TW202446174A - 印刷線路板用基板的可靠性試驗方法 - Google Patents

印刷線路板用基板的可靠性試驗方法 Download PDF

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Publication number
TW202446174A
TW202446174A TW113113093A TW113113093A TW202446174A TW 202446174 A TW202446174 A TW 202446174A TW 113113093 A TW113113093 A TW 113113093A TW 113113093 A TW113113093 A TW 113113093A TW 202446174 A TW202446174 A TW 202446174A
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TW
Taiwan
Prior art keywords
printed circuit
circuit board
board substrate
test
load
Prior art date
Application number
TW113113093A
Other languages
English (en)
Chinese (zh)
Inventor
高橋正樹
大竹俊亮
乃万裕一
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202446174A publication Critical patent/TW202446174A/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0062—Crack or flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0076—Hardness, compressibility or resistance to crushing
    • G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
TW113113093A 2023-04-19 2024-04-09 印刷線路板用基板的可靠性試驗方法 TW202446174A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-068328 2023-04-19
JP2023068328 2023-04-19

Publications (1)

Publication Number Publication Date
TW202446174A true TW202446174A (zh) 2024-11-16

Family

ID=93152877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113113093A TW202446174A (zh) 2023-04-19 2024-04-09 印刷線路板用基板的可靠性試驗方法

Country Status (7)

Country Link
US (1) US20250283793A1 (https=)
EP (1) EP4700359A1 (https=)
JP (1) JPWO2024219249A1 (https=)
KR (1) KR20250174619A (https=)
CN (1) CN119173752A (https=)
TW (1) TW202446174A (https=)
WO (1) WO2024219249A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119437897B (zh) * 2025-01-07 2025-03-21 高邮鑫润龙印刷科技有限公司 一种印刷材料检测机构及具有该检测机构的印刷机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07325029A (ja) * 1994-05-31 1995-12-12 Nec Corp 薄膜物性評価装置
JPH07260658A (ja) * 1994-12-13 1995-10-13 Shimadzu Corp 薄膜の剥離荷重測定方法
US6339958B1 (en) * 1998-12-10 2002-01-22 Advanced Micro Devices, Inc. Adhesion strength testing using a depth-sensing indentation technique
JP3581279B2 (ja) * 1999-10-13 2004-10-27 正樹 白鳥 材料試験機
JP3819701B2 (ja) * 2000-11-10 2006-09-13 三菱樹脂株式会社 ビルドアップ多層プリント配線基板用コア基板
JP3861148B2 (ja) * 2002-11-19 2006-12-20 独立行政法人産業技術総合研究所 無機質膜の剥離力測定方法及び測定装置
JP4610275B2 (ja) 2004-09-27 2011-01-12 イビデン株式会社 多層プリント配線板
JP2012146990A (ja) * 2012-02-22 2012-08-02 Sumitomo Bakelite Co Ltd 多層回路基板、多層回路基板の製造方法および半導体装置

Also Published As

Publication number Publication date
CN119173752A (zh) 2024-12-20
JPWO2024219249A1 (https=) 2024-10-24
KR20250174619A (ko) 2025-12-12
US20250283793A1 (en) 2025-09-11
EP4700359A1 (en) 2026-02-25
WO2024219249A1 (ja) 2024-10-24

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