KR20260030938A - 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지 - Google Patents

열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지

Info

Publication number
KR20260030938A
KR20260030938A KR1020267003997A KR20267003997A KR20260030938A KR 20260030938 A KR20260030938 A KR 20260030938A KR 1020267003997 A KR1020267003997 A KR 1020267003997A KR 20267003997 A KR20267003997 A KR 20267003997A KR 20260030938 A KR20260030938 A KR 20260030938A
Authority
KR
South Korea
Prior art keywords
group
resin composition
thermosetting resin
carbon atoms
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020267003997A
Other languages
English (en)
Korean (ko)
Inventor
요시토 이타야
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20260030938A publication Critical patent/KR20260030938A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020267003997A 2023-09-07 2024-09-05 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지 Pending KR20260030938A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-145544 2023-09-07
JP2023145544 2023-09-07
PCT/JP2024/031923 WO2025053233A1 (ja) 2023-09-07 2024-09-05 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
KR20260030938A true KR20260030938A (ko) 2026-03-06

Family

ID=94923321

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020267003997A Pending KR20260030938A (ko) 2023-09-07 2024-09-05 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지

Country Status (5)

Country Link
JP (1) JPWO2025053233A1 (https=)
KR (1) KR20260030938A (https=)
CN (1) CN120813617A (https=)
TW (1) TW202519510A (https=)
WO (1) WO2025053233A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107735409B (zh) * 2015-07-06 2020-08-11 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
WO2021132495A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP7452204B2 (ja) * 2020-04-01 2024-03-19 味の素株式会社 樹脂組成物
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN116056893A (zh) * 2020-09-11 2023-05-02 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
WO2022102782A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
KR20230108275A (ko) * 2020-11-16 2023-07-18 가부시끼가이샤 레조낙 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
US20240270885A1 (en) * 2021-05-17 2024-08-15 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

Also Published As

Publication number Publication date
JPWO2025053233A1 (https=) 2025-03-13
CN120813617A (zh) 2025-10-17
TW202519510A (zh) 2025-05-16
WO2025053233A1 (ja) 2025-03-13

Similar Documents

Publication Publication Date Title
JP7272068B2 (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2022122542A (ja) マレイミド樹脂組成物、プリプレグ、樹脂フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP2020169274A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169276A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20250110826A (ko) 수지 조성물, 수지 필름, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
JP7552218B2 (ja) 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
WO2023162989A1 (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
KR20260030938A (ko) 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지
KR20250009422A (ko) 열경화성 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판, 안테나 장치, 안테나 모듈 및 통신 장치
JP2023157772A (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
JP7815960B2 (ja) 樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
WO2022075221A1 (ja) 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2023013224A (ja) アンテナモジュール用積層板の製造方法、アンテナ装置の製造方法、アンテナモジュールの製造方法及び通信装置の製造方法
JP2020169277A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169275A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20250112771A (ko) 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지
KR20250150547A (ko) 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
KR20250115998A (ko) 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
JP2025094409A (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ
KR20260008086A (ko) 수지 조성물, 수지 필름, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
TW202536076A (zh) 樹脂組成物、樹脂膜、預浸體、積層板、印刷線路板及半導體封裝體
JP2025065832A (ja) 樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
WO2025142841A1 (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2024087484A (ja) 熱硬化性樹脂組成物、樹脂フィルム、プリプレグ、積層板、金属張り積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置
KR20250023363A (ko) 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지

Legal Events

Date Code Title Description
D11 Substantive examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE)

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)