JPWO2024180611A1 - - Google Patents

Info

Publication number
JPWO2024180611A1
JPWO2024180611A1 JP2023553025A JP2023553025A JPWO2024180611A1 JP WO2024180611 A1 JPWO2024180611 A1 JP WO2024180611A1 JP 2023553025 A JP2023553025 A JP 2023553025A JP 2023553025 A JP2023553025 A JP 2023553025A JP WO2024180611 A1 JPWO2024180611 A1 JP WO2024180611A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023553025A
Other languages
Japanese (ja)
Other versions
JPWO2024180611A5 (https=
JP7657310B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024180611A1 publication Critical patent/JPWO2024180611A1/ja
Publication of JPWO2024180611A5 publication Critical patent/JPWO2024180611A5/ja
Application granted granted Critical
Publication of JP7657310B2 publication Critical patent/JP7657310B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023553025A 2023-02-27 2023-02-27 ウエハ載置台 Active JP7657310B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/007066 WO2024180611A1 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Publications (3)

Publication Number Publication Date
JPWO2024180611A1 true JPWO2024180611A1 (https=) 2024-09-06
JPWO2024180611A5 JPWO2024180611A5 (https=) 2025-02-04
JP7657310B2 JP7657310B2 (ja) 2025-04-04

Family

ID=92461088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023553025A Active JP7657310B2 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Country Status (6)

Country Link
US (1) US12451385B2 (https=)
JP (1) JP7657310B2 (https=)
KR (1) KR102721433B1 (https=)
CN (1) CN120677559A (https=)
TW (1) TW202435355A (https=)
WO (1) WO2024180611A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134287A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) * 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2010123712A (ja) * 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
JP2018101773A (ja) * 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
US20190267277A1 (en) * 2018-02-26 2019-08-29 Tokyo Electron Limited Plasma processing apparatus and method for manufacturing mounting stage
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
WO2020121898A1 (ja) * 2018-12-14 2020-06-18 日本発條株式会社 流路付きプレート
JP2020145280A (ja) * 2019-03-05 2020-09-10 Toto株式会社 静電チャック
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2022167481A (ja) * 2021-04-23 2022-11-04 新光電気工業株式会社 静電吸着部材及び基板固定装置
JP2023003957A (ja) * 2021-06-25 2023-01-17 東京エレクトロン株式会社 プラズマ処理装置及び基板支持部

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US11227749B2 (en) * 2016-02-18 2022-01-18 Lam Research Corporation 3D printed plasma arrestor for an electrostatic chuck
JP6767829B2 (ja) 2016-09-27 2020-10-14 日本特殊陶業株式会社 対象物載置用部材
JP7299805B2 (ja) * 2019-09-09 2023-06-28 日本特殊陶業株式会社 保持装置
JP7255659B1 (ja) * 2021-11-25 2023-04-11 住友大阪セメント株式会社 静電チャック装置
JP7560675B1 (ja) * 2022-12-05 2024-10-02 日本碍子株式会社 半導体製造装置用部材

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) * 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2010123712A (ja) * 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
JP2018101773A (ja) * 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
US20190267277A1 (en) * 2018-02-26 2019-08-29 Tokyo Electron Limited Plasma processing apparatus and method for manufacturing mounting stage
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
WO2020121898A1 (ja) * 2018-12-14 2020-06-18 日本発條株式会社 流路付きプレート
JP2020145280A (ja) * 2019-03-05 2020-09-10 Toto株式会社 静電チャック
US20200411355A1 (en) * 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2022167481A (ja) * 2021-04-23 2022-11-04 新光電気工業株式会社 静電吸着部材及び基板固定装置
JP2023003957A (ja) * 2021-06-25 2023-01-17 東京エレクトロン株式会社 プラズマ処理装置及び基板支持部

Also Published As

Publication number Publication date
US12451385B2 (en) 2025-10-21
CN120677559A (zh) 2025-09-19
KR20240134715A (ko) 2024-09-10
TW202435355A (zh) 2024-09-01
WO2024180611A1 (ja) 2024-09-06
US20240290646A1 (en) 2024-08-29
KR102721433B1 (ko) 2024-10-25
JP7657310B2 (ja) 2025-04-04

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