TW202504994A - 研磨劑及其製造方法、研磨劑用添加液之製造方法、研磨方法、以及半導體零件之製造方法 - Google Patents

研磨劑及其製造方法、研磨劑用添加液之製造方法、研磨方法、以及半導體零件之製造方法 Download PDF

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Publication number
TW202504994A
TW202504994A TW113126391A TW113126391A TW202504994A TW 202504994 A TW202504994 A TW 202504994A TW 113126391 A TW113126391 A TW 113126391A TW 113126391 A TW113126391 A TW 113126391A TW 202504994 A TW202504994 A TW 202504994A
Authority
TW
Taiwan
Prior art keywords
abrasive
particles
polishing
mass
polishing agent
Prior art date
Application number
TW113126391A
Other languages
English (en)
Chinese (zh)
Inventor
福井宏佳
Original Assignee
日商Ａｇｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW202504994A publication Critical patent/TW202504994A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW113126391A 2023-07-21 2024-07-15 研磨劑及其製造方法、研磨劑用添加液之製造方法、研磨方法、以及半導體零件之製造方法 TW202504994A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-119429 2023-07-21
JP2023119429 2023-07-21

Publications (1)

Publication Number Publication Date
TW202504994A true TW202504994A (zh) 2025-02-01

Family

ID=94374975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113126391A TW202504994A (zh) 2023-07-21 2024-07-15 研磨劑及其製造方法、研磨劑用添加液之製造方法、研磨方法、以及半導體零件之製造方法

Country Status (4)

Country Link
JP (1) JPWO2025023040A1 (https=)
DE (1) DE112024003049T5 (https=)
TW (1) TW202504994A (https=)
WO (1) WO2025023040A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035818A (ja) 1999-07-16 2001-02-09 Seimi Chem Co Ltd 半導体用研磨剤
FR2906800B1 (fr) 2006-10-09 2008-11-28 Rhodia Recherches & Tech Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage
JPWO2013137220A1 (ja) * 2012-03-14 2015-08-03 日立化成株式会社 研磨方法
WO2016104611A1 (ja) * 2014-12-26 2016-06-30 花王株式会社 酸化珪素膜研磨用研磨液組成物
JP7187770B2 (ja) * 2017-11-08 2022-12-13 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP7685983B2 (ja) * 2021-12-28 2025-05-30 花王株式会社 酸化珪素膜用研磨液組成物
JP7433593B2 (ja) 2022-02-16 2024-02-20 株式会社ミヤコシ インクジェット印字装置
JPWO2024142722A1 (https=) * 2022-12-27 2024-07-04

Also Published As

Publication number Publication date
DE112024003049T5 (de) 2026-05-07
WO2025023040A1 (ja) 2025-01-30
JPWO2025023040A1 (https=) 2025-01-30

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