TW202519510A - 熱硬化性樹脂組成物、預浸體、樹脂膜、積層板、印刷線路板及半導體封裝體 - Google Patents

熱硬化性樹脂組成物、預浸體、樹脂膜、積層板、印刷線路板及半導體封裝體 Download PDF

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Publication number
TW202519510A
TW202519510A TW113133820A TW113133820A TW202519510A TW 202519510 A TW202519510 A TW 202519510A TW 113133820 A TW113133820 A TW 113133820A TW 113133820 A TW113133820 A TW 113133820A TW 202519510 A TW202519510 A TW 202519510A
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TW
Taiwan
Prior art keywords
group
resin composition
thermosetting resin
component
carbon atoms
Prior art date
Application number
TW113133820A
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English (en)
Chinese (zh)
Inventor
板谷義人
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202519510A publication Critical patent/TW202519510A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113133820A 2023-09-07 2024-09-06 熱硬化性樹脂組成物、預浸體、樹脂膜、積層板、印刷線路板及半導體封裝體 TW202519510A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023145544 2023-09-07
JP2023-145544 2023-09-07

Publications (1)

Publication Number Publication Date
TW202519510A true TW202519510A (zh) 2025-05-16

Family

ID=94923321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113133820A TW202519510A (zh) 2023-09-07 2024-09-06 熱硬化性樹脂組成物、預浸體、樹脂膜、積層板、印刷線路板及半導體封裝體

Country Status (5)

Country Link
JP (1) JPWO2025053233A1 (https=)
KR (1) KR20260030938A (https=)
CN (1) CN120813617A (https=)
TW (1) TW202519510A (https=)
WO (1) WO2025053233A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107735409B (zh) * 2015-07-06 2020-08-11 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
WO2021132495A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP7452204B2 (ja) * 2020-04-01 2024-03-19 味の素株式会社 樹脂組成物
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN116056893A (zh) * 2020-09-11 2023-05-02 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
WO2022102782A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
KR20230108275A (ko) * 2020-11-16 2023-07-18 가부시끼가이샤 레조낙 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
US20240270885A1 (en) * 2021-05-17 2024-08-15 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

Also Published As

Publication number Publication date
JPWO2025053233A1 (https=) 2025-03-13
KR20260030938A (ko) 2026-03-06
CN120813617A (zh) 2025-10-17
WO2025053233A1 (ja) 2025-03-13

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