KR20260017377A - 연마 패드, 연마 방법 및 반도체의 제조 방법 - Google Patents

연마 패드, 연마 방법 및 반도체의 제조 방법

Info

Publication number
KR20260017377A
KR20260017377A KR1020257041044A KR20257041044A KR20260017377A KR 20260017377 A KR20260017377 A KR 20260017377A KR 1020257041044 A KR1020257041044 A KR 1020257041044A KR 20257041044 A KR20257041044 A KR 20257041044A KR 20260017377 A KR20260017377 A KR 20260017377A
Authority
KR
South Korea
Prior art keywords
polishing
groove
polishing pad
pad
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257041044A
Other languages
English (en)
Korean (ko)
Inventor
아즈사 스나야마
Original Assignee
주식회사 쿠라레
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 쿠라레 filed Critical 주식회사 쿠라레
Publication of KR20260017377A publication Critical patent/KR20260017377A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020257041044A 2023-06-12 2024-06-11 연마 패드, 연마 방법 및 반도체의 제조 방법 Pending KR20260017377A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023096439 2023-06-12
JPJP-P-2023-096439 2023-06-12
PCT/JP2024/021113 WO2024257742A1 (ja) 2023-06-12 2024-06-11 研磨パッド、研磨方法及び半導体の製造方法

Publications (1)

Publication Number Publication Date
KR20260017377A true KR20260017377A (ko) 2026-02-05

Family

ID=93852126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257041044A Pending KR20260017377A (ko) 2023-06-12 2024-06-11 연마 패드, 연마 방법 및 반도체의 제조 방법

Country Status (4)

Country Link
JP (1) JPWO2024257742A1 (https=)
KR (1) KR20260017377A (https=)
TW (1) TW202506328A (https=)
WO (1) WO2024257742A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093670A2 (en) 2005-02-25 2006-09-08 Jh Rhodes Company, Inc. Polishing pad for use in polishing work pieces
US11280950B2 (en) 2019-12-16 2022-03-22 Coretronic Corporation Backlight module
WO2023013576A1 (ja) 2021-08-04 2023-02-09 株式会社クラレ 研磨パッド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
JP2000042901A (ja) * 1998-07-29 2000-02-15 Toshiba Ceramics Co Ltd 研磨布およびその製造方法
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
JP2007103602A (ja) * 2005-10-03 2007-04-19 Toshiba Corp 研磨パッド及び研磨装置
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093670A2 (en) 2005-02-25 2006-09-08 Jh Rhodes Company, Inc. Polishing pad for use in polishing work pieces
US11280950B2 (en) 2019-12-16 2022-03-22 Coretronic Corporation Backlight module
WO2023013576A1 (ja) 2021-08-04 2023-02-09 株式会社クラレ 研磨パッド

Also Published As

Publication number Publication date
WO2024257742A1 (ja) 2024-12-19
JPWO2024257742A1 (https=) 2024-12-19
TW202506328A (zh) 2025-02-16

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)