JP7657310B2 - ウエハ載置台 - Google Patents

ウエハ載置台 Download PDF

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Publication number
JP7657310B2
JP7657310B2 JP2023553025A JP2023553025A JP7657310B2 JP 7657310 B2 JP7657310 B2 JP 7657310B2 JP 2023553025 A JP2023553025 A JP 2023553025A JP 2023553025 A JP2023553025 A JP 2023553025A JP 7657310 B2 JP7657310 B2 JP 7657310B2
Authority
JP
Japan
Prior art keywords
plug
hole
outer edge
wafer mounting
ceramic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023553025A
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English (en)
Japanese (ja)
Other versions
JPWO2024180611A5 (https=
JPWO2024180611A1 (https=
Inventor
征樹 石川
達也 久野
裕佑 小木曽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2024180611A1 publication Critical patent/JPWO2024180611A1/ja
Publication of JPWO2024180611A5 publication Critical patent/JPWO2024180611A5/ja
Application granted granted Critical
Publication of JP7657310B2 publication Critical patent/JP7657310B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023553025A 2023-02-27 2023-02-27 ウエハ載置台 Active JP7657310B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/007066 WO2024180611A1 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Publications (3)

Publication Number Publication Date
JPWO2024180611A1 JPWO2024180611A1 (https=) 2024-09-06
JPWO2024180611A5 JPWO2024180611A5 (https=) 2025-02-04
JP7657310B2 true JP7657310B2 (ja) 2025-04-04

Family

ID=92461088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023553025A Active JP7657310B2 (ja) 2023-02-27 2023-02-27 ウエハ載置台

Country Status (6)

Country Link
US (1) US12451385B2 (https=)
JP (1) JP7657310B2 (https=)
KR (1) KR102721433B1 (https=)
CN (1) CN120677559A (https=)
TW (1) TW202435355A (https=)
WO (1) WO2024180611A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134287A1 (ja) * 2023-12-20 2025-06-26 日本碍子株式会社 半導体製造装置用部材

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2010123712A (ja) 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
JP2018101773A (ja) 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
US20190267277A1 (en) 2018-02-26 2019-08-29 Tokyo Electron Limited Plasma processing apparatus and method for manufacturing mounting stage
WO2020004478A1 (ja) 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
WO2020121898A1 (ja) 2018-12-14 2020-06-18 日本発條株式会社 流路付きプレート
JP2020145280A (ja) 2019-03-05 2020-09-10 Toto株式会社 静電チャック
US20200411355A1 (en) 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2022167481A (ja) 2021-04-23 2022-11-04 新光電気工業株式会社 静電吸着部材及び基板固定装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US11227749B2 (en) * 2016-02-18 2022-01-18 Lam Research Corporation 3D printed plasma arrestor for an electrostatic chuck
JP6767829B2 (ja) 2016-09-27 2020-10-14 日本特殊陶業株式会社 対象物載置用部材
JP7299805B2 (ja) * 2019-09-09 2023-06-28 日本特殊陶業株式会社 保持装置
JP7645724B2 (ja) * 2021-06-25 2025-03-14 東京エレクトロン株式会社 プラズマ処理装置及び基板支持部
JP7255659B1 (ja) * 2021-11-25 2023-04-11 住友大阪セメント株式会社 静電チャック装置
JP7560675B1 (ja) * 2022-12-05 2024-10-02 日本碍子株式会社 半導体製造装置用部材

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135969A1 (en) 1996-04-26 2002-09-26 Applied Materials, Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2010123712A (ja) 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
JP2018101773A (ja) 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
US20190267277A1 (en) 2018-02-26 2019-08-29 Tokyo Electron Limited Plasma processing apparatus and method for manufacturing mounting stage
WO2020004478A1 (ja) 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
WO2020121898A1 (ja) 2018-12-14 2020-06-18 日本発條株式会社 流路付きプレート
JP2020145280A (ja) 2019-03-05 2020-09-10 Toto株式会社 静電チャック
US20200411355A1 (en) 2019-06-28 2020-12-31 Applied Materials, Inc. Apparatus for reduction or prevention of arcing in a substrate support
JP2022167481A (ja) 2021-04-23 2022-11-04 新光電気工業株式会社 静電吸着部材及び基板固定装置

Also Published As

Publication number Publication date
US12451385B2 (en) 2025-10-21
CN120677559A (zh) 2025-09-19
KR20240134715A (ko) 2024-09-10
TW202435355A (zh) 2024-09-01
WO2024180611A1 (ja) 2024-09-06
US20240290646A1 (en) 2024-08-29
KR102721433B1 (ko) 2024-10-25
JPWO2024180611A1 (https=) 2024-09-06

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