TW202417242A - 被覆基材 - Google Patents

被覆基材 Download PDF

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Publication number
TW202417242A
TW202417242A TW112129275A TW112129275A TW202417242A TW 202417242 A TW202417242 A TW 202417242A TW 112129275 A TW112129275 A TW 112129275A TW 112129275 A TW112129275 A TW 112129275A TW 202417242 A TW202417242 A TW 202417242A
Authority
TW
Taiwan
Prior art keywords
film
thickness
substrate
coated substrate
atm
Prior art date
Application number
TW112129275A
Other languages
English (en)
Chinese (zh)
Inventor
村田朋來
Original Assignee
日商日本特殊陶業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本特殊陶業股份有限公司 filed Critical 日商日本特殊陶業股份有限公司
Publication of TW202417242A publication Critical patent/TW202417242A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C25D9/12Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C25D9/10Electrolytic coating other than with metals with inorganic materials by cathodic processes on iron or steel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)
TW112129275A 2022-08-05 2023-08-04 被覆基材 TW202417242A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022125323 2022-08-05
JP2022-125323 2022-08-05
WOPCT/JP2023/026615 2023-07-20
PCT/JP2023/026615 WO2024029363A1 (ja) 2022-08-05 2023-07-20 被覆基材

Publications (1)

Publication Number Publication Date
TW202417242A true TW202417242A (zh) 2024-05-01

Family

ID=89848926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112129275A TW202417242A (zh) 2022-08-05 2023-08-04 被覆基材

Country Status (7)

Country Link
US (1) US20250327204A1 (https=)
EP (1) EP4567162A1 (https=)
JP (1) JPWO2024029363A1 (https=)
KR (1) KR20250004329A (https=)
CN (1) CN119301313A (https=)
TW (1) TW202417242A (https=)
WO (1) WO2024029363A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248103A (ja) * 1989-06-20 1990-02-16 Sumitomo Electric Ind Ltd 被覆超硬合金工具及びその製造法
JP3027502B2 (ja) * 1993-03-15 2000-04-04 健 増本 耐摩耗性非晶質硬質膜及びその製造方法
JP3865442B2 (ja) 1995-11-22 2007-01-10 のぞみフォトニクス株式会社 多層酸化物薄膜素子及びその製造方法
JP3001849B2 (ja) * 1998-03-16 2000-01-24 日立ツール株式会社 被覆硬質工具
JP2000117509A (ja) * 1998-10-14 2000-04-25 Mitsubishi Materials Corp 耐摩耗性の優れた表面被覆超硬合金製スローアウエイ切削チップ
JP2008231516A (ja) * 2007-03-20 2008-10-02 Toyota Motor Corp 金属酸化物薄膜、コンデンサ、水素分離膜−電解質膜接合体および燃料電池の製造方法
JP2009147192A (ja) 2007-12-17 2009-07-02 Fujifilm Corp 結晶性無機膜とその製造方法、半導体装置
JP5535466B2 (ja) * 2008-10-31 2014-07-02 ゼネラル・エレクトリック・カンパニイ 金属酸化物コーティング
JP2011032521A (ja) 2009-07-31 2011-02-17 Mitsubishi Materials Corp Csd溶液及び該溶液を用いたcis系膜形成方法
JP5896508B2 (ja) * 2011-04-28 2016-03-30 学校法人早稲田大学 組成物およびニッケル炭化物Ni3Cを主相とするめっき膜の製造用電気めっき液
WO2014101517A1 (zh) * 2012-12-26 2014-07-03 Wu Shanghua 一种采用物理气相沉积工艺在氮化硅切削刀具表面制备Al2O3涂层及其复合涂层的方法
JP6213173B2 (ja) 2013-11-14 2017-10-18 東ソー株式会社 チタン酸化物膜の製造方法及びチタン酸化物膜
JP7121234B2 (ja) * 2018-07-10 2022-08-18 三菱マテリアル株式会社 硬質被覆層が優れた耐チッピング性を発揮する表面切削工具

Also Published As

Publication number Publication date
JPWO2024029363A1 (https=) 2024-02-08
US20250327204A1 (en) 2025-10-23
WO2024029363A1 (ja) 2024-02-08
EP4567162A1 (en) 2025-06-11
CN119301313A (zh) 2025-01-10
KR20250004329A (ko) 2025-01-07

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