JPWO2024111575A1 - - Google Patents
Info
- Publication number
- JPWO2024111575A1 JPWO2024111575A1 JP2024560158A JP2024560158A JPWO2024111575A1 JP WO2024111575 A1 JPWO2024111575 A1 JP WO2024111575A1 JP 2024560158 A JP2024560158 A JP 2024560158A JP 2024560158 A JP2024560158 A JP 2024560158A JP WO2024111575 A1 JPWO2024111575 A1 JP WO2024111575A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022186881 | 2022-11-22 | ||
| PCT/JP2023/041787 WO2024111575A1 (ja) | 2022-11-22 | 2023-11-21 | 成形用樹脂組成物及び電子部品装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111575A1 true JPWO2024111575A1 (https=) | 2024-05-30 |
Family
ID=91195696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024560158A Pending JPWO2024111575A1 (https=) | 2022-11-22 | 2023-11-21 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024111575A1 (https=) |
| KR (1) | KR20250112775A (https=) |
| CN (1) | CN119677792A (https=) |
| TW (1) | TW202436504A (https=) |
| WO (1) | WO2024111575A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3550923B2 (ja) * | 1996-12-13 | 2004-08-04 | 日立化成工業株式会社 | 電子部品封止用エポキシ樹脂成形材料 |
| JP6042054B2 (ja) | 2011-05-26 | 2016-12-14 | Dic株式会社 | 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム |
| JP6070134B2 (ja) | 2012-12-07 | 2017-02-01 | Dic株式会社 | 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| CN104892902B (zh) * | 2014-03-03 | 2018-01-05 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
| KR20160088753A (ko) * | 2015-01-16 | 2016-07-26 | 삼성전기주식회사 | 인쇄회로기판용 수지 조성물, 이를 이용한 수지 바니시, 접착 필름, 프리프레그 및 프린트 배선판 |
| US20190225744A1 (en) * | 2016-07-06 | 2019-07-25 | Dic Corporation | Active ester resin composition and cured product of same |
| WO2018008415A1 (ja) * | 2016-07-06 | 2018-01-11 | Dic株式会社 | 硬化性組成物とその硬化物 |
| JP7415550B2 (ja) * | 2019-12-25 | 2024-01-17 | Dic株式会社 | 硬化性樹脂組成物、その硬化物、及び半導体封止材料 |
| WO2022124406A1 (ja) * | 2020-12-11 | 2022-06-16 | 昭和電工マテリアルズ株式会社 | 成形用樹脂組成物及び電子部品装置 |
| JP6870778B1 (ja) * | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | 成形用樹脂組成物及び電子部品装置 |
| WO2023188401A1 (ja) * | 2022-03-31 | 2023-10-05 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
-
2023
- 2023-11-21 KR KR1020257016844A patent/KR20250112775A/ko active Pending
- 2023-11-21 WO PCT/JP2023/041787 patent/WO2024111575A1/ja not_active Ceased
- 2023-11-21 JP JP2024560158A patent/JPWO2024111575A1/ja active Pending
- 2023-11-21 TW TW112145000A patent/TW202436504A/zh unknown
- 2023-11-21 CN CN202380037407.9A patent/CN119677792A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024111575A1 (ja) | 2024-05-30 |
| KR20250112775A (ko) | 2025-07-24 |
| CN119677792A (zh) | 2025-03-21 |
| TW202436504A (zh) | 2024-09-16 |