KR20250068637A - 폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 - Google Patents

폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 Download PDF

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KR20250068637A
KR20250068637A KR1020257008251A KR20257008251A KR20250068637A KR 20250068637 A KR20250068637 A KR 20250068637A KR 1020257008251 A KR1020257008251 A KR 1020257008251A KR 20257008251 A KR20257008251 A KR 20257008251A KR 20250068637 A KR20250068637 A KR 20250068637A
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South Korea
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group
structural unit
formula
polyimide resin
polyimide
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Pending
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KR1020257008251A
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English (en)
Korean (ko)
Inventor
요헤이 아비코
하루카 야스후쿠
신이치 요네하마
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
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Publication of KR20250068637A publication Critical patent/KR20250068637A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046Polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257008251A 2022-09-16 2023-09-08 폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물 Pending KR20250068637A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022148519 2022-09-16
JPJP-P-2022-148519 2022-09-16
PCT/JP2023/032770 WO2024058061A1 (ja) 2022-09-16 2023-09-08 ポリイミド樹脂、ポリイミドワニス、ポリイミドフィルム及び仮固定材組成物

Publications (1)

Publication Number Publication Date
KR20250068637A true KR20250068637A (ko) 2025-05-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257008251A Pending KR20250068637A (ko) 2022-09-16 2023-09-08 폴리이미드 수지, 폴리이미드 바니시, 폴리이미드 필름 및 가고정재 조성물

Country Status (7)

Country Link
US (1) US20260022208A1 (https=)
EP (1) EP4588955A1 (https=)
JP (1) JPWO2024058061A1 (https=)
KR (1) KR20250068637A (https=)
CN (1) CN119866354A (https=)
TW (1) TW202424048A (https=)
WO (1) WO2024058061A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026083845A1 (ja) * 2024-10-15 2026-04-23 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス、ポリイミドフィルム、及び仮固定材組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254808A (ja) 2009-04-24 2010-11-11 Hitachi Chem Co Ltd ウエハ仮固定用耐熱性接着組成物およびフィルム
JP2011233679A (ja) 2010-04-27 2011-11-17 Tokyo Ohka Kogyo Co Ltd 剥離方法及び剥離装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Jsr株式会社 電子部品およびその製造方法
JP2003231753A (ja) * 2001-10-30 2003-08-19 Mitsui Chemicals Inc 新規ポリイミド、該ポリイミドからなる耐熱性接着剤、ポリイミドフィルム、接着性絶縁テープおよび金属積層体
CN101289537B (zh) * 2008-05-19 2010-09-08 东华大学 1,4-双(2,4-二氨基苯氧基)苯型自增韧性不饱和聚酰亚胺粉末的制备方法
CN104870595B (zh) * 2012-12-27 2017-06-23 东丽株式会社 粘合剂、粘合膜、半导体器件及其制造方法
JP2015093966A (ja) * 2013-11-13 2015-05-18 デクセリアルズ株式会社 ポリイミド、ポリイミド溶液、成型体、及び光学デバイス
CN110894294B (zh) * 2019-12-09 2021-01-08 中国科学院长春应用化学研究所 一种耐高温含氟聚酰亚胺热缩管及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254808A (ja) 2009-04-24 2010-11-11 Hitachi Chem Co Ltd ウエハ仮固定用耐熱性接着組成物およびフィルム
JP2011233679A (ja) 2010-04-27 2011-11-17 Tokyo Ohka Kogyo Co Ltd 剥離方法及び剥離装置

Also Published As

Publication number Publication date
EP4588955A1 (en) 2025-07-23
WO2024058061A1 (ja) 2024-03-21
JPWO2024058061A1 (https=) 2024-03-21
CN119866354A (zh) 2025-04-22
TW202424048A (zh) 2024-06-16
US20260022208A1 (en) 2026-01-22

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Patent event date: 20250312

Patent event code: PA01051R01D

Comment text: International Patent Application

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