JPWO2025023040A1 - - Google Patents
Info
- Publication number
- JPWO2025023040A1 JPWO2025023040A1 JP2025535721A JP2025535721A JPWO2025023040A1 JP WO2025023040 A1 JPWO2025023040 A1 JP WO2025023040A1 JP 2025535721 A JP2025535721 A JP 2025535721A JP 2025535721 A JP2025535721 A JP 2025535721A JP WO2025023040 A1 JPWO2025023040 A1 JP WO2025023040A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119429 | 2023-07-21 | ||
| PCT/JP2024/025077 WO2025023040A1 (ja) | 2023-07-21 | 2024-07-11 | 研磨剤及びその製造方法、研磨剤用添加液の製造方法、研磨方法、並びに、半導体部品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023040A1 true JPWO2025023040A1 (https=) | 2025-01-30 |
Family
ID=94374975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535721A Pending JPWO2025023040A1 (https=) | 2023-07-21 | 2024-07-11 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023040A1 (https=) |
| DE (1) | DE112024003049T5 (https=) |
| TW (1) | TW202504994A (https=) |
| WO (1) | WO2025023040A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035818A (ja) | 1999-07-16 | 2001-02-09 | Seimi Chem Co Ltd | 半導体用研磨剤 |
| FR2906800B1 (fr) | 2006-10-09 | 2008-11-28 | Rhodia Recherches & Tech | Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage |
| JPWO2013137220A1 (ja) * | 2012-03-14 | 2015-08-03 | 日立化成株式会社 | 研磨方法 |
| WO2016104611A1 (ja) * | 2014-12-26 | 2016-06-30 | 花王株式会社 | 酸化珪素膜研磨用研磨液組成物 |
| JP7187770B2 (ja) * | 2017-11-08 | 2022-12-13 | Ａｇｃ株式会社 | 研磨剤と研磨方法、および研磨用添加液 |
| JP7685983B2 (ja) * | 2021-12-28 | 2025-05-30 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7433593B2 (ja) | 2022-02-16 | 2024-02-20 | 株式会社ミヤコシ | インクジェット印字装置 |
| JPWO2024142722A1 (https=) * | 2022-12-27 | 2024-07-04 |
-
2024
- 2024-07-11 JP JP2025535721A patent/JPWO2025023040A1/ja active Pending
- 2024-07-11 WO PCT/JP2024/025077 patent/WO2025023040A1/ja active Pending
- 2024-07-11 DE DE112024003049.1T patent/DE112024003049T5/de active Pending
- 2024-07-15 TW TW113126391A patent/TW202504994A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE112024003049T5 (de) | 2026-05-07 |
| WO2025023040A1 (ja) | 2025-01-30 |
| TW202504994A (zh) | 2025-02-01 |