TW202425176A - 半導體製造裝置用部件 - Google Patents
半導體製造裝置用部件 Download PDFInfo
- Publication number
- TW202425176A TW202425176A TW112138688A TW112138688A TW202425176A TW 202425176 A TW202425176 A TW 202425176A TW 112138688 A TW112138688 A TW 112138688A TW 112138688 A TW112138688 A TW 112138688A TW 202425176 A TW202425176 A TW 202425176A
- Authority
- TW
- Taiwan
- Prior art keywords
- plug
- semiconductor manufacturing
- hole
- bonding layer
- ceramic plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2022/044764 | 2022-12-05 | ||
| PCT/JP2022/044764 WO2024121910A1 (ja) | 2022-12-05 | 2022-12-05 | 半導体製造装置用部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202425176A true TW202425176A (zh) | 2024-06-16 |
Family
ID=91280269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112138688A TW202425176A (zh) | 2022-12-05 | 2023-10-11 | 半導體製造裝置用部件 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12211729B2 (https=) |
| JP (1) | JP7560675B1 (https=) |
| KR (1) | KR102815697B1 (https=) |
| CN (1) | CN120239901A (https=) |
| TW (1) | TW202425176A (https=) |
| WO (1) | WO2024121910A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102721433B1 (ko) * | 2023-02-27 | 2024-10-25 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 적재대 |
| WO2026009597A1 (ja) * | 2024-07-03 | 2026-01-08 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2026009583A1 (ja) * | 2024-07-03 | 2026-01-08 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP2026036969A (ja) * | 2024-08-21 | 2026-03-06 | 住友大阪セメント株式会社 | 静電チャック部材、および静電チャック装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| JP6865145B2 (ja) * | 2016-12-16 | 2021-04-28 | 日本特殊陶業株式会社 | 保持装置 |
| JP2019029384A (ja) | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| JP7269759B2 (ja) | 2019-03-12 | 2023-05-09 | 新光電気工業株式会社 | 基板固定装置 |
| US20200411355A1 (en) * | 2019-06-28 | 2020-12-31 | Applied Materials, Inc. | Apparatus for reduction or prevention of arcing in a substrate support |
| JP7299805B2 (ja) * | 2019-09-09 | 2023-06-28 | 日本特殊陶業株式会社 | 保持装置 |
| JP7372271B2 (ja) * | 2021-01-06 | 2023-10-31 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
-
2022
- 2022-12-05 KR KR1020237023090A patent/KR102815697B1/ko active Active
- 2022-12-05 JP JP2023540959A patent/JP7560675B1/ja active Active
- 2022-12-05 WO PCT/JP2022/044764 patent/WO2024121910A1/ja not_active Ceased
- 2022-12-05 CN CN202280007930.2A patent/CN120239901A/zh active Pending
-
2023
- 2023-07-05 US US18/346,951 patent/US12211729B2/en active Active
- 2023-10-11 TW TW112138688A patent/TW202425176A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240086599A (ko) | 2024-06-18 |
| JPWO2024121910A1 (https=) | 2024-06-13 |
| CN120239901A (zh) | 2025-07-01 |
| JP7560675B1 (ja) | 2024-10-02 |
| US12211729B2 (en) | 2025-01-28 |
| US20240186170A1 (en) | 2024-06-06 |
| KR102815697B1 (ko) | 2025-06-04 |
| WO2024121910A1 (ja) | 2024-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW202425176A (zh) | 半導體製造裝置用部件 | |
| KR102755205B1 (ko) | 반도체 제조 장치용 부재 | |
| JP7620578B2 (ja) | 半導体製造装置用部材 | |
| CN115954310B (zh) | 半导体制造装置用部件 | |
| TWI849981B (zh) | 半導體製造裝置用構件 | |
| CN116504706A (zh) | 半导体制造装置用部件 | |
| TWI826124B (zh) | 半導體製造裝置用構件 | |
| CN116344428B (zh) | 半导体制造装置用部件 | |
| TW202403950A (zh) | 晶圓載置台 | |
| TW202435355A (zh) | 晶圓載置台 | |
| TWI875257B (zh) | 晶圓載置台 | |
| JP7503708B1 (ja) | 半導体製造装置用部材 | |
| TWI836924B (zh) | 晶圓載置台 | |
| US20260112586A1 (en) | Member for semiconductor manufacturing apparatus | |
| KR102817676B1 (ko) | 웨이퍼 배치대 | |
| KR102846887B1 (ko) | 웨이퍼 배치대 | |
| TW202516675A (zh) | 半導體製造裝置用零件 | |
| TW202606013A (zh) | 半導體製造設備用零件 | |
| WO2026009583A1 (ja) | 半導体製造装置用部材 | |
| TW202527222A (zh) | 半導體製造裝置用構件 | |
| TW202518665A (zh) | 半導體製造裝置用構件 | |
| CN120092320A (zh) | 半导体制造装置用部件 |