CN119173752A - 印刷线路板用基板的可靠性试验方法 - Google Patents

印刷线路板用基板的可靠性试验方法 Download PDF

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Publication number
CN119173752A
CN119173752A CN202480002352.2A CN202480002352A CN119173752A CN 119173752 A CN119173752 A CN 119173752A CN 202480002352 A CN202480002352 A CN 202480002352A CN 119173752 A CN119173752 A CN 119173752A
Authority
CN
China
Prior art keywords
printed wiring
wiring board
substrate
test
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480002352.2A
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English (en)
Chinese (zh)
Inventor
高桥正树
大竹俊亮
乃万裕一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN119173752A publication Critical patent/CN119173752A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0062—Crack or flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0076—Hardness, compressibility or resistance to crushing
    • G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
CN202480002352.2A 2023-04-19 2024-04-05 印刷线路板用基板的可靠性试验方法 Pending CN119173752A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-068328 2023-04-19
JP2023068328 2023-04-19
PCT/JP2024/014015 WO2024219249A1 (ja) 2023-04-19 2024-04-05 プリント配線板用基板の信頼性試験方法

Publications (1)

Publication Number Publication Date
CN119173752A true CN119173752A (zh) 2024-12-20

Family

ID=93152877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480002352.2A Pending CN119173752A (zh) 2023-04-19 2024-04-05 印刷线路板用基板的可靠性试验方法

Country Status (7)

Country Link
US (1) US20250283793A1 (https=)
EP (1) EP4700359A1 (https=)
JP (1) JPWO2024219249A1 (https=)
KR (1) KR20250174619A (https=)
CN (1) CN119173752A (https=)
TW (1) TW202446174A (https=)
WO (1) WO2024219249A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119437897A (zh) * 2025-01-07 2025-02-14 高邮鑫润龙印刷科技有限公司 一种印刷材料检测机构及具有该检测机构的印刷机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07325029A (ja) * 1994-05-31 1995-12-12 Nec Corp 薄膜物性評価装置
JPH07260658A (ja) * 1994-12-13 1995-10-13 Shimadzu Corp 薄膜の剥離荷重測定方法
US6339958B1 (en) * 1998-12-10 2002-01-22 Advanced Micro Devices, Inc. Adhesion strength testing using a depth-sensing indentation technique
JP3581279B2 (ja) * 1999-10-13 2004-10-27 正樹 白鳥 材料試験機
JP3819701B2 (ja) * 2000-11-10 2006-09-13 三菱樹脂株式会社 ビルドアップ多層プリント配線基板用コア基板
JP3861148B2 (ja) * 2002-11-19 2006-12-20 独立行政法人産業技術総合研究所 無機質膜の剥離力測定方法及び測定装置
JP4610275B2 (ja) 2004-09-27 2011-01-12 イビデン株式会社 多層プリント配線板
JP2012146990A (ja) * 2012-02-22 2012-08-02 Sumitomo Bakelite Co Ltd 多層回路基板、多層回路基板の製造方法および半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119437897A (zh) * 2025-01-07 2025-02-14 高邮鑫润龙印刷科技有限公司 一种印刷材料检测机构及具有该检测机构的印刷机

Also Published As

Publication number Publication date
JPWO2024219249A1 (https=) 2024-10-24
KR20250174619A (ko) 2025-12-12
US20250283793A1 (en) 2025-09-11
EP4700359A1 (en) 2026-02-25
WO2024219249A1 (ja) 2024-10-24
TW202446174A (zh) 2024-11-16

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