TW202438613A - 研磨劑、研磨方法、半導體零件之製造方法以及研磨用添加液 - Google Patents

研磨劑、研磨方法、半導體零件之製造方法以及研磨用添加液 Download PDF

Info

Publication number
TW202438613A
TW202438613A TW112147387A TW112147387A TW202438613A TW 202438613 A TW202438613 A TW 202438613A TW 112147387 A TW112147387 A TW 112147387A TW 112147387 A TW112147387 A TW 112147387A TW 202438613 A TW202438613 A TW 202438613A
Authority
TW
Taiwan
Prior art keywords
polishing
abrasive
group
water
soluble polymer
Prior art date
Application number
TW112147387A
Other languages
English (en)
Chinese (zh)
Inventor
赤時正敏
野沢靖久
竹中敦義
Original Assignee
日商Ａｇｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW202438613A publication Critical patent/TW202438613A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW112147387A 2022-12-27 2023-12-06 研磨劑、研磨方法、半導體零件之製造方法以及研磨用添加液 TW202438613A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022209603 2022-12-27
JP2022-209603 2022-12-27

Publications (1)

Publication Number Publication Date
TW202438613A true TW202438613A (zh) 2024-10-01

Family

ID=91717161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112147387A TW202438613A (zh) 2022-12-27 2023-12-06 研磨劑、研磨方法、半導體零件之製造方法以及研磨用添加液

Country Status (4)

Country Link
US (1) US20250368860A1 (https=)
JP (1) JPWO2024142722A1 (https=)
TW (1) TW202438613A (https=)
WO (1) WO2024142722A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025023040A1 (https=) * 2023-07-21 2025-01-30

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013137220A1 (ja) * 2012-03-14 2015-08-03 日立化成株式会社 研磨方法
JP2017149798A (ja) * 2016-02-22 2017-08-31 日立化成株式会社 研磨液、研磨液セット及び基体の研磨方法
KR102827839B1 (ko) * 2019-12-27 2025-06-30 도아고세이가부시키가이샤 분산제 및 연마제 조성물 (dispersant and polishing agent composition)

Also Published As

Publication number Publication date
WO2024142722A1 (ja) 2024-07-04
JPWO2024142722A1 (https=) 2024-07-04
US20250368860A1 (en) 2025-12-04

Similar Documents

Publication Publication Date Title
KR101276026B1 (ko) 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법, 및 화학 기계 연마용 수계 분산체를 제조하기 위한 키트
US8470195B2 (en) Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
KR20220051148A (ko) 연마제와 연마 방법, 및 연마용 첨가액
JP2023024484A (ja) 研磨剤と研磨方法、および研磨用添加液
JP2004349426A (ja) Ｓｔｉ用化学機械研磨方法
JP2016154208A (ja) 研磨剤、研磨方法および半導体集積回路装置の製造方法
JP4637464B2 (ja) 化学機械研磨用水系分散体
EP3400266B1 (en) Method of polishing a low-k substrate
US20250368860A1 (en) Polishing agent, polishing method, method for manufacturing semiconductor component, and additive solution for polishing agent
CN114026189B (zh) 氧化硅膜用研磨液组合物
TW201829676A (zh) 具有改善之凹陷及圖案選擇性之對氧化物及氮化物有選擇性之cmp組成物
CN113930163A (zh) 研磨剂和研磨方法
CN114316900A (zh) 研磨用组合物及其制造方法、研磨方法以及基板的制造方法
TW202411371A (zh) 研磨劑、研磨劑用添加液及研磨方法
TW202504994A (zh) 研磨劑及其製造方法、研磨劑用添加液之製造方法、研磨方法、以及半導體零件之製造方法
TW202443679A (zh) 研磨劑、研磨方法、半導體零件之製造方法及研磨劑用添加液
WO2023145572A1 (ja) 研磨剤、研磨剤用添加液および研磨方法
JP7209583B2 (ja) 酸化珪素膜用研磨液組成物
JP7727510B2 (ja) 酸化珪素膜用研磨液組成物
WO2025254017A1 (ja) 研磨剤、研磨剤用添加液、研磨方法、及び、半導体部品の製造方法
TW202613275A (zh) 研磨劑、研磨劑用添加液、研磨方法及半導體零件之製造方法
KR20230109650A (ko) 산화규소막용 연마액 조성물
JP2022085857A (ja) 酸化珪素膜用研磨液組成物
CN116507688A (zh) 氧化硅膜用研磨液组合物