JPWO2024121910A1 - - Google Patents
Info
- Publication number
- JPWO2024121910A1 JPWO2024121910A1 JP2023540959A JP2023540959A JPWO2024121910A1 JP WO2024121910 A1 JPWO2024121910 A1 JP WO2024121910A1 JP 2023540959 A JP2023540959 A JP 2023540959A JP 2023540959 A JP2023540959 A JP 2023540959A JP WO2024121910 A1 JPWO2024121910 A1 JP WO2024121910A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/044764 WO2024121910A1 (ja) | 2022-12-05 | 2022-12-05 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024121910A1 true JPWO2024121910A1 (https=) | 2024-06-13 |
| JP7560675B1 JP7560675B1 (ja) | 2024-10-02 |
| JPWO2024121910A5 JPWO2024121910A5 (https=) | 2024-11-06 |
Family
ID=91280269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540959A Active JP7560675B1 (ja) | 2022-12-05 | 2022-12-05 | 半導体製造装置用部材 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12211729B2 (https=) |
| JP (1) | JP7560675B1 (https=) |
| KR (1) | KR102815697B1 (https=) |
| CN (1) | CN120239901A (https=) |
| TW (1) | TW202425176A (https=) |
| WO (1) | WO2024121910A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102721433B1 (ko) * | 2023-02-27 | 2024-10-25 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 적재대 |
| WO2026009597A1 (ja) * | 2024-07-03 | 2026-01-08 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2026009583A1 (ja) * | 2024-07-03 | 2026-01-08 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP2026036969A (ja) * | 2024-08-21 | 2026-03-06 | 住友大阪セメント株式会社 | 静電チャック部材、および静電チャック装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| JP6865145B2 (ja) * | 2016-12-16 | 2021-04-28 | 日本特殊陶業株式会社 | 保持装置 |
| JP2019029384A (ja) | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| JP7269759B2 (ja) | 2019-03-12 | 2023-05-09 | 新光電気工業株式会社 | 基板固定装置 |
| US20200411355A1 (en) * | 2019-06-28 | 2020-12-31 | Applied Materials, Inc. | Apparatus for reduction or prevention of arcing in a substrate support |
| JP7299805B2 (ja) * | 2019-09-09 | 2023-06-28 | 日本特殊陶業株式会社 | 保持装置 |
| JP7372271B2 (ja) * | 2021-01-06 | 2023-10-31 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
-
2022
- 2022-12-05 KR KR1020237023090A patent/KR102815697B1/ko active Active
- 2022-12-05 JP JP2023540959A patent/JP7560675B1/ja active Active
- 2022-12-05 WO PCT/JP2022/044764 patent/WO2024121910A1/ja not_active Ceased
- 2022-12-05 CN CN202280007930.2A patent/CN120239901A/zh active Pending
-
2023
- 2023-07-05 US US18/346,951 patent/US12211729B2/en active Active
- 2023-10-11 TW TW112138688A patent/TW202425176A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240086599A (ko) | 2024-06-18 |
| CN120239901A (zh) | 2025-07-01 |
| JP7560675B1 (ja) | 2024-10-02 |
| US12211729B2 (en) | 2025-01-28 |
| US20240186170A1 (en) | 2024-06-06 |
| KR102815697B1 (ko) | 2025-06-04 |
| WO2024121910A1 (ja) | 2024-06-13 |
| TW202425176A (zh) | 2024-06-16 |
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