KR20240133605A - 농도 제어 장치, 원료 기화 시스템, 농도 제어 방법, 및 농도 제어 프로그램을 격납한 기록 매체 - Google Patents

농도 제어 장치, 원료 기화 시스템, 농도 제어 방법, 및 농도 제어 프로그램을 격납한 기록 매체 Download PDF

Info

Publication number
KR20240133605A
KR20240133605A KR1020240025209A KR20240025209A KR20240133605A KR 20240133605 A KR20240133605 A KR 20240133605A KR 1020240025209 A KR1020240025209 A KR 1020240025209A KR 20240025209 A KR20240025209 A KR 20240025209A KR 20240133605 A KR20240133605 A KR 20240133605A
Authority
KR
South Korea
Prior art keywords
raw material
concentration
flow rate
control device
material gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020240025209A
Other languages
English (en)
Korean (ko)
Inventor
고타로 다키지리
Original Assignee
가부시키가이샤 호리바 에스텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 호리바 에스텍 filed Critical 가부시키가이샤 호리바 에스텍
Publication of KR20240133605A publication Critical patent/KR20240133605A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D1/00—Evaporating
    • B01D1/0082—Regulation; Control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
    • G05D11/138—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture by sensing the concentration of the mixture, e.g. measuring pH value
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C7/00—Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass
    • F17C7/02—Discharging liquefied gases
    • F17C7/04—Discharging liquefied gases with change of state, e.g. vaporisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/02—Pipe-line systems for gases or vapours
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • H01L21/67017—
    • H01L21/67253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Feedback Control In General (AREA)
  • Control Of Non-Electrical Variables (AREA)
KR1020240025209A 2023-02-28 2024-02-21 농도 제어 장치, 원료 기화 시스템, 농도 제어 방법, 및 농도 제어 프로그램을 격납한 기록 매체 Pending KR20240133605A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023029849A JP2024122352A (ja) 2023-02-28 2023-02-28 濃度制御装置、原料気化システム、濃度制御方法及び濃度制御プログラム
JPJP-P-2023-029849 2023-02-28

Publications (1)

Publication Number Publication Date
KR20240133605A true KR20240133605A (ko) 2024-09-04

Family

ID=92461882

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020240025209A Pending KR20240133605A (ko) 2023-02-28 2024-02-21 농도 제어 장치, 원료 기화 시스템, 농도 제어 방법, 및 농도 제어 프로그램을 격납한 기록 매체

Country Status (5)

Country Link
US (1) US20240286060A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024122352A (cg-RX-API-DMAC7.html)
KR (1) KR20240133605A (cg-RX-API-DMAC7.html)
CN (1) CN118564832A (cg-RX-API-DMAC7.html)
TW (1) TW202448566A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7829898B1 (ja) * 2025-03-31 2026-03-16 株式会社エイシング 遅れ補償システム、方法、及びプログラム

Also Published As

Publication number Publication date
JP2024122352A (ja) 2024-09-09
US20240286060A1 (en) 2024-08-29
CN118564832A (zh) 2024-08-30
TW202448566A (zh) 2024-12-16

Similar Documents

Publication Publication Date Title
US8459290B2 (en) Material gas concentration control system
US8153017B2 (en) Substrate treating method
US11158529B2 (en) Method of manufacturing semiconductor device, method of controlling temperature and non-transitory computer-readable recording medium
US8459291B2 (en) Source gas concentration control system
US20040098145A1 (en) Hybrid cascade model-based predictive control system
KR102642990B1 (ko) 기판 처리 장치 및 기판 처리 방법
US12431396B2 (en) Temperature correction information calculation device, semiconductor manufacturing apparatus, storage medium, and temperature correction information calculation method
KR20180103708A (ko) 가스 제어 시스템, 그 가스 제어 시스템을 구비한 성막 장치, 그 가스 제어 시스템에 이용하는 프로그램 및 가스 제어 방법
KR20120075378A (ko) 재료가스 제어장치, 재료가스 제어 방법, 재료가스 제어 프로그램 및 재료가스 제어 시스템
JP4001575B2 (ja) 基板処理装置
US12431373B2 (en) Temperature correction information calculating device, semiconductor manufacturing apparatus, recording medium, and temperature correction information calculating method
JP2020117795A (ja) 濃度制御装置、及び、ゼロ点調整方法、濃度制御装置用プログラム
KR102949431B1 (ko) 원료 기화 시스템, 및 이것에 이용되는 농도 제어 모듈
US20070006483A1 (en) Vapor drying method, apparatus and recording medium for use in the method
KR20220117820A (ko) 성막 시스템 및 성막 방법
CN117712407A (zh) 一种基于mpc算法的燃料电池水热管理控制方法及控制系统
CN101801519B (zh) 载热体加热冷却装置以及载热体温度控制方法
US20240286060A1 (en) Concentration control device, raw material vaporization system, concentration control method, and recording medium storing concentration control program
JPH0528490B2 (cg-RX-API-DMAC7.html)
JP5145193B2 (ja) 材料ガス濃度制御システム
KR20160115767A (ko) 원료 공급 장치, 원료 공급 방법 및 기억 매체
US20060188412A1 (en) Substrate treating apparatus and method
US20240245872A1 (en) Temperature control method of vaporizer and substrate processing apparatus
JP4429189B2 (ja) 基板処理装置及びその方法
JPWO2006061892A1 (ja) 温度制御方法、及び温度制御装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000