JP7560675B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
JP7560675B1
JP7560675B1 JP2023540959A JP2023540959A JP7560675B1 JP 7560675 B1 JP7560675 B1 JP 7560675B1 JP 2023540959 A JP2023540959 A JP 2023540959A JP 2023540959 A JP2023540959 A JP 2023540959A JP 7560675 B1 JP7560675 B1 JP 7560675B1
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JP
Japan
Prior art keywords
plug
hole
semiconductor manufacturing
manufacturing equipment
ceramic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023540959A
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English (en)
Japanese (ja)
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JPWO2024121910A1 (https=
JPWO2024121910A5 (https=
Inventor
夏樹 平田
信也 吉田
達也 久野
靖也 井上
太朗 宇佐美
憲司 米本
碧惟 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2024121910A1 publication Critical patent/JPWO2024121910A1/ja
Application granted granted Critical
Publication of JP7560675B1 publication Critical patent/JP7560675B1/ja
Publication of JPWO2024121910A5 publication Critical patent/JPWO2024121910A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2023540959A 2022-12-05 2022-12-05 半導体製造装置用部材 Active JP7560675B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/044764 WO2024121910A1 (ja) 2022-12-05 2022-12-05 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2024121910A1 JPWO2024121910A1 (https=) 2024-06-13
JP7560675B1 true JP7560675B1 (ja) 2024-10-02
JPWO2024121910A5 JPWO2024121910A5 (https=) 2024-11-06

Family

ID=91280269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540959A Active JP7560675B1 (ja) 2022-12-05 2022-12-05 半導体製造装置用部材

Country Status (6)

Country Link
US (1) US12211729B2 (https=)
JP (1) JP7560675B1 (https=)
KR (1) KR102815697B1 (https=)
CN (1) CN120239901A (https=)
TW (1) TW202425176A (https=)
WO (1) WO2024121910A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024180611A1 (ja) * 2023-02-27 2024-09-06 日本碍子株式会社 ウエハ載置台
WO2026009597A1 (ja) * 2024-07-03 2026-01-08 日本碍子株式会社 半導体製造装置用部材
WO2026009583A1 (ja) * 2024-07-03 2026-01-08 日本碍子株式会社 半導体製造装置用部材
JP2026036969A (ja) * 2024-08-21 2026-03-06 住友大阪セメント株式会社 静電チャック部材、および静電チャック装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050813A (ja) * 1996-04-26 1998-02-20 Applied Materials Inc 静電チャック面への熱伝達流体の流れのための導管
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2021044307A (ja) * 2019-09-09 2021-03-18 日本特殊陶業株式会社 保持装置
JP2022106181A (ja) * 2021-01-06 2022-07-19 日本碍子株式会社 半導体製造装置用部材及びその製法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6865145B2 (ja) * 2016-12-16 2021-04-28 日本特殊陶業株式会社 保持装置
JP2019029384A (ja) 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
JP7269759B2 (ja) 2019-03-12 2023-05-09 新光電気工業株式会社 基板固定装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050813A (ja) * 1996-04-26 1998-02-20 Applied Materials Inc 静電チャック面への熱伝達流体の流れのための導管
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2021044307A (ja) * 2019-09-09 2021-03-18 日本特殊陶業株式会社 保持装置
JP2022106181A (ja) * 2021-01-06 2022-07-19 日本碍子株式会社 半導体製造装置用部材及びその製法

Also Published As

Publication number Publication date
US20240186170A1 (en) 2024-06-06
CN120239901A (zh) 2025-07-01
TW202425176A (zh) 2024-06-16
US12211729B2 (en) 2025-01-28
JPWO2024121910A1 (https=) 2024-06-13
WO2024121910A1 (ja) 2024-06-13
KR20240086599A (ko) 2024-06-18
KR102815697B1 (ko) 2025-06-04

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