TW202504943A - 環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 - Google Patents

環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 Download PDF

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Publication number
TW202504943A
TW202504943A TW113126052A TW113126052A TW202504943A TW 202504943 A TW202504943 A TW 202504943A TW 113126052 A TW113126052 A TW 113126052A TW 113126052 A TW113126052 A TW 113126052A TW 202504943 A TW202504943 A TW 202504943A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
component
liquid
epoxy
Prior art date
Application number
TW113126052A
Other languages
English (en)
Chinese (zh)
Inventor
岩谷一希
大坪広大
重田望
永田理恵子
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202504943A publication Critical patent/TW202504943A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW113126052A 2023-07-21 2024-07-11 環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 TW202504943A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023119048 2023-07-21
JP2023-119048 2023-07-21

Publications (1)

Publication Number Publication Date
TW202504943A true TW202504943A (zh) 2025-02-01

Family

ID=94374610

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113126052A TW202504943A (zh) 2023-07-21 2024-07-11 環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件

Country Status (5)

Country Link
JP (1) JPWO2025023048A1 (https=)
KR (1) KR20260041016A (https=)
CN (1) CN121443668A (https=)
TW (1) TW202504943A (https=)
WO (1) WO2025023048A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048838A1 (ja) * 2024-08-30 2026-03-05 ナミックス株式会社 硬化剤組成物、それが収容された容器、熱硬化性組成物キット、熱硬化性組成物の製造方法、熱硬化性組成物の硬化物、ならびに硬化剤組成物の輸送及び保存方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367532B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP3367531B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP2009170742A (ja) * 2008-01-18 2009-07-30 Sumitomo Metal Mining Co Ltd 電子部品搭載用基板の信頼性評価方法
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
JP2020120842A (ja) 2019-01-30 2020-08-13 株式会社三洋物産 遊技機
JP7723639B2 (ja) * 2022-05-10 2025-08-14 四国化成工業株式会社 チオール化合物及びその用途
JP7236041B2 (ja) 2022-08-24 2023-03-09 四国化成ホールディングス株式会社 硬化剤及びその用途
JP2023126883A (ja) 2023-07-04 2023-09-12 四国化成工業株式会社 チオール化合物及びその用途

Also Published As

Publication number Publication date
CN121443668A (zh) 2026-01-30
KR20260041016A (ko) 2026-03-26
WO2025023048A1 (ja) 2025-01-30
JPWO2025023048A1 (https=) 2025-01-30

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