KR102721433B1 - 웨이퍼 적재대 - Google Patents

웨이퍼 적재대 Download PDF

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Publication number
KR102721433B1
KR102721433B1 KR1020237032591A KR20237032591A KR102721433B1 KR 102721433 B1 KR102721433 B1 KR 102721433B1 KR 1020237032591 A KR1020237032591 A KR 1020237032591A KR 20237032591 A KR20237032591 A KR 20237032591A KR 102721433 B1 KR102721433 B1 KR 102721433B1
Authority
KR
South Korea
Prior art keywords
plug
wafer loading
placement hole
joint
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237032591A
Other languages
English (en)
Korean (ko)
Other versions
KR20240134715A (ko
Inventor
마사키 이시카와
다츠야 구노
유스케 오기소
Original Assignee
엔지케이 인슐레이터 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔지케이 인슐레이터 엘티디 filed Critical 엔지케이 인슐레이터 엘티디
Publication of KR20240134715A publication Critical patent/KR20240134715A/ko
Application granted granted Critical
Publication of KR102721433B1 publication Critical patent/KR102721433B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01L21/67109—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020237032591A 2023-02-27 2023-02-27 웨이퍼 적재대 Active KR102721433B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/007066 WO2024180611A1 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Publications (2)

Publication Number Publication Date
KR20240134715A KR20240134715A (ko) 2024-09-10
KR102721433B1 true KR102721433B1 (ko) 2024-10-25

Family

ID=92461088

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237032591A Active KR102721433B1 (ko) 2023-02-27 2023-02-27 웨이퍼 적재대

Country Status (6)

Country Link
US (1) US12451385B2 (https=)
JP (1) JP7657310B2 (https=)
KR (1) KR102721433B1 (https=)
CN (1) CN120677559A (https=)
TW (1) TW202435355A (https=)
WO (1) WO2024180611A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134287A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US20170243726A1 (en) 2016-02-18 2017-08-24 Lam Research Corporation 3d printed plasma arrestor for an electrostatic chuck
JP2021044307A (ja) 2019-09-09 2021-03-18 日本特殊陶業株式会社 保持装置
JP6865145B2 (ja) 2016-12-16 2021-04-28 日本特殊陶業株式会社 保持装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP4557814B2 (ja) 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
JP5449750B2 (ja) * 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
JP6767829B2 (ja) 2016-09-27 2020-10-14 日本特殊陶業株式会社 対象物載置用部材
JP6994981B2 (ja) 2018-02-26 2022-01-14 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
KR102590641B1 (ko) * 2018-12-14 2023-10-17 닛폰 하츠죠 가부시키가이샤 유로가 형성된 플레이트
JP6729735B1 (ja) 2019-03-05 2020-07-22 Toto株式会社 静電チャック
US20200411355A1 (en) 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP7600025B2 (ja) * 2021-04-23 2024-12-16 新光電気工業株式会社 静電吸着部材及び基板固定装置
JP7645724B2 (ja) * 2021-06-25 2025-03-14 東京エレクトロン株式会社 プラズマ処理装置及び基板支持部
JP7255659B1 (ja) * 2021-11-25 2023-04-11 住友大阪セメント株式会社 静電チャック装置
JP7560675B1 (ja) * 2022-12-05 2024-10-02 日本碍子株式会社 半導体製造装置用部材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US20170243726A1 (en) 2016-02-18 2017-08-24 Lam Research Corporation 3d printed plasma arrestor for an electrostatic chuck
JP6865145B2 (ja) 2016-12-16 2021-04-28 日本特殊陶業株式会社 保持装置
JP2021044307A (ja) 2019-09-09 2021-03-18 日本特殊陶業株式会社 保持装置

Also Published As

Publication number Publication date
US12451385B2 (en) 2025-10-21
CN120677559A (zh) 2025-09-19
KR20240134715A (ko) 2024-09-10
TW202435355A (zh) 2024-09-01
WO2024180611A1 (ja) 2024-09-06
US20240290646A1 (en) 2024-08-29
JPWO2024180611A1 (https=) 2024-09-06
JP7657310B2 (ja) 2025-04-04

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