TW202502677A - 半導體元件被覆用玻璃及半導體元件被覆用燒結體 - Google Patents
半導體元件被覆用玻璃及半導體元件被覆用燒結體 Download PDFInfo
- Publication number
- TW202502677A TW202502677A TW113121211A TW113121211A TW202502677A TW 202502677 A TW202502677 A TW 202502677A TW 113121211 A TW113121211 A TW 113121211A TW 113121211 A TW113121211 A TW 113121211A TW 202502677 A TW202502677 A TW 202502677A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass
- semiconductor element
- zno
- sio2
- al2o3
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-094622 | 2023-06-08 | ||
| JP2023094622 | 2023-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202502677A true TW202502677A (zh) | 2025-01-16 |
Family
ID=93796052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113121211A TW202502677A (zh) | 2023-06-08 | 2024-06-07 | 半導體元件被覆用玻璃及半導體元件被覆用燒結體 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024253096A1 (https=) |
| CN (1) | CN121335867A (https=) |
| TW (1) | TW202502677A (https=) |
| WO (1) | WO2024253096A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126639A (ja) * | 1989-10-06 | 1991-05-29 | Nippon Electric Glass Co Ltd | 被覆用ガラス組成物 |
| WO2013168236A1 (ja) * | 2012-05-08 | 2013-11-14 | 新電元工業株式会社 | 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法 |
| WO2018221426A1 (ja) * | 2017-05-27 | 2018-12-06 | 日本山村硝子株式会社 | 封止用ガラス組成物 |
| JP7218531B2 (ja) * | 2018-10-04 | 2023-02-07 | 日本電気硝子株式会社 | 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料 |
| JP7216323B2 (ja) * | 2019-01-29 | 2023-02-01 | 日本電気硝子株式会社 | 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料 |
| CN115038674A (zh) * | 2020-01-21 | 2022-09-09 | 日本山村硝子株式会社 | 低热膨胀性封接/被覆用玻璃 |
-
2024
- 2024-06-04 JP JP2025526116A patent/JPWO2024253096A1/ja active Pending
- 2024-06-04 WO PCT/JP2024/020388 patent/WO2024253096A1/ja not_active Ceased
- 2024-06-04 CN CN202480037730.0A patent/CN121335867A/zh active Pending
- 2024-06-07 TW TW113121211A patent/TW202502677A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024253096A1 (https=) | 2024-12-12 |
| CN121335867A (zh) | 2026-01-13 |
| WO2024253096A1 (ja) | 2024-12-12 |
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