TW202506328A - 研磨墊、研磨方法及半導體之製造方法 - Google Patents

研磨墊、研磨方法及半導體之製造方法 Download PDF

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Publication number
TW202506328A
TW202506328A TW113121613A TW113121613A TW202506328A TW 202506328 A TW202506328 A TW 202506328A TW 113121613 A TW113121613 A TW 113121613A TW 113121613 A TW113121613 A TW 113121613A TW 202506328 A TW202506328 A TW 202506328A
Authority
TW
Taiwan
Prior art keywords
polishing
groove
center
polishing pad
grooves
Prior art date
Application number
TW113121613A
Other languages
English (en)
Chinese (zh)
Inventor
砂山梓紗
Original Assignee
日商可樂麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商可樂麗股份有限公司 filed Critical 日商可樂麗股份有限公司
Publication of TW202506328A publication Critical patent/TW202506328A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW113121613A 2023-06-12 2024-06-12 研磨墊、研磨方法及半導體之製造方法 TW202506328A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023096439 2023-06-12
JP2023-096439 2023-06-12

Publications (1)

Publication Number Publication Date
TW202506328A true TW202506328A (zh) 2025-02-16

Family

ID=93852126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113121613A TW202506328A (zh) 2023-06-12 2024-06-12 研磨墊、研磨方法及半導體之製造方法

Country Status (4)

Country Link
JP (1) JPWO2024257742A1 (https=)
KR (1) KR20260017377A (https=)
TW (1) TW202506328A (https=)
WO (1) WO2024257742A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
JP2000042901A (ja) * 1998-07-29 2000-02-15 Toshiba Ceramics Co Ltd 研磨布およびその製造方法
US20060194530A1 (en) 2005-02-25 2006-08-31 Thomson Clifford O Polishing pad for use in polishing work pieces
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
JP2007103602A (ja) * 2005-10-03 2007-04-19 Toshiba Corp 研磨パッド及び研磨装置
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
CN210982992U (zh) 2019-12-16 2020-07-10 中强光电股份有限公司 背光模块
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION

Also Published As

Publication number Publication date
WO2024257742A1 (ja) 2024-12-19
JPWO2024257742A1 (https=) 2024-12-19
KR20260017377A (ko) 2026-02-05

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