TW202448566A - 濃度控制裝置、原料氣化系統、濃度控制方法和存儲有濃度控制程式的存儲介質 - Google Patents

濃度控制裝置、原料氣化系統、濃度控制方法和存儲有濃度控制程式的存儲介質 Download PDF

Info

Publication number
TW202448566A
TW202448566A TW113106614A TW113106614A TW202448566A TW 202448566 A TW202448566 A TW 202448566A TW 113106614 A TW113106614 A TW 113106614A TW 113106614 A TW113106614 A TW 113106614A TW 202448566 A TW202448566 A TW 202448566A
Authority
TW
Taiwan
Prior art keywords
concentration
raw material
control device
gas
flow
Prior art date
Application number
TW113106614A
Other languages
English (en)
Chinese (zh)
Inventor
瀧尻興太郎
Original Assignee
日商堀場Stec股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商堀場Stec股份有限公司 filed Critical 日商堀場Stec股份有限公司
Publication of TW202448566A publication Critical patent/TW202448566A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
    • G05D11/138—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture by sensing the concentration of the mixture, e.g. measuring pH value
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D1/00—Evaporating
    • B01D1/0082—Regulation; Control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C7/00—Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass
    • F17C7/02—Discharging liquefied gases
    • F17C7/04—Discharging liquefied gases with change of state, e.g. vaporisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Feedback Control In General (AREA)
  • Control Of Non-Electrical Variables (AREA)
TW113106614A 2023-02-28 2024-02-23 濃度控制裝置、原料氣化系統、濃度控制方法和存儲有濃度控制程式的存儲介質 TW202448566A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023029849A JP2024122352A (ja) 2023-02-28 2023-02-28 濃度制御装置、原料気化システム、濃度制御方法及び濃度制御プログラム
JP2023-029849 2023-02-28

Publications (1)

Publication Number Publication Date
TW202448566A true TW202448566A (zh) 2024-12-16

Family

ID=92461882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106614A TW202448566A (zh) 2023-02-28 2024-02-23 濃度控制裝置、原料氣化系統、濃度控制方法和存儲有濃度控制程式的存儲介質

Country Status (5)

Country Link
US (1) US20240286060A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024122352A (cg-RX-API-DMAC7.html)
KR (1) KR20240133605A (cg-RX-API-DMAC7.html)
CN (1) CN118564832A (cg-RX-API-DMAC7.html)
TW (1) TW202448566A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7829898B1 (ja) * 2025-03-31 2026-03-16 株式会社エイシング 遅れ補償システム、方法、及びプログラム

Also Published As

Publication number Publication date
JP2024122352A (ja) 2024-09-09
US20240286060A1 (en) 2024-08-29
CN118564832A (zh) 2024-08-30
KR20240133605A (ko) 2024-09-04

Similar Documents

Publication Publication Date Title
US6855916B1 (en) Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling
KR20040042874A (ko) 하이브리드 캐스케이드 모델 기반의 예측 제어 시스템
US7727780B2 (en) Substrate processing method and semiconductor manufacturing apparatus
EP0789981B1 (en) Thermal reactor optimization
US7718926B2 (en) Film deposition apparatus, film deposition method, monitoring program for film deposition apparatus, and recording medium thereof
KR100359734B1 (ko) 모델에 기초한 반도체 열 처리기용 온도제어기
CN108570659B (zh) 气体控制系统、成膜装置、存储介质和气体控制方法
US5793022A (en) Adaptive temperture controller and method of operation
JP2014527286A (ja) モデルベースの制御を使用して基板を処理するための方法および装置
US12431396B2 (en) Temperature correction information calculation device, semiconductor manufacturing apparatus, storage medium, and temperature correction information calculation method
KR20220117820A (ko) 성막 시스템 및 성막 방법
US11698649B2 (en) Vaporization system and concentration control module used in the same
US20240286060A1 (en) Concentration control device, raw material vaporization system, concentration control method, and recording medium storing concentration control program
JP4001575B2 (ja) 基板処理装置
CN114930514A (zh) 用于热处理系统的自适应控制的控制系统
US7781703B2 (en) Thermal analyzer
CN121428654B (zh) 一种外延生长工艺控制方法及系统
CN121028924A (zh) 一种气路控制方法、系统、智能终端及存储介质
JP3620981B2 (ja) 試料温度制御方法
JP6693106B2 (ja) 原料供給装置、原料供給方法及び記憶媒体
JP2004356409A (ja) 基板処理装置
JP2008197069A (ja) 水素濃度管理方法およびチャンバ装置
JP5223154B2 (ja) 温度制御方法、温度制御装置および温度制御用プログラム
JPWO2006061892A1 (ja) 温度制御方法、及び温度制御装置
CN121411534A (zh) 一种半导体反应腔的温度控制方法