JPWO2024257742A1 - - Google Patents
Info
- Publication number
- JPWO2024257742A1 JPWO2024257742A1 JP2025527923A JP2025527923A JPWO2024257742A1 JP WO2024257742 A1 JPWO2024257742 A1 JP WO2024257742A1 JP 2025527923 A JP2025527923 A JP 2025527923A JP 2025527923 A JP2025527923 A JP 2025527923A JP WO2024257742 A1 JPWO2024257742 A1 JP WO2024257742A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023096439 | 2023-06-12 | ||
| PCT/JP2024/021113 WO2024257742A1 (ja) | 2023-06-12 | 2024-06-11 | 研磨パッド、研磨方法及び半導体の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024257742A1 true JPWO2024257742A1 (https=) | 2024-12-19 |
Family
ID=93852126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025527923A Pending JPWO2024257742A1 (https=) | 2023-06-12 | 2024-06-11 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024257742A1 (https=) |
| KR (1) | KR20260017377A (https=) |
| TW (1) | TW202506328A (https=) |
| WO (1) | WO2024257742A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6254456B1 (en) * | 1997-09-26 | 2001-07-03 | Lsi Logic Corporation | Modifying contact areas of a polishing pad to promote uniform removal rates |
| JP2000042901A (ja) * | 1998-07-29 | 2000-02-15 | Toshiba Ceramics Co Ltd | 研磨布およびその製造方法 |
| US20060194530A1 (en) | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces |
| KR101279819B1 (ko) * | 2005-04-12 | 2013-06-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 방사-편향 연마 패드 |
| JP2007103602A (ja) * | 2005-10-03 | 2007-04-19 | Toshiba Corp | 研磨パッド及び研磨装置 |
| TWI492818B (zh) * | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
| CN210982992U (zh) | 2019-12-16 | 2020-07-10 | 中强光电股份有限公司 | 背光模块 |
| EP4382250A4 (en) * | 2021-08-04 | 2025-06-11 | Kuraray Co., Ltd. | POLISHING CUSHION |
-
2024
- 2024-06-11 JP JP2025527923A patent/JPWO2024257742A1/ja active Pending
- 2024-06-11 KR KR1020257041044A patent/KR20260017377A/ko active Pending
- 2024-06-11 WO PCT/JP2024/021113 patent/WO2024257742A1/ja not_active Ceased
- 2024-06-12 TW TW113121613A patent/TW202506328A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024257742A1 (ja) | 2024-12-19 |
| KR20260017377A (ko) | 2026-02-05 |
| TW202506328A (zh) | 2025-02-16 |