CN120813617A - 热固性树脂组合物、预浸料、树脂膜、层叠板、印刷线路板及半导体封装体 - Google Patents

热固性树脂组合物、预浸料、树脂膜、层叠板、印刷线路板及半导体封装体

Info

Publication number
CN120813617A
CN120813617A CN202480018893.4A CN202480018893A CN120813617A CN 120813617 A CN120813617 A CN 120813617A CN 202480018893 A CN202480018893 A CN 202480018893A CN 120813617 A CN120813617 A CN 120813617A
Authority
CN
China
Prior art keywords
group
resin composition
thermosetting resin
component
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480018893.4A
Other languages
English (en)
Chinese (zh)
Inventor
板谷义人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN120813617A publication Critical patent/CN120813617A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202480018893.4A 2023-09-07 2024-09-05 热固性树脂组合物、预浸料、树脂膜、层叠板、印刷线路板及半导体封装体 Pending CN120813617A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023145544 2023-09-07
JP2023-145544 2023-09-07
PCT/JP2024/031923 WO2025053233A1 (ja) 2023-09-07 2024-09-05 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
CN120813617A true CN120813617A (zh) 2025-10-17

Family

ID=94923321

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480018893.4A Pending CN120813617A (zh) 2023-09-07 2024-09-05 热固性树脂组合物、预浸料、树脂膜、层叠板、印刷线路板及半导体封装体

Country Status (5)

Country Link
JP (1) JPWO2025053233A1 (https=)
KR (1) KR20260030938A (https=)
CN (1) CN120813617A (https=)
TW (1) TW202519510A (https=)
WO (1) WO2025053233A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107735409B (zh) * 2015-07-06 2020-08-11 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
WO2021132495A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP7452204B2 (ja) * 2020-04-01 2024-03-19 味の素株式会社 樹脂組成物
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN116056893A (zh) * 2020-09-11 2023-05-02 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
WO2022102782A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
KR20230108275A (ko) * 2020-11-16 2023-07-18 가부시끼가이샤 레조낙 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
US20240270885A1 (en) * 2021-05-17 2024-08-15 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

Also Published As

Publication number Publication date
JPWO2025053233A1 (https=) 2025-03-13
KR20260030938A (ko) 2026-03-06
TW202519510A (zh) 2025-05-16
WO2025053233A1 (ja) 2025-03-13

Similar Documents

Publication Publication Date Title
CN112969759B (zh) 树脂组合物、树脂组合物的固化物、预浸料、层叠板、树脂膜、多层印刷布线板、毫米波雷达用多层印刷布线板及聚苯醚衍生物
TWI888344B (zh) 預浸體、積層板、多層印刷線路板、半導體封裝體及樹脂組成物、以及預浸體、積層板及多層印刷線路板的製造方法
JP2020169273A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2022122542A (ja) マレイミド樹脂組成物、プリプレグ、樹脂フィルム、積層板、多層プリント配線板及び半導体パッケージ
CN120153001A (zh) 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板和半导体封装体
JP7826690B2 (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
CN118742610A (zh) 热固化性树脂组合物、预浸料、树脂膜、层叠板、印刷布线板和半导体封装体
CN120813617A (zh) 热固性树脂组合物、预浸料、树脂膜、层叠板、印刷线路板及半导体封装体
JP6896994B2 (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2023157772A (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
KR20230108278A (ko) 말레이미드 수지 조성물, 프리프레그, 수지 필름, 적층판, 프린트 배선판 및 반도체 패키지
JP7815960B2 (ja) 樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
JP2021075729A (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2020169277A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
EP4624527A1 (en) Resin composition, prepreg, resin film, laminate, printed wiring board and semiconductor package
KR20250150547A (ko) 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
JP2025094409A (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ
CN121079354A (zh) 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板及半导体封装体
CN120153013A (zh) 预浸料、层叠板、印刷线路板和半导体封装体
CN120936671A (zh) 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板和半导体封装体
JP2025065832A (ja) 樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
JP2024087484A (ja) 熱硬化性樹脂組成物、樹脂フィルム、プリプレグ、積層板、金属張り積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置
CN116669958A (zh) 热固性树脂组合物、预浸渍体、层叠板、覆金属层叠板、印刷电路板及高速通信兼容模块
JP2025002128A (ja) 樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ
WO2025142841A1 (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination