KR20250174619A - 프린트 배선판용 기판의 신뢰성 시험 방법 - Google Patents

프린트 배선판용 기판의 신뢰성 시험 방법

Info

Publication number
KR20250174619A
KR20250174619A KR1020257034537A KR20257034537A KR20250174619A KR 20250174619 A KR20250174619 A KR 20250174619A KR 1020257034537 A KR1020257034537 A KR 1020257034537A KR 20257034537 A KR20257034537 A KR 20257034537A KR 20250174619 A KR20250174619 A KR 20250174619A
Authority
KR
South Korea
Prior art keywords
printed wiring
wiring board
substrate
test
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257034537A
Other languages
English (en)
Korean (ko)
Inventor
마사키 다카하시
슌스케 오타케
šœ스케 오타케
히로카즈 노마
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250174619A publication Critical patent/KR20250174619A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0062—Crack or flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0076—Hardness, compressibility or resistance to crushing
    • G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
KR1020257034537A 2023-04-19 2024-04-05 프린트 배선판용 기판의 신뢰성 시험 방법 Pending KR20250174619A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-068328 2023-04-19
JP2023068328 2023-04-19
PCT/JP2024/014015 WO2024219249A1 (ja) 2023-04-19 2024-04-05 プリント配線板用基板の信頼性試験方法

Publications (1)

Publication Number Publication Date
KR20250174619A true KR20250174619A (ko) 2025-12-12

Family

ID=93152877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257034537A Pending KR20250174619A (ko) 2023-04-19 2024-04-05 프린트 배선판용 기판의 신뢰성 시험 방법

Country Status (7)

Country Link
US (1) US20250283793A1 (https=)
EP (1) EP4700359A1 (https=)
JP (1) JPWO2024219249A1 (https=)
KR (1) KR20250174619A (https=)
CN (1) CN119173752A (https=)
TW (1) TW202446174A (https=)
WO (1) WO2024219249A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119437897B (zh) * 2025-01-07 2025-03-21 高邮鑫润龙印刷科技有限公司 一种印刷材料检测机构及具有该检测机构的印刷机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093618A (ja) 2004-09-27 2006-04-06 Ibiden Co Ltd 多層プリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07325029A (ja) * 1994-05-31 1995-12-12 Nec Corp 薄膜物性評価装置
JPH07260658A (ja) * 1994-12-13 1995-10-13 Shimadzu Corp 薄膜の剥離荷重測定方法
US6339958B1 (en) * 1998-12-10 2002-01-22 Advanced Micro Devices, Inc. Adhesion strength testing using a depth-sensing indentation technique
JP3581279B2 (ja) * 1999-10-13 2004-10-27 正樹 白鳥 材料試験機
JP3819701B2 (ja) * 2000-11-10 2006-09-13 三菱樹脂株式会社 ビルドアップ多層プリント配線基板用コア基板
JP3861148B2 (ja) * 2002-11-19 2006-12-20 独立行政法人産業技術総合研究所 無機質膜の剥離力測定方法及び測定装置
JP2012146990A (ja) * 2012-02-22 2012-08-02 Sumitomo Bakelite Co Ltd 多層回路基板、多層回路基板の製造方法および半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093618A (ja) 2004-09-27 2006-04-06 Ibiden Co Ltd 多層プリント配線板

Also Published As

Publication number Publication date
CN119173752A (zh) 2024-12-20
JPWO2024219249A1 (https=) 2024-10-24
US20250283793A1 (en) 2025-09-11
EP4700359A1 (en) 2026-02-25
WO2024219249A1 (ja) 2024-10-24
TW202446174A (zh) 2024-11-16

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)