TW202424048A - 聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜及暫時固定材組成物 - Google Patents

聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜及暫時固定材組成物 Download PDF

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Publication number
TW202424048A
TW202424048A TW112134775A TW112134775A TW202424048A TW 202424048 A TW202424048 A TW 202424048A TW 112134775 A TW112134775 A TW 112134775A TW 112134775 A TW112134775 A TW 112134775A TW 202424048 A TW202424048 A TW 202424048A
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TW
Taiwan
Prior art keywords
constituent unit
group
polyimide resin
formula
polyimide
Prior art date
Application number
TW112134775A
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English (en)
Chinese (zh)
Inventor
安孫子洋平
安福悠
米浜伸一
Original Assignee
日商三菱瓦斯化學股份有限公司
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Publication of TW202424048A publication Critical patent/TW202424048A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112134775A 2022-09-16 2023-09-13 聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜及暫時固定材組成物 TW202424048A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022148519 2022-09-16
JP2022-148519 2022-09-16

Publications (1)

Publication Number Publication Date
TW202424048A true TW202424048A (zh) 2024-06-16

Family

ID=90274905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112134775A TW202424048A (zh) 2022-09-16 2023-09-13 聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜及暫時固定材組成物

Country Status (7)

Country Link
US (1) US20260022208A1 (https=)
EP (1) EP4588955A1 (https=)
JP (1) JPWO2024058061A1 (https=)
KR (1) KR20250068637A (https=)
CN (1) CN119866354A (https=)
TW (1) TW202424048A (https=)
WO (1) WO2024058061A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026083845A1 (ja) * 2024-10-15 2026-04-23 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス、ポリイミドフィルム、及び仮固定材組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Ｊｓｒ株式会社 電子部品およびその製造方法
JP2003231753A (ja) * 2001-10-30 2003-08-19 Mitsui Chemicals Inc 新規ポリイミド、該ポリイミドからなる耐熱性接着剤、ポリイミドフィルム、接着性絶縁テープおよび金属積層体
CN101289537B (zh) * 2008-05-19 2010-09-08 东华大学 1,4-双(2,4-二氨基苯氧基)苯型自增韧性不饱和聚酰亚胺粉末的制备方法
JP2010254808A (ja) 2009-04-24 2010-11-11 Hitachi Chem Co Ltd ウエハ仮固定用耐熱性接着組成物およびフィルム
JP5523922B2 (ja) 2010-04-27 2014-06-18 東京応化工業株式会社 剥離方法及び剥離装置
CN104870595B (zh) * 2012-12-27 2017-06-23 东丽株式会社 粘合剂、粘合膜、半导体器件及其制造方法
JP2015093966A (ja) * 2013-11-13 2015-05-18 デクセリアルズ株式会社 ポリイミド、ポリイミド溶液、成型体、及び光学デバイス
CN110894294B (zh) * 2019-12-09 2021-01-08 中国科学院长春应用化学研究所 一种耐高温含氟聚酰亚胺热缩管及其制备方法

Also Published As

Publication number Publication date
EP4588955A1 (en) 2025-07-23
WO2024058061A1 (ja) 2024-03-21
JPWO2024058061A1 (https=) 2024-03-21
CN119866354A (zh) 2025-04-22
KR20250068637A (ko) 2025-05-16
US20260022208A1 (en) 2026-01-22

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