KR102815697B1 - 반도체 제조 장치용 부재 - Google Patents

반도체 제조 장치용 부재 Download PDF

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Publication number
KR102815697B1
KR102815697B1 KR1020237023090A KR20237023090A KR102815697B1 KR 102815697 B1 KR102815697 B1 KR 102815697B1 KR 1020237023090 A KR1020237023090 A KR 1020237023090A KR 20237023090 A KR20237023090 A KR 20237023090A KR 102815697 B1 KR102815697 B1 KR 102815697B1
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KR
South Korea
Prior art keywords
plug
semiconductor manufacturing
hole
ceramic plate
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237023090A
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English (en)
Korean (ko)
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KR20240086599A (ko
Inventor
나츠키 히라타
신야 요시다
다츠야 구노
세이야 이노우에
다로 우사미
겐지 요네모토
아오이 사이토
Original Assignee
엔지케이 인슐레이터 엘티디
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Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20240086599A publication Critical patent/KR20240086599A/ko
Application granted granted Critical
Publication of KR102815697B1 publication Critical patent/KR102815697B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020237023090A 2022-12-05 2022-12-05 반도체 제조 장치용 부재 Active KR102815697B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/044764 WO2024121910A1 (ja) 2022-12-05 2022-12-05 半導体製造装置用部材

Publications (2)

Publication Number Publication Date
KR20240086599A KR20240086599A (ko) 2024-06-18
KR102815697B1 true KR102815697B1 (ko) 2025-06-04

Family

ID=91280269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023090A Active KR102815697B1 (ko) 2022-12-05 2022-12-05 반도체 제조 장치용 부재

Country Status (6)

Country Link
US (1) US12211729B2 (https=)
JP (1) JP7560675B1 (https=)
KR (1) KR102815697B1 (https=)
CN (1) CN120239901A (https=)
TW (1) TW202425176A (https=)
WO (1) WO2024121910A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102721433B1 (ko) * 2023-02-27 2024-10-25 엔지케이 인슐레이터 엘티디 웨이퍼 적재대
WO2026009597A1 (ja) * 2024-07-03 2026-01-08 日本碍子株式会社 半導体製造装置用部材
WO2026009583A1 (ja) * 2024-07-03 2026-01-08 日本碍子株式会社 半導体製造装置用部材
JP2026036969A (ja) * 2024-08-21 2026-03-06 住友大阪セメント株式会社 静電チャック部材、および静電チャック装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101773A (ja) * 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
JP2019029384A (ja) 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720818A (en) * 1996-04-26 1998-02-24 Applied Materials, Inc. Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
JP7269759B2 (ja) 2019-03-12 2023-05-09 新光電気工業株式会社 基板固定装置
JP7299805B2 (ja) * 2019-09-09 2023-06-28 日本特殊陶業株式会社 保持装置
JP7372271B2 (ja) * 2021-01-06 2023-10-31 日本碍子株式会社 半導体製造装置用部材及びその製法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101773A (ja) * 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
JP2019029384A (ja) 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support

Also Published As

Publication number Publication date
KR20240086599A (ko) 2024-06-18
JPWO2024121910A1 (https=) 2024-06-13
CN120239901A (zh) 2025-07-01
JP7560675B1 (ja) 2024-10-02
US12211729B2 (en) 2025-01-28
US20240186170A1 (en) 2024-06-06
WO2024121910A1 (ja) 2024-06-13
TW202425176A (zh) 2024-06-16

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