KR20260041016A - 에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품 - Google Patents

에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품

Info

Publication number
KR20260041016A
KR20260041016A KR1020257043338A KR20257043338A KR20260041016A KR 20260041016 A KR20260041016 A KR 20260041016A KR 1020257043338 A KR1020257043338 A KR 1020257043338A KR 20257043338 A KR20257043338 A KR 20257043338A KR 20260041016 A KR20260041016 A KR 20260041016A
Authority
KR
South Korea
Prior art keywords
epoxy resin
component
resin composition
thiol
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257043338A
Other languages
English (en)
Korean (ko)
Inventor
카즈키 이와야
코다이 오츠보
노조미 시게타
리에코 나가타
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20260041016A publication Critical patent/KR20260041016A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020257043338A 2023-07-21 2024-07-11 에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품 Pending KR20260041016A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-119048 2023-07-21
JP2023119048 2023-07-21
PCT/JP2024/025141 WO2025023048A1 (ja) 2023-07-21 2024-07-11 エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Publications (1)

Publication Number Publication Date
KR20260041016A true KR20260041016A (ko) 2026-03-26

Family

ID=94374610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257043338A Pending KR20260041016A (ko) 2023-07-21 2024-07-11 에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품

Country Status (5)

Country Link
JP (1) JPWO2025023048A1 (https=)
KR (1) KR20260041016A (https=)
CN (1) CN121443668A (https=)
TW (1) TW202504943A (https=)
WO (1) WO2025023048A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048838A1 (ja) * 2024-08-30 2026-03-05 ナミックス株式会社 硬化剤組成物、それが収容された容器、熱硬化性組成物キット、熱硬化性組成物の製造方法、熱硬化性組成物の硬化物、ならびに硬化剤組成物の輸送及び保存方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367532B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP3367531B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP2009170742A (ja) * 2008-01-18 2009-07-30 Sumitomo Metal Mining Co Ltd 電子部品搭載用基板の信頼性評価方法
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
JP2020120842A (ja) 2019-01-30 2020-08-13 株式会社三洋物産 遊技機
JP7723639B2 (ja) * 2022-05-10 2025-08-14 四国化成工業株式会社 チオール化合物及びその用途
JP7236041B2 (ja) 2022-08-24 2023-03-09 四国化成ホールディングス株式会社 硬化剤及びその用途
JP2023126883A (ja) 2023-07-04 2023-09-12 四国化成工業株式会社 チオール化合物及びその用途

Also Published As

Publication number Publication date
CN121443668A (zh) 2026-01-30
TW202504943A (zh) 2025-02-01
WO2025023048A1 (ja) 2025-01-30
JPWO2025023048A1 (https=) 2025-01-30

Similar Documents

Publication Publication Date Title
JP6887687B2 (ja) 樹脂組成物、接着剤、封止材、ダム剤、半導体装置、およびイメージセンサーモジュール
EP2640765B1 (en) One component epoxy resin composition
KR102442254B1 (ko) 반도체 장치 및 이미지 센서 모듈
TWI827873B (zh) 環氧樹脂組成物
TWI826714B (zh) 環氧樹脂組成物
KR20210080363A (ko) 수지 조성물
TWI817988B (zh) 環氧樹脂組成物
KR20260041016A (ko) 에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품
KR20260038862A (ko) 에폭시 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품
JP4204814B2 (ja) 熱硬化性液状樹脂組成物
KR20210078480A (ko) 수지 조성물
KR20250095607A (ko) 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품
KR102129331B1 (ko) 에폭시 수지 조성물
CN115124813A (zh) 树脂组合物
JP2021031666A (ja) エポキシ樹脂組成物
WO2023026872A1 (ja) エポキシ樹脂組成物
KR102187518B1 (ko) 에폭시 수지 조성물
WO2024116693A1 (ja) 樹脂組成物、接着剤、封止材、ダイアタッチ剤、硬化物及び電子デバイス
JP2026060203A (ja) 樹脂組成物
WO2023181831A1 (ja) 樹脂組成物、接着剤又は封止材、硬化物、半導体装置及び電子部品
KR20250097806A (ko) 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)