CN120677559A - 晶片载放台 - Google Patents

晶片载放台

Info

Publication number
CN120677559A
CN120677559A CN202380010192.1A CN202380010192A CN120677559A CN 120677559 A CN120677559 A CN 120677559A CN 202380010192 A CN202380010192 A CN 202380010192A CN 120677559 A CN120677559 A CN 120677559A
Authority
CN
China
Prior art keywords
plug
outer edge
hole
wafer stage
arrangement hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380010192.1A
Other languages
English (en)
Chinese (zh)
Inventor
石川征树
久野达也
小木曾裕佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN120677559A publication Critical patent/CN120677559A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380010192.1A 2023-02-27 2023-02-27 晶片载放台 Pending CN120677559A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/007066 WO2024180611A1 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Publications (1)

Publication Number Publication Date
CN120677559A true CN120677559A (zh) 2025-09-19

Family

ID=92461088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380010192.1A Pending CN120677559A (zh) 2023-02-27 2023-02-27 晶片载放台

Country Status (6)

Country Link
US (1) US12451385B2 (https=)
JP (1) JP7657310B2 (https=)
KR (1) KR102721433B1 (https=)
CN (1) CN120677559A (https=)
TW (1) TW202435355A (https=)
WO (1) WO2024180611A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134287A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP4557814B2 (ja) 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
JP5449750B2 (ja) * 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
US11227749B2 (en) * 2016-02-18 2022-01-18 Lam Research Corporation 3D printed plasma arrestor for an electrostatic chuck
JP6767829B2 (ja) 2016-09-27 2020-10-14 日本特殊陶業株式会社 対象物載置用部材
JP6865145B2 (ja) * 2016-12-16 2021-04-28 日本特殊陶業株式会社 保持装置
JP6994981B2 (ja) 2018-02-26 2022-01-14 東京エレクトロン株式会社 プラズマ処理装置及び載置台の製造方法
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
KR102590641B1 (ko) * 2018-12-14 2023-10-17 닛폰 하츠죠 가부시키가이샤 유로가 형성된 플레이트
JP6729735B1 (ja) 2019-03-05 2020-07-22 Toto株式会社 静電チャック
US20200411355A1 (en) 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP7299805B2 (ja) * 2019-09-09 2023-06-28 日本特殊陶業株式会社 保持装置
JP7600025B2 (ja) * 2021-04-23 2024-12-16 新光電気工業株式会社 静電吸着部材及び基板固定装置
JP7645724B2 (ja) * 2021-06-25 2025-03-14 東京エレクトロン株式会社 プラズマ処理装置及び基板支持部
JP7255659B1 (ja) * 2021-11-25 2023-04-11 住友大阪セメント株式会社 静電チャック装置
JP7560675B1 (ja) * 2022-12-05 2024-10-02 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
US12451385B2 (en) 2025-10-21
KR20240134715A (ko) 2024-09-10
TW202435355A (zh) 2024-09-01
WO2024180611A1 (ja) 2024-09-06
US20240290646A1 (en) 2024-08-29
KR102721433B1 (ko) 2024-10-25
JPWO2024180611A1 (https=) 2024-09-06
JP7657310B2 (ja) 2025-04-04

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