveguide laminated on the back surface side of the insulating layer, wherein the flexible circuit board is a flexible double-sided circuit board in which electrical wiring is also formed on the back surface of the insulating layer, and a metallic reinforcing layer is plated on at least the portion of the electrical wiring on the back surface side that corresponds to the mounting pad, and the optical waveguide is in contact with the metallic reinforcing layer.
  • a metallic reinforcing layer is adhered to an insulating layer of a flexible circuit board without an adhesive layer, and it is described that an optical-electrical hybrid board can be provided in which elements are properly mounted while suppressing deformation due to a pressure load when the elements are mounted by the metallic reinforcing layer.
  • Patent Document 1 describes a method of preparing a substrate having an insulating layer 1 made of a resin such as polyimide and copper foil 21 formed on both sides thereof, and forming through holes 1a and via holes 1b for an optical path in the substrate (see paragraph 0023 of Patent Document 1).
  • Patent Document 1 also describes a flexible double-sided circuit board E on which a metallic reinforcing layer M is formed (see paragraph 0028 of Patent Document 1).
  • the flexible double-sided circuit board E includes the substrate.
  • Patent Document 1 describes that an undercladding layer 6 is formed on the back side of a flexible double-sided circuit board E in contact with a metal reinforcing layer M that covers the electrical wiring 2B on the back side, and describes that examples of a molding material for the undercladding layer 6 include a photosensitive resin and a thermosetting resin (see paragraph 0029 of Patent Document 1). According to Figures 4 to 6 of Patent Document 1, it can be seen that the molding material for the undercladding layer 6 is filled into a recess formed in the flexible double-sided circuit board E on which the metal reinforcing layer M is formed.
  • Patent Document 2 describes an optoelectronic wiring board that is formed by integrating a rigid section in which conductor circuits and insulating layers are laminated on both sides of a substrate with one or more bendable flex sections, wherein the rigid section is formed with external connection terminals for mounting optical elements and/or package substrates on which optical elements are mounted, and at least one of the flex sections is formed with optical wiring. It is stated that the optoelectronic wiring board in Patent Document 2 can suitably process large amounts of information and high speed information processing without increasing the size of the wiring board.
  • Patent Document 2 describes that the rigid section has an optical signal transmitting region formed therein, and that the optical signal transmitting region is filled with a resin composition (see claims 4 and 5 of Patent Document 2). It also describes that the optical signal transmitting region is formed so as to penetrate all of the substrates and insulating layers that make up the rigid section (see claim 6 of Patent Document 2).
  • Patent Document 2 describes a substrate 221 consisting of an optical waveguide film 250 and a surrounding resin layer (insulating layer) 221a, and describes that the resin layer 221a constitutes part of the optical signal transmitting regions 242a, 242b (see paragraph 0033 of Patent Document 2).
  • a method for manufacturing an optical/electrical composite substrate includes, for example, a step of forming a first clad layer of an optical waveguide on a substrate to obtain a laminate comprising the substrate and the first clad layer of the optical waveguide. According to the inventors' investigations, it has been found that warping may occur in such a laminate.
  • the present invention has been developed in consideration of the above circumstances, and aims to provide a method for manufacturing a laminate that can suppress the amount of warping.
  • the present invention provides the following method for producing a laminate.
  • a method for manufacturing a laminate including a substrate and a first clad layer of an optical waveguide comprising the steps of: A step (A) of preparing a workpiece having at least the substrate; A method for manufacturing a laminate, comprising: a step (B) of attaching an adhesive member to one surface of the substrate in the work.
  • a step (A) of preparing a workpiece having at least the substrate comprising: a step (B) of attaching an adhesive member to one surface of the substrate in the work.
  • the adhesive member comprises a base material layer and an adhesive resin layer.
  • the thickness of the base layer is 10 ⁇ m or more and 1000 ⁇ m or less.
  • the substrate layer is a resin film
  • the adhesive constituting the adhesive resin layer includes at least one selected from the group consisting of (meth)acrylic adhesives, silicone adhesives, urethane adhesives, and rubber adhesives.
  • the present invention provides a method for manufacturing a laminate that can reduce the amount of warping.
  • FIG. 1 is a cross-sectional view showing a schematic example of a structure of an optical/electrical composite substrate according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a schematic example of a structure of a workpiece.
  • FIG. 13 is a diagram for explaining an example of step (B).
  • FIG. 1 is a cross-sectional view showing a schematic example of the structure of an optical/electrical composite substrate according to this embodiment.
  • the optical/electrical composite substrate 200 has an optical waveguide 100 provided on a substrate 110.
  • the optical waveguide 100 has a first clad layer 20, a core layer 30, and a second clad layer 40 laminated in this order.
  • a mirror 50 on the light-emitting element side and a mirror 60 on the light-receiving element side are formed in the optical waveguide 100.
  • the substrate 110 has through holes 140 (140a, 140b) (note that the through holes 140 shown in Fig. 1 are filled with the first clad layer 20).
  • a light-emitting element 120 and a light-receiving element 130 are provided on the side of the substrate 110 opposite to the optical waveguide 100 side.
  • the light propagation path in the photoelectric composite substrate 200 will be specifically described using Figure 1.
  • the light emitted from the light-emitting portion of the light-emitting element 120 passes through the through-hole 140a formed in the substrate 110, enters the mirror 50 on the light-emitting element side, and is transmitted through the core layer 30. After that, it enters the mirror 60 on the light-receiving element side, passes through the through-hole 140b formed in the substrate 110, and enters the light-receiving element 130.
  • the arrows in Figure 1 are a schematic representation of the propagation of light.
  • the steps of forming a first clad layer on a substrate to obtain a laminate comprising the substrate and the first clad layer, forming a core layer on the first clad layer of the obtained laminate, and forming a second clad layer on the core layer are carried out in sequence.
  • warping amount refers to the degree of warping of the laminate, and a laminate with a large warping amount is also referred to as a large warping amount). If the warping amount is large, it may deteriorate the handling properties in the next process. Therefore, there is a demand for a laminate with a reduced amount of warping.
  • the present invention has been developed in consideration of the above circumstances, and aims to provide a method for manufacturing a laminate that can suppress the amount of warping.
  • the method for manufacturing a laminate in this embodiment is a method for manufacturing a laminate including a substrate and a first clad layer of an optical waveguide, and includes a step (A) of preparing a workpiece including at least a substrate, and a step (B) of attaching an adhesive member to one side of the substrate in the workpiece.
  • the method for manufacturing a laminate of this embodiment includes a step (A) of preparing a workpiece including at least a substrate.
  • the workpiece of this embodiment includes at least a substrate.
  • the substrate is not particularly limited, and examples thereof include a printed circuit board and a flexible substrate.
  • a flexible substrate is preferable, and a flexible double-sided copper-clad laminate is more preferable.
  • the substrate is preferably a substrate for mounting an optical waveguide.
  • the thickness of the substrate is preferably 10 ⁇ m or more, more preferably 30 ⁇ m or more, even more preferably 40 ⁇ m or more, and even more preferably 45 ⁇ m or more, and from the viewpoint of miniaturizing the optoelectronic composite substrate, it is preferably 1000 ⁇ m or less, more preferably 800 ⁇ m or less, even more preferably 500 ⁇ m or less, even more preferably 300 ⁇ m or less, even more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less, and even more preferably 80 ⁇ m or less.
  • the substrate preferably has a through hole.
  • the substrate may have one through hole or two or more through holes.
  • the substrate 110 has a through hole 140a on the light emitting element side and a through hole 140b on the light receiving element side.
  • the through hole 140 can be a light propagation path.
  • the hole diameter of the through hole is preferably 10 ⁇ m or more, more preferably 30 ⁇ m or more, even more preferably 50 ⁇ m or more, even more preferably 70 ⁇ m or more, even more preferably 90 ⁇ m or more, and preferably 1000 ⁇ m or less, more preferably 800 ⁇ m or less, even more preferably 500 ⁇ m or less, even more preferably 400 ⁇ m or less, even more preferably 350 ⁇ m or less, even more preferably 300 ⁇ m or less, even more preferably 250 ⁇ m or less, even more preferably 220 ⁇ m or less.
  • the hole diameter of at least one of the through holes is within the above range.
  • T/R is preferably 0.10 or more, more preferably 0.13 or more, even more preferably 0.15 or more, even more preferably 0.20 or more, even more preferably 0.25 or more, even more preferably 0.30 or more, even more preferably 0.35 or more, even more preferably 0.40 or more, even more preferably 0.45 or more, and even more preferably 0.60 or more, and the upper limit is not particularly limited, but may be, for example, 2.00 or less, 1.50 or less, or 1.00 or less.
  • the substrate has a plurality of through holes, it is sufficient that the T/R of at least one of the through holes is within the above range.
  • the workpiece of this embodiment may be a laminate in which a substrate and a layer other than the substrate are laminated.
  • FIG. 2 is a cross-sectional view showing a schematic example of a structure of a workpiece.
  • the workpiece 350 preferably comprises a substrate 110 and a layer 310 of a resin composition for forming the first clad layer laminated thereon, and more preferably, the substrate 110 and the layer 310 of a resin composition for forming the first clad layer are in direct contact with each other.
  • the "layer made of a resin composition for forming the first clad layer” may be referred to as the "resin layer (a).”
  • the resin composition for forming the first cladding layer is not particularly limited as long as it is a resin composition that can be used to form a cladding layer of an optical waveguide, but the preferred embodiments are as follows.
  • the resin contained in the resin composition for forming the first clad layer is not particularly limited, but preferably contains at least one selected from the group consisting of polyimide resins, compounds having a cyclic ether structure, and copolymers of styrene-based monomers and diene-based monomers.
  • the resin composition for forming the first clad layer preferably contains a polymerization initiator.
  • the polymerization initiator include a thermal polymerization initiator and a photopolymerization initiator, and preferably includes a photopolymerization initiator.
  • the photopolymerization initiator is not particularly limited, and a photocationic polymerization initiator, a photoradical polymerization initiator, or the like can be used, and preferably includes a photocationic polymerization initiator.
  • the resin composition for forming the first clad layer may contain components such as a surfactant as appropriate.
  • the resin composition for forming the first clad layer preferably contains a polyimide resin and a compound having a cyclic ether structure, and more preferably contains a polyimide resin, a compound having a cyclic ether structure, and a polymerization initiator.
  • the thickness of the resin layer (a) 310 is preferably 10 ⁇ m or more, more preferably 12 ⁇ m or more, even more preferably 15 ⁇ m or more, and even more preferably 18 ⁇ m or more, and from the viewpoint of further improving the optical propagation efficiency of the optical waveguide, it is preferably 300 ⁇ m or less, even more preferably 250 ⁇ m or less, even more preferably 200 ⁇ m or less, even more preferably 100 ⁇ m or less, even more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m or less.
  • the through hole 140 may be filled with a resin composition for forming a first cladding layer.
  • the proportion of the resin composition for forming the first cladding layer filled in the through hole is, when the volume of the through hole is 100 volume%, from the viewpoint of further suppressing the propagation loss of the optical waveguide, preferably 70 vol.% or more, more preferably 75 vol.% or more, even more preferably 80 vol.% or more, even more preferably 85 vol.% or more, even more preferably 90 vol.% or more, even more preferably 95 vol.% or more, even more preferably 98 vol.% or more, even more preferably 99 vol.% or more, and is, for example, 100 vol.% or less.
  • the method for filling the through-holes with the resin composition for forming the first clad layer is not particularly limited, but an example of such a method is to overlap a substrate having a through-hole with a film having a resin layer (a), and use a vacuum laminator to laminate the substrate having a through-hole with the film having the resin layer (a), thereby filling the through-holes with the resin composition for forming the first clad layer.
  • the resin composition for forming the first clad layer may be an uncured body, a semi-cured body, or a cured body, but is preferably a semi-cured body or a cured body, and more preferably a cured body.
  • the resin composition for forming the first clad layer is a cured product, the appearance of the resulting laminate is further improved.
  • the workpiece of this embodiment preferably further includes a base film, and more preferably includes a substrate, a resin layer (a), and a base film laminated in this order, and even more preferably includes a substrate, a resin layer (a), and a base film laminated in this order so that they are in contact with each other.
  • the base film may be, for example, a resin film.
  • the resin constituting the base film is not particularly limited, but includes, for example, at least one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, cycloolefin polymer, polycarbonate, and polyimide, more preferably at least one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and even more preferably polyethylene terephthalate.
  • the thickness of the base film is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, preferably 30 ⁇ m or more, and preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 40 ⁇ m or less.
  • the substrate film may be surface-treated, such as for antistatic purposes or release treatment.
  • the method for manufacturing the workpiece of this embodiment is not particularly limited, but may be, for example, the following method.
  • the workpiece is a substrate having a through hole
  • the workpiece is obtained by forming the hole in the substrate by any method.
  • the workpiece further includes the resin layer (a) and the base film
  • the workpiece can be obtained, for example, by the following method.
  • the resin layer (a) may be exposed to light and heated to form a workpiece in which the resin composition for forming the first cladding layer is cured.
  • Step (B) of attaching adhesive member The method for manufacturing a laminate in this embodiment includes a step (B) of attaching an adhesive member to one surface of a substrate in a workpiece. The step (B) is carried out after the step (A). An optional step may be further included between the step (A) and the step (B).
  • FIG. 3 is a diagram for explaining an example of the step (B).
  • FIG. 3 is a diagram showing an adhesive member 450 attached to one surface of a substrate 110 in a workpiece 350 .
  • the workpiece 350 further includes the resin layer (a) 310 as shown in FIG. 3, an adhesive member 450 is attached to the surface of the substrate 110 opposite to the resin layer (a) 310 .
  • the adhesive member 450 is not particularly limited as long as it can be attached to one side of the substrate 110, but the preferred embodiments are as follows.
  • the adhesive member 450 preferably includes a base material layer 420 and an adhesive resin layer 410 .
  • the adhesive member 450 may have an adhesive resin layer 410 on only one side of the base layer 420, or may have an adhesive resin layer 410 on both sides of the base layer 420, but preferably has an adhesive resin layer 410 on only one side of the base layer 420.
  • the adhesive member 450 preferably includes a base material layer 420 .
  • the base layer 420 is not particularly limited, and may be, for example, a plate member, a resin film, or the like.
  • the base layer 420 is a plate member, specifically, for example, a glass plate; a metal plate such as a copper plate or a stainless steel plate; etc. can be used.
  • the base layer 420 is preferably a resin film.
  • the resin constituting the resin film is not particularly limited, but preferably contains at least one selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and more preferably contains polyethylene terephthalate.
  • the thickness of the base layer 420 is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, even more preferably 40 ⁇ m or more, even more preferably 60 ⁇ m or more, even more preferably 80 ⁇ m or more, even more preferably 100 ⁇ m or more, even more preferably 110 ⁇ m or more, even more preferably 120 ⁇ m or more, and the upper limit is not particularly limited, but may be, for example, 1000 ⁇ m or less, 800 ⁇ m or less, 600 ⁇ m or less, 400 ⁇ m or less, 300 ⁇ m or less, 250 ⁇ m or less, 200 ⁇ m or less, or 130 ⁇ m or less.
  • the adhesive resin layer 410 is a layer for attaching the adhesive member 450 to the workpiece 350.
  • the adhesive resin layer 410 is made of, for example, an adhesive.
  • the adhesive constituting the adhesive resin layer 410 is not particularly limited, but preferably includes at least one selected from the group consisting of a (meth)acrylic adhesive, a silicone-based adhesive, a urethane-based adhesive, and a rubber-based adhesive, more preferably includes at least one selected from the group consisting of a (meth)acrylic adhesive and a silicone-based adhesive, and even more preferably includes a (meth)acrylic adhesive.
  • the adhesive resin layer 410 may be one whose adhesive strength decreases when heated or irradiated with light, for example.
  • the adhesive resin layer 410 can have its adhesive strength reduced by heating or light irradiation, for example, by using an adhesive containing a resin that hardens when heated or irradiated with light as the adhesive that constitutes the adhesive resin layer 410.
  • the adhesive member 450 may have other layers in addition to the base layer 420 and the adhesive resin layer 410.
  • the adhesive strength of the adhesive member 450 to a stainless steel test plate is preferably 1 mN/10 mm or more, more preferably 5 mN/10 mm or more, and even more preferably 8 mN/10 mm or more, and from the viewpoint of further improving the peelability of the adhesive member, is preferably 500 mN/10 mm or less, more preferably 300 mN/10 mm or less, and even more preferably 100 mN/10 mm or less.
  • the adhesive strength of the adhesive member 450 to a polyethylene terephthalate test plate is preferably 1 mN/25 mm or more, more preferably 10 mN/25 mm or more, more preferably 20 mN/25 mm or more, even more preferably 40 mN/25 mm or more, even more preferably 60 mN/25 mm or more, and from the viewpoint of further improving the peelability of the adhesive member, it is preferably 230 mN/25 mm or less, more preferably 210 mN/25 mm or less, even more preferably 150 mN/25 mm or less, even more preferably 120 mN/25 mm or less.
  • the adhesive strength of the adhesive member 450 to a polyethylene terephthalate test plate means a value measured by the following method. [method] The adhesive member 450 is attached to a polyethylene terephthalate test plate, pressed back and forth once with a 2 kg rubber roller, and after leaving it for 24 hours, the adhesive member 450 is peeled off in a 180° direction at a pulling speed of 300 mm/min. The test environment is 23° C. and 50% RH.
  • the adhesive member 450 may be, for example, a commercially available adhesive tape.
  • Examples of commercially available pressure-sensitive adhesive tapes include SRL-050F (SFCL) (manufactured by Lintec Corporation), SRL-125F (SF) (manufactured by Lintec Corporation), SRL-0753 (AS) (manufactured by Lintec Corporation), and LIOELM LE905-T (manufactured by Toyochem Co., Ltd.).
  • step (B) the method for attaching the adhesive member to one side of the substrate in the workpiece is not particularly limited, and the member may be attached by hand or by using a tape applicator or the like.
  • Step (C) of removing the adhesive member The method for producing a laminate of the present embodiment preferably further includes the step (C) of removing the adhesive member from the substrate. Step (C) is carried out after step (B). An optional step may be further included between step (B) and step (C).
  • the adhesive member may be heated or irradiated with light to reduce the adhesive strength of the adhesive resin layer in the adhesive member.
  • the laminate including the workpiece and the adhesive member may be heated using an oven.
  • the heating conditions may be, for example, a heating temperature of 120° C. or more and 160° C. or less, and a heating time of 30 minutes or more and 120 minutes or less.
  • step (C) the method for removing the adhesive member from the substrate is not particularly limited, and the adhesive member may be peeled off from the substrate by hand, or the adhesive member may be peeled off from the substrate using a tape peeling machine or the like.
  • Step (D) of laminating a film having a layer made of a resin composition for forming a core layer The method for producing the laminate of this embodiment preferably further includes, after step (B), a step (D) of laminating a film comprising a layer of a resin composition for forming a core layer onto a layer of a resin composition for forming the first clad layer.
  • Step (D) is performed after step (B).
  • An optional step may be further included between step (B) and step (D).
  • a step of peeling off the base film may be further included between step (B) and step (D).
  • step (C) is preferably carried out prior to step (C).
  • the resin composition for forming the core layer is a resin composition capable of forming a core layer of an optical waveguide.
  • the resin contained in the resin composition for forming the core layer includes, for example, a cyclic olefin-based resin, and more specifically, a norbornene-based resin.
  • the resin composition for forming the core layer may contain an antioxidant, a photoacid generator, and the like.
  • a film having a layer made of a resin composition for forming a core layer can be obtained by applying a varnish-like resin composition onto a base film (e.g., a polyethylene terephthalate (PET) film, etc.) and drying it.
  • a varnish-like resin composition onto a base film (e.g., a polyethylene terephthalate (PET) film, etc.) and drying it.
  • PET polyethylene terephthalate
  • a film including a layer of a resin composition for forming a core layer may be laminated on a layer of a resin composition for forming a first clad layer using a known laminator.
  • a vacuum laminator may be used as the laminator to perform lamination in a vacuum atmosphere.
  • the conditions such as the heating temperature, lamination time, and lamination pressure can be arbitrarily set.
  • Step (E) of laminating a film having a layer made of a resin composition for forming a second clad layer The method for producing the laminate of this embodiment preferably further includes, after step (D), a step (E) of laminating a film comprising a layer of a resin composition for forming a second clad layer onto the layer of the resin composition for forming the core layer.
  • Step (E) is performed after step (D). An optional step may be further included between step (D) and step (E).
  • step (E) is preferably carried out prior to step (C).
  • the resin composition for forming the second cladding layer is not particularly limited, as long as it is a resin composition capable of forming the second cladding layer of the optical waveguide.
  • the resin composition for forming the second cladding layer may have a similar composition to that of the resin composition for forming the first cladding layer.
  • the resin composition for forming the second clad layer may be different from the resin composition for forming the first clad layer.
  • a film having a layer of a resin composition for forming a second clad layer can be obtained by applying a varnish-like resin composition onto a substrate film (e.g., a polyimide (PI) film, etc.) and drying it.
  • a varnish-like resin composition onto a substrate film (e.g., a polyimide (PI) film, etc.) and drying it.
  • a film including a layer of a resin composition for forming a second clad layer may be laminated on a layer of a resin composition for forming a core layer using a known laminator.
  • a vacuum laminator may be used as the laminator to perform lamination in a vacuum atmosphere.
  • the conditions such as the heating temperature, lamination time, and lamination pressure can be arbitrarily set.
  • the method for producing a laminate according to the present embodiment may include steps other than the steps described above.
  • step (A) of preparing a workpiece it is preferable to carry out each step in the following order: step (A) of preparing a workpiece, step (B) of attaching an adhesive member, step (D) of laminating a film having a layer made of a resin composition for forming a core layer, step (E) of laminating a film having a layer made of a resin composition for forming a second clad layer, and step (C) of removing the adhesive member.
  • step (A) of preparing a workpiece step (B) of attaching an adhesive member
  • step (D) of laminating a film having a layer made of a resin composition for forming a core layer step (E) of laminating a film having a layer made of a resin composition for forming a second clad layer
  • step (C) of removing the adhesive member optionally included between each step.
  • the laminate obtained by the method for producing a laminate of this embodiment includes a substrate and a first clad layer of an optical waveguide.
  • the laminate of this embodiment may further include other layers, and may be a laminate including an adhesive member, a substrate, and a first clad layer in this order; a laminate including an adhesive member, a substrate, a first clad layer, and a base film in this order; etc.
  • the laminate of the present embodiment is preferably an optoelectronic composite substrate further including a core layer and a second clad layer on the first clad layer in this order, i.e., the optoelectronic composite substrate includes a substrate, a first clad layer, a core layer, and a second clad layer in this order.
  • the optoelectronic composite substrate of this embodiment may further include a polyimide substrate on the surface of the second clad layer opposite to the core layer side.
  • the polyimide substrate is, for example, a polyimide substrate in a film including a layer made of a resin composition for forming the second clad layer in step (E) (i.e., a film including a layer made of a resin composition for forming the second clad layer and a polyimide substrate).
  • the optical/electrical composite substrate of this embodiment can be obtained, for example, by carrying out steps (A) to (E).
  • the preferred order of carrying out each step is as described above.
  • the method for producing the optical/electrical composite substrate may appropriately include a step of forming a waveguide pattern in the core layer, a step of forming a mirror on the optical waveguide, and the like.
  • the first clad layer is a concept that includes a layer made of a resin composition for forming the first clad layer
  • the core layer is a concept that includes a layer made of a resin composition for forming the core layer
  • the second clad layer is a concept that includes a layer made of a resin composition for forming the second clad layer.
  • the obtained polyimide solution was poured into 1,000 g of methanol while stirring in a 5 L volume container to precipitate a polyimide resin. Thereafter, the solid polyimide resin was filtered using a suction filtration device and further washed with 1,000 g of methanol. Then, the solid polyimide resin was dried at 100° C. for 24 hours using a vacuum dryer and further dried at 200° C. for 3 hours to obtain a powdered polyimide resin (A-1). The weight average molecular weight (Mw) of the polyimide resin (A-1) measured by GPC was 51,000.
  • the polyimide resin (A-1) was measured by 1 H-NMR, and the imidization rate was calculated from the quantitative value of the amide peak relative to the peak of the aromatic ring of the polyimide, and the imidization rate was found to be 99% or more.
  • Polyimide resin (A-1) was dissolved in propylene glycol monomethyl ether acetate to a solid content of 25%, and then coated using an applicator to a film thickness of 30 ⁇ m, followed by drying in an oven for 10 minutes at 100° C. A polyimide coating film was obtained.
  • the refractive index of the coating film obtained was measured using an Abbe refractometer (manufactured by Atago Co., Ltd., product name: NAR-1T SOLID) under conditions of 23° C. and 589 nm, and the refractive index of polyimide resin (A-1) was 1.54.
  • C Photopolymerization initiator (C)> (C-1) CPI-310B (manufactured by San-Apro Co., Ltd., photocationic polymerization initiator, triarylsulfonium salt)
  • ⁇ Preparation of resin composition for forming first clad layer 50 parts by mass of polyimide resin (A-1), 50 parts by mass of compound (B-1) having a cyclic ether structure, 0.10 parts by mass of photopolymerization initiator (C-1), 0.10 parts by mass of surfactant (D-1), 80 parts by mass of organic solvent (E-1), and 40 parts by mass of organic solvent (E-2) were stirred at room temperature until each raw material was completely dissolved to obtain a solution. The solution was then filtered through a PTFE filter having a pore size of 0.2 ⁇ m to obtain a resin composition for forming a varnish-like first clad layer.
  • Adhesive member 1 SRL-050F (SFCL) (manufactured by Lintec Corporation, an adhesive tape having a polyethylene terephthalate film (base layer) and a layer composed of an acrylic adhesive (adhesive resin layer), adhesive strength (SUS): 10 mN/10 mm, adhesive strength (PET): 70 mN/25 mm, thickness of base layer: 50 ⁇ m)
  • Adhesive member 2 SRL-125F (SF) (manufactured by Lintec Corporation, an adhesive tape having a polyethylene terephthalate film (base layer) and a layer composed of an acrylic adhesive (adhesive resin layer), adhesive strength (SUS): 10 mN/10 mm, adhesive strength (PET): 80 mN/25 mm, thickness of base layer: 125 ⁇ m)
  • Adhesive member 3 SRL-0753 (AS) (manufactured by Lintec Corporation, an adhesive tape including a polyethylene terephthalate film
  • the adhesive strength (SUS) of adhesive members 1 to 3 and 5 is the adhesive strength value of the adhesive member against a stainless steel test plate, measured in accordance with JIS Z 0237 (2009).
  • the adhesive strength (PET) of the adhesive members 1 to 3 and 5 means a value obtained by the following measurement method.
  • the adhesive member was attached to a polyethylene terephthalate (PET) test plate, pressed once with a 2 kg rubber roller, and left for 24 hours, after which the adhesive member was peeled off in a 180° direction at a pulling speed of 300 mm/min.
  • the test environment was 23° C. and 50% RH.
  • the adhesive strength (PET) of the adhesive member 4 was measured in the same manner as the adhesive strength (PET) of the adhesive members 1 to 3 and 5, except that the standing time was 20 minutes. In the measurement method of adhesive strength (PET), the adhesive strength (PET) tends to become larger as the leaving time is increased. Therefore, the adhesive strength (PET) of the adhesive member 4 is expected to be 240 mN/25 mm or more when measured after leaving for 24 hours.
  • the substrate and the film having the resin layer (a) were laminated under the conditions of temperature: 140°C, pressure: 0.5 MPa, and time: 30 seconds to obtain a laminate having a layer structure of "substrate/resin layer (a)/PET substrate".
  • the resin composition for forming the first clad layer was filled into the through-hole formed in the substrate.
  • the PET substrate in the laminate is a PET substrate derived from the film having the resin layer (a).
  • the laminates obtained after lamination were exposed to light using a direct imaging exposure machine (manufactured by SCREEN Co., Ltd., product name: LI-9000). Next, the laminates were heated in an oven at 160° C. for 30 minutes to obtain workpieces. That is, the workpieces of Examples 1 to 3 and 5 to 6 have a layer structure of "substrate/resin layer (a)/PET base material", and the resin composition for forming the first clad layer constituting the resin layer (a) is hardened.
  • Step (B) of attaching adhesive member> Using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: CVP-300), the adhesive member was attached to the workpiece under conditions of temperature: 60°C, pressure: 0.6 MPa, and time: 30 seconds, so that the substrate in the workpiece and the adhesive resin layer in the adhesive member were in contact with each other, thereby obtaining laminates of Examples 1 to 3 and 5 to 6, respectively.
  • the adhesive members used were the adhesive members shown in Table 1, respectively.
  • the laminates of Examples 1 to 3 and 5 to 6 have a layer structure of "substrate layer/adhesive resin layer/substrate/resin layer (a)/PET substrate".
  • the size of the laminates of Examples 1 to 3 and 5 to 6 is 160 mm x 205 mm.
  • Example 4 ⁇ Process (A) of preparing workpiece>
  • the workpiece in Example 4 is a substrate having the above-mentioned through hole.
  • Step (B) of attaching adhesive member> Using a vacuum laminator (manufactured by Nikko Materials Co., Ltd., product name: CVP-300), the adhesive material 1 was attached to the workpiece under conditions of temperature: 60° C., pressure: 0.6 MPa, and time: 30 seconds, such that one side of the substrate having a through hole was in contact with the adhesive resin layer in the adhesive material. In other words, a laminate having a layer structure of "base layer/adhesive resin layer/substrate" was obtained.
  • the OPP cover film was peeled off from the film including the resin layer (a), and the laminate and the resin layer (a) were superimposed so that the substrate side of the obtained laminate was in contact with the resin layer (a).
  • the substrate and the film including the resin layer (a) were laminated in the same manner as in Examples 1 to 3 and 5 to 6 to obtain a laminate having a layer structure of "substrate layer/adhesive resin layer/substrate/resin layer (a)/PET substrate".
  • the resin composition for forming the first clad layer was filled into the through holes formed in the substrate.
  • the laminated laminate was exposed to light and heated to harden the resin composition for forming the first clad layer constituting the resin layer (a), thereby obtaining the laminate of Example 4.
  • the size of the laminate of Example 4 was 160 mm x 205 mm.
  • Comparative Example 1 A laminate of Comparative Example 1 was obtained in the same manner as in Examples 1 to 3 and 5 to 6, except that step (B) was not performed. That is, the laminate of Comparative Example 1 has a layer structure of "substrate/resin layer (a)/PET base material", and the resin composition for forming the first clad layer constituting the resin layer (a) is cured. The size of the laminate of Comparative Example 1 is 160 mm x 205 mm.
  • the evaluation of peelability can be said to have been carried out by further performing step (C) of removing the adhesive member from the substrate in the manufacturing method of the laminates of Examples 1 to 6.
  • the manufacturing method of the examples all have a smaller amount of warping than the laminates obtained by the manufacturing method of the comparative examples.
  • the manufacturing method of the laminate of this embodiment can suppress the amount of warping of the obtained laminate.
  • First cladding layer 30 Core layer 40 Second cladding layer 50 Mirror on the light-emitting element side 60 Mirror on the light-receiving element side 100
  • Optical waveguide 110 Substrate 120
  • Light-emitting element 130 Light-receiving element 140, 140a, 140b Through hole 200
  • Photoelectric composite substrate 310 Layer made of a resin composition for forming the first cladding layer (resin layer (a)) 350 Workpiece 410
  • Adhesive resin layer 420 Base material layer 450 Adhesive member

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  • General Physics & Mathematics (AREA)
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  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010224030A (ja) * 2009-03-19 2010-10-07 Hitachi Chem Co Ltd 光電気複合部材の製造方法
WO2013105471A1 (ja) * 2012-01-11 2013-07-18 日立化成株式会社 光導波路及びその製造方法
WO2018159746A1 (ja) * 2017-03-03 2018-09-07 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
JP2019113704A (ja) * 2017-12-22 2019-07-11 住友ベークライト株式会社 光導波路の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010224030A (ja) * 2009-03-19 2010-10-07 Hitachi Chem Co Ltd 光電気複合部材の製造方法
WO2013105471A1 (ja) * 2012-01-11 2013-07-18 日立化成株式会社 光導波路及びその製造方法
WO2018159746A1 (ja) * 2017-03-03 2018-09-07 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
JP2019113704A (ja) * 2017-12-22 2019-07-11 住友ベークライト株式会社 光導波路の製造方法

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