KR20250068637A - 폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 - Google Patents
폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 Download PDFInfo
- Publication number
- KR20250068637A KR20250068637A KR1020257008251A KR20257008251A KR20250068637A KR 20250068637 A KR20250068637 A KR 20250068637A KR 1020257008251 A KR1020257008251 A KR 1020257008251A KR 20257008251 A KR20257008251 A KR 20257008251A KR 20250068637 A KR20250068637 A KR 20250068637A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- structural unit
- formula
- polyimide resin
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022148519 | 2022-09-16 | ||
| JPJP-P-2022-148519 | 2022-09-16 | ||
| PCT/JP2023/032770 WO2024058061A1 (ja) | 2022-09-16 | 2023-09-08 | ポリイミド樹脂、ポリイミドワニス、ポリイミドフィルム及び仮固定材組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250068637A true KR20250068637A (ko) | 2025-05-16 |
Family
ID=90274905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257008251A Pending KR20250068637A (ko) | 2022-09-16 | 2023-09-08 | 폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20260022208A1 (https=) |
| EP (1) | EP4588955A1 (https=) |
| JP (1) | JPWO2024058061A1 (https=) |
| KR (1) | KR20250068637A (https=) |
| CN (1) | CN119866354A (https=) |
| TW (1) | TW202424048A (https=) |
| WO (1) | WO2024058061A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026083845A1 (ja) * | 2024-10-15 | 2026-04-23 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス、ポリイミドフィルム、及び仮固定材組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010254808A (ja) | 2009-04-24 | 2010-11-11 | Hitachi Chem Co Ltd | ウエハ仮固定用耐熱性接着組成物およびフィルム |
| JP2011233679A (ja) | 2010-04-27 | 2011-11-17 | Tokyo Ohka Kogyo Co Ltd | 剥離方法及び剥離装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4042201B2 (ja) * | 1998-04-15 | 2008-02-06 | Jsr株式会社 | 電子部品およびその製造方法 |
| JP2003231753A (ja) * | 2001-10-30 | 2003-08-19 | Mitsui Chemicals Inc | 新規ポリイミド、該ポリイミドからなる耐熱性接着剤、ポリイミドフィルム、接着性絶縁テープおよび金属積層体 |
| CN101289537B (zh) * | 2008-05-19 | 2010-09-08 | 东华大学 | 1,4-双(2,4-二氨基苯氧基)苯型自增韧性不饱和聚酰亚胺粉末的制备方法 |
| CN104870595B (zh) * | 2012-12-27 | 2017-06-23 | 东丽株式会社 | 粘合剂、粘合膜、半导体器件及其制造方法 |
| JP2015093966A (ja) * | 2013-11-13 | 2015-05-18 | デクセリアルズ株式会社 | ポリイミド、ポリイミド溶液、成型体、及び光学デバイス |
| CN110894294B (zh) * | 2019-12-09 | 2021-01-08 | 中国科学院长春应用化学研究所 | 一种耐高温含氟聚酰亚胺热缩管及其制备方法 |
-
2023
- 2023-09-08 CN CN202380065556.6A patent/CN119866354A/zh active Pending
- 2023-09-08 KR KR1020257008251A patent/KR20250068637A/ko active Pending
- 2023-09-08 JP JP2024546915A patent/JPWO2024058061A1/ja active Pending
- 2023-09-08 US US19/111,067 patent/US20260022208A1/en active Pending
- 2023-09-08 WO PCT/JP2023/032770 patent/WO2024058061A1/ja not_active Ceased
- 2023-09-08 EP EP23865416.4A patent/EP4588955A1/en active Pending
- 2023-09-13 TW TW112134775A patent/TW202424048A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010254808A (ja) | 2009-04-24 | 2010-11-11 | Hitachi Chem Co Ltd | ウエハ仮固定用耐熱性接着組成物およびフィルム |
| JP2011233679A (ja) | 2010-04-27 | 2011-11-17 | Tokyo Ohka Kogyo Co Ltd | 剥離方法及び剥離装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4588955A1 (en) | 2025-07-23 |
| WO2024058061A1 (ja) | 2024-03-21 |
| JPWO2024058061A1 (https=) | 2024-03-21 |
| CN119866354A (zh) | 2025-04-22 |
| TW202424048A (zh) | 2024-06-16 |
| US20260022208A1 (en) | 2026-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20250312 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application |