KR20250112775A - 성형용 수지 조성물 및 전자 부품 장치 - Google Patents

성형용 수지 조성물 및 전자 부품 장치

Info

Publication number
KR20250112775A
KR20250112775A KR1020257016844A KR20257016844A KR20250112775A KR 20250112775 A KR20250112775 A KR 20250112775A KR 1020257016844 A KR1020257016844 A KR 1020257016844A KR 20257016844 A KR20257016844 A KR 20257016844A KR 20250112775 A KR20250112775 A KR 20250112775A
Authority
KR
South Korea
Prior art keywords
resin composition
molding
epoxy resin
molding resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257016844A
Other languages
English (en)
Korean (ko)
Inventor
미카 다나카
유마 다케우치
유타 스케가와
신타로 오카다
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250112775A publication Critical patent/KR20250112775A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H01L23/295—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257016844A 2022-11-22 2023-11-21 성형용 수지 조성물 및 전자 부품 장치 Pending KR20250112775A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-186881 2022-11-22
JP2022186881 2022-11-22
PCT/JP2023/041787 WO2024111575A1 (ja) 2022-11-22 2023-11-21 成形用樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
KR20250112775A true KR20250112775A (ko) 2025-07-24

Family

ID=91195696

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257016844A Pending KR20250112775A (ko) 2022-11-22 2023-11-21 성형용 수지 조성물 및 전자 부품 장치

Country Status (5)

Country Link
JP (1) JPWO2024111575A1 (https=)
KR (1) KR20250112775A (https=)
CN (1) CN119677792A (https=)
TW (1) TW202436504A (https=)
WO (1) WO2024111575A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012246367A (ja) 2011-05-26 2012-12-13 Dic Corp 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP2014114352A (ja) 2012-12-07 2014-06-26 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550923B2 (ja) * 1996-12-13 2004-08-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
CN104892902B (zh) * 2014-03-03 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
KR20160088753A (ko) * 2015-01-16 2016-07-26 삼성전기주식회사 인쇄회로기판용 수지 조성물, 이를 이용한 수지 바니시, 접착 필름, 프리프레그 및 프린트 배선판
US20190225744A1 (en) * 2016-07-06 2019-07-25 Dic Corporation Active ester resin composition and cured product of same
WO2018008415A1 (ja) * 2016-07-06 2018-01-11 Dic株式会社 硬化性組成物とその硬化物
JP7415550B2 (ja) * 2019-12-25 2024-01-17 Dic株式会社 硬化性樹脂組成物、その硬化物、及び半導体封止材料
WO2022124406A1 (ja) * 2020-12-11 2022-06-16 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置
WO2023188401A1 (ja) * 2022-03-31 2023-10-05 株式会社レゾナック 成形用樹脂組成物及び電子部品装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012246367A (ja) 2011-05-26 2012-12-13 Dic Corp 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP2014114352A (ja) 2012-12-07 2014-06-26 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Also Published As

Publication number Publication date
WO2024111575A1 (ja) 2024-05-30
CN119677792A (zh) 2025-03-21
JPWO2024111575A1 (https=) 2024-05-30
TW202436504A (zh) 2024-09-16

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St.27 status event code: A-2-2-P10-P22-nap-X000