TW202436504A - 成形用樹脂組成物及電子零件裝置 - Google Patents

成形用樹脂組成物及電子零件裝置 Download PDF

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Publication number
TW202436504A
TW202436504A TW112145000A TW112145000A TW202436504A TW 202436504 A TW202436504 A TW 202436504A TW 112145000 A TW112145000 A TW 112145000A TW 112145000 A TW112145000 A TW 112145000A TW 202436504 A TW202436504 A TW 202436504A
Authority
TW
Taiwan
Prior art keywords
resin composition
molding resin
epoxy
epoxy resin
mass
Prior art date
Application number
TW112145000A
Other languages
English (en)
Chinese (zh)
Inventor
田中実佳
竹内勇磨
助川雄太
岡田進太郎
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202436504A publication Critical patent/TW202436504A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112145000A 2022-11-22 2023-11-21 成形用樹脂組成物及電子零件裝置 TW202436504A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-186881 2022-11-22
JP2022186881 2022-11-22

Publications (1)

Publication Number Publication Date
TW202436504A true TW202436504A (zh) 2024-09-16

Family

ID=91195696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112145000A TW202436504A (zh) 2022-11-22 2023-11-21 成形用樹脂組成物及電子零件裝置

Country Status (5)

Country Link
JP (1) JPWO2024111575A1 (https=)
KR (1) KR20250112775A (https=)
CN (1) CN119677792A (https=)
TW (1) TW202436504A (https=)
WO (1) WO2024111575A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550923B2 (ja) * 1996-12-13 2004-08-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
JP6042054B2 (ja) 2011-05-26 2016-12-14 Dic株式会社 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6070134B2 (ja) 2012-12-07 2017-02-01 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
CN104892902B (zh) * 2014-03-03 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
KR20160088753A (ko) * 2015-01-16 2016-07-26 삼성전기주식회사 인쇄회로기판용 수지 조성물, 이를 이용한 수지 바니시, 접착 필름, 프리프레그 및 프린트 배선판
US20190225744A1 (en) * 2016-07-06 2019-07-25 Dic Corporation Active ester resin composition and cured product of same
WO2018008415A1 (ja) * 2016-07-06 2018-01-11 Dic株式会社 硬化性組成物とその硬化物
JP7415550B2 (ja) * 2019-12-25 2024-01-17 Dic株式会社 硬化性樹脂組成物、その硬化物、及び半導体封止材料
WO2022124406A1 (ja) * 2020-12-11 2022-06-16 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置
WO2023188401A1 (ja) * 2022-03-31 2023-10-05 株式会社レゾナック 成形用樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
WO2024111575A1 (ja) 2024-05-30
KR20250112775A (ko) 2025-07-24
CN119677792A (zh) 2025-03-21
JPWO2024111575A1 (https=) 2024-05-30

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