TW202416604A - Pressing mechanism, testing apparatus, and processing machine - Google Patents

Abstract

The pressing mechanism includes a pressing member and a pressure-detecting unit. The supporter of the pressing member has a cavity therein, and the cavity is injected with fluid via the fluid pipe. The pressing member is driven to move along a pressing axis by the pressure of the fluid in the cavity. The pressure-detecting unit has a detecting portion on the supporter wherein the detecting portion communicates the cavity so that the fluid pressure in the cavity can be detected by the detecting portion and compared with the determined pressure. Thus, the pressing member is ensured to press the electronic component under the predetermined pressure.

Description

Joining mechanism, testing device and operating machine

The present invention provides a bonding mechanism which can detect the actual fluid pressure of the bonding tool in real time and ensure that the bonding tool presses the electronic component with a preset lower pressure.

Nowadays, test equipment uses testers on test mechanisms to test electronic components and eliminate defective products. However, in order to ensure that the solder balls of electronic components actually contact the probes of the testers, the test equipment is equipped with a bonding mechanism on top of the test mechanism to crimp the electronic components to perform the test operation. Therefore, excessive or insufficient pressure under the bonding mechanism will affect the quality of electronic component testing.

Please refer to Figure 1. The testing mechanism is provided with a plurality of testers 11A and 11B with probes for accommodating and testing electronic components 12A and 12B. The bonding mechanism is provided with a plurality of bonding devices 14A and 14B on the moving arm 13. Each bonding device 14A and 14B is provided with a chamber 141A and 141B and a diaphragm 142A and 142B arranged therein. , multiple chambers 141A, 141B are connected to multiple gas delivery pipelines 143A, 143B. One end of each gas delivery pipeline 143A, 143B inputs gas to the chamber 141A, 141B, and the other end is commonly connected to a fluid controller 144. The fluid controller 144 is connected to a gas supply source (not shown). The diaphragms 142A, 142B of each chamber 141A, 141B are respectively connected to connectors 145A, 145B. Taking connector 14A as an example, connector 14A drives connector 145A to move in the Z direction through diaphragm 142A with the fluid pressure of chamber 141A to press the electronic component 12A of tester 11A with pressure to perform testing.

However, since the fluid controller 144 uses two gas delivery pipelines 143A and 143B to deliver gas to the chambers 141A and 141B of the connectors 14A and 14B respectively, even if the gas flow rate initially output by the fluid controller 144 is the preset value, gas loss may easily occur during the gas delivery process from the fluid controller 144 to the chambers 141A and 141B due to factors such as tube breakage or tube rupture and gas leakage, making it impossible to ensure whether the actual fluid pressure in the chambers 141A and 141B meets the preset fluid pressure, and further, it is impossible to ensure whether the connectors 145A and 145B are pressed against the electronic components with the preset downward pressure. Insufficient downward pressure will make it impossible for the contacts of the electronic components to effectively contact the probes of the tester, thereby affecting the test quality.

Furthermore, the bonding mechanism uses a single fluid controller 144 to connect multiple gas delivery pipelines 143A, 143B of multiple connectors 14A, 14B, and it is impossible to know which gas delivery pipeline has an abnormality. Not only can the test yield of electronic components not be ensured, but if multiple gas delivery pipelines are checked one by one, the operation inconvenience is increased. If the entire bonding mechanism is replaced, the cost of the mechanism is bound to increase.

The first object of the present invention is to provide a bonding mechanism, including at least one bonder and at least one cavity pressure detection unit. The at least one bonder is provided with a carrier and a bonder. The cavity inside the carrier is connected to a fluid delivery pipeline that can input fluid. The fluid pressure in the cavity can drive the bonder to move along the axial direction of the bonding to bond the electronic component. The cavity pressure detection unit is provided with at least one pressure detection part that communicates with the cavity on the carrier. The pressure detection part can allow a pressure sensor to communicate with the cavity. When the bonder is not bonded or has been bonded to the electronic component, the pressure sensor can instantly detect the actual fluid pressure in the cavity through the pressure detection part, and can quickly eliminate the abnormality to ensure that the lower pressure of the bonder is the preset lower pressure, thereby improving the test quality.

The second object of the present invention is to provide a bonding mechanism, wherein a cavity pressure detection unit is provided with a pressure detection portion communicating with the cavity on the carrier of each bonder, so that a correspondingly configured pressure sensor can independently detect the actual fluid pressure of the cavity, so that the staff can quickly know which bonder is abnormal and replace the abnormal fluid delivery pipeline alone without replacing the entire bonder, which not only ensures the test yield of electronic components and improves the convenience of operation, but also effectively saves the cost of the mechanism.

The third object of the present invention is to provide a testing device, comprising at least one testing mechanism and at least one bonding mechanism, wherein at least one testing mechanism is provided with at least one tester for testing electronic components; at least one bonding mechanism of the present invention comprises a coupler and a cavity pressure detection unit, the lower pressure of the coupler is used to press-connect the electronic components, and the cavity pressure detection unit is used to detect the actual fluid pressure of the coupler, thereby ensuring the lower pressure of the coupler.

The fourth object of the present invention is to provide an operating machine, including a machine, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device is arranged on the machine and is provided with at least one testing mechanism and at least one bonding mechanism for pressure testing the electronic component, and can detect the actual fluid pressure in real time to ensure the downward pressure; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying the electronic component; the central control device controls and integrates the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to FIG. 2 , the coupling mechanism of the present invention includes at least one coupling device and at least one cavity pressure detection unit.

At least one adapter includes a carrier and at least one adapter, and at least one chamber is provided inside the carrier, and the chamber is connected to at least one fluid delivery pipeline for inputting fluid (such as gas); further, the carrier is provided with at least one first component 211 with a chamber; according to the operation requirements, the chamber can be designed as an upper opening type or a lower opening type, which is not limited to the present embodiment; in the present embodiment, the carrier includes a first component 211 and a second component 212, and the first component 211 is provided with a lower opening type chamber 2111, and is provided with a delivery channel 2112 for transporting fluid, one end of the delivery channel 2112 is connected to the chamber 2111, and the other end is connected to a fluid delivery pipeline 22, and the fluid delivery pipeline 22 is connected to a fluid supply source (not shown in the figure), and the fluid, which can be a gas, is input into the chamber 2111 of the first component 211 through the delivery channel 2112.

As mentioned above, the coupling mechanism is provided with a fluid controller 23 for connecting at least one fluid delivery pipeline 22 ; in this embodiment, the fluid controller 23 is connected to a fluid supply source (not shown) and can control the flow rate of the fluid in a plurality of fluid delivery pipelines 22 .

The second component 212 is assembled below the first component 211, and has a chamber 2121 recessed downwardly on the top surface, and a crimping portion 2122 protruding downwardly on the bottom surface. The crimping portion 2122 has a through hole 2123 extending upward from the bottom surface to the chamber 2121, and a stepped surface 2124 is provided between the chamber 2121 and the through hole 2123.

At least one bonding tool is assembled on the carrier, and can be driven by the fluid pressure in the chamber 2111 of the carrier to move along the pressing axis A to press the electronic component under pressure; further, at least one bonding tool is provided with at least one bonding component for pressing the electronic component.

According to the operation requirements, the carrier can be equipped with a bonding tool to directly press the electronic components with a single downward pressure, or the carrier can be configured with multiple stacked bonding tools to press the electronic components with the stacked pressure. Therefore, it is not limited to this embodiment.

According to the operation requirements, the bonding tool may be provided with at least one picking portion for picking up and placing electronic components.

In this embodiment, at least one bonding tool includes a first bonding tool 241 and a second bonding tool 242. The first bonding tool 241 is disposed in the chamber 2111 of the first component 211, and contacts the gas in the chamber 2111 with the top surface, and the fluid pressure that can be the gas pressure can drive the first bonding tool 241 to move along the pressing axis A. The second jointer 242 is arranged in the chamber 2121 of the second component 212 and straddles the step surface 2124 of the second component 212. The top surface of the second jointer 242 overlaps the bottom surface of the first jointer 241. The second jointer 242 is provided with a joint component 2421 protruding downward. The joint component 2421 is inserted into the through hole 2123 of the second component 212 and is provided with a pick-up portion 2422 connected to an exhaust pipe (not shown) for taking and placing electronic components. The first jointer 241 and the second jointer 242 overlapped with each other can be synchronously displaced along the pressing axis A, so that the second jointer 242 can take and place electronic components, press the electronic components with pressure, and can float along the pressing axis A.

According to the operation requirements of different types of electronic components (such as bump-type electronic components or planar electronic components), the bonding component 2421 of the second bonding tool 242 can be located inside the through hole 2123 of the second component 212, or protrude from the through hole 2123, and both can press-connect the electronic components.

The cavity pressure detection unit is provided with at least one pressure-detecting portion communicating with the cavity on the carrier, so that the pressure sensor can sense through the pressure-detecting portion whether the actual fluid pressure in the cavity meets the preset fluid pressure in real time to ensure the pressure under the joint; further, the pressure-detecting portion can be a receiving hole communicating with the cavity to accommodate the pressure sensor, and make the sensing component of the pressure sensor relative to the cavity, or the pressure-detecting portion is a through hole communicating with the cavity, one end of the through hole communicates with the cavity, and the other end communicates with the pressure sensor located outside the carrier, and the sensing component of the pressure sensor is relative to the cavity.

According to the operation requirements, a pressure testing pipeline can be added between the pressure testing part and the pressure sensor to allow the fluid in the chamber to flow into the pressure testing pipeline so that the pressure sensor can sense the actual fluid pressure in the chamber.

In this embodiment, the cavity pressure detection unit includes a pressure detection part and a pressure sensor. The pressure detection part is arranged on the first component 211 of the carrier and is a through hole 2113. One end of the through hole 2113 is connected to the chamber 2111, and the other end is connected to the outside of the first component 211. The pressure sensor 25 has a sensing part 251 and is assembled on the side of the first component 211 with a support frame 252, and the sensing part 251 is relative to the through hole 2113. When the second coupling device 242 is in an unpressed state or a pressurized state, it is used to detect the pressure of the fluid flowing from the chamber 2111 into the through hole 2113, and whether the actual fluid pressure of the chamber 2111 meets the preset fluid pressure can be detected.

Based on the above, the carrier can be fixedly configured or movable, for example, the carrier can be mounted on a fixed frame, for example, the carrier can be mounted on a moving arm, and can be driven by the moving arm to move in at least one direction; in this embodiment, the carrier is provided with a transfer block 213 on the top surface of the first component 211, and the transfer block 213 is used to be mounted on the moving arm 26, and the moving arm 26 can drive the connector and the cavity pressure detection unit to move synchronously.

Based on the above, the bonding tool can be equipped with at least one temperature control unit (not shown) to control the temperature of the electronic components; further, the temperature control unit can be a heating element or a cooling chip, etc.

Please refer to Figures 3, 4, and 5. A test device 20 includes at least one test mechanism and at least one bonding mechanism of the present invention. The test mechanism is provided with at least one tester for testing electronic components. In this embodiment, the test mechanism is provided with a plurality of testers, each of which is provided with an electrically connected circuit board 271 and a test socket 272. The test socket 272 has a probe for holding and testing electronic components. The bonding mechanism of the present invention is provided with a plurality of adapters with a second bonding tool 242 and a plurality of cavity pressure detection units with a pressure sensor 25 on the moving arm 26. The fluid delivery pipelines 22 of the plurality of adapters are connected to the same fluid controller 23. , and use multiple pick-up parts 2422 to absorb the electronic components to be tested, and the moving arm 26 drives multiple adapters and multiple cavity pressure detection units to synchronously move to the top of the test mechanism, so that the multiple second adapters 242 and the electronic components to be tested are relative to the multiple test seats 272.

A fluid controller 23 of the bonding mechanism controls the gas to flow into the delivery channels 2112 of the plurality of adapters through the plurality of fluid delivery pipelines 22. Each delivery channel 2112 delivers the gas into the chamber 2111 of the first component 211 of the carrier. Since the fluid delivery pipeline 22 and the delivery channel 2112 may break or leak gas or lose the pipeline during the process of delivering the gas, in order to enable the staff to immediately detect whether the actual fluid pressure of the chamber 2111 of the adapter meets the preset fluid pressure, it can ensure that the second adapter 242 presses the electronic component with the preset pressure. When the delivery channel 2112 of the carrier delivers the gas to the chamber 2111 and the second adapter 242 is in an unpressed state, the cavity pressure detection unit By using part of the gas in the chamber 2111 to flow into the through hole 2113, the sensing component 251 of the pressure sensor 25 can sense the actual fluid pressure in the chamber 2111 through the through hole 2113 of the first component 211, and transmit the sensing data to a processor (not shown), which determines whether the actual fluid pressure in the chamber 2111 meets the preset fluid pressure; however, in the design that each adapter is equipped with an independent pressure sensor 25, the processor can quickly know which adapter's chamber 2111 has abnormal actual fluid pressure based on the sensing data transmitted by each pressure sensor 25, and display an abnormal signal, thereby immediately notifying the staff to stop the machine for inspection or adjust the gas volume to quickly eliminate the abnormality. , and ensure that the first connector 241 and the second connector 242 of each connector press the electronic component with a preset lower pressure.

When the actual fluid pressure in the chamber 2111 of the connector meets the preset fluid pressure, the moving arm 26 drives the first component 211, the second component 212, the first connector 241, the second connector 242, the pressure sensor 25 and the electronic component to be tested to move synchronously in the Z direction, and the electronic component to be tested is placed in the test seat 272. The fluid pressure in the chamber 2111 is used to push the first connector 241, and the first connector 241 pushes the second connector. 242 moves downward in the Z direction along the press-fit axis A, so that the joint part 2421 of the second jointer 242 presses the electronic component of the test seat 272 with a preset downward pressure. The electronic component is pushed by the reaction force of the probe of the test seat 272 and moves upward along the press-fit axis A, and the second jointer 242 and the first jointer 241 are pushed upward in the Z direction synchronously, so that the contact of the electronic component is in contact with the probe of the test seat 272 , achieving the practical benefit of improving the test quality.

According to the work requirements, in other embodiments of the bonding mechanism of the present invention, the first component of the carrier can be provided with a chamber with an upper opening, and a diaphragm is arranged inside the chamber for connecting at least one bonding tool. In addition, a sealing plate is arranged on the upper part of the chamber, and the sealing plate can be an independent panel or a panel of the moving arm, and is provided with at least one conveying channel, one end of the conveying channel is connected to the chamber, and the other end is connected to the fluid conveying pipeline for conveying fluid to the chamber, so that The diaphragm drives the jointer to move along the axial direction of the press-fitting to press-fit the electronic component; the cavity pressure detection unit is provided with a pressure detection portion as a receiving hole on the inner wall surface of the cavity of the first component for inserting the pressure sensor, so that the sensing component of the pressure sensor is relative to the cavity, so that the pressure sensor can instantly sense whether the actual fluid pressure in the cavity meets the preset fluid pressure through the pressure detection portion, so as to ensure the pressure under the jointer, thereby improving the test quality.

Please refer to Figures 2 to 6. The bonding mechanism of the present invention is applied to an electronic component processing machine, which includes a machine 30, a feeding device 40, a receiving device 50, a testing device 20, a conveying device 60 and a central control device (not shown); the feeding device 40 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 50 is mounted on the machine 30 and is provided with at least one receiving device to accommodate at least one electronic component that has been tested; the testing device 20 is disposed on the machine 30 and is provided with at least one testing mechanism and at least one bonding mechanism of the present invention, and the testing device 20 is disposed on the machine 30 and is provided with at least one testing mechanism and at least one bonding mechanism of the present invention. The test mechanism is provided with at least one tester for testing electronic components. The bonding mechanism of the present invention includes at least one bonder and at least one cavity pressure detection unit for pressing the electronic components and detecting the actual fluid pressure of the bonder. In this embodiment, the tester is provided with an electrically connected circuit board 271 and a test seat 272. The test seat 272 has a probe for testing the electronic components. The chamber 2111 of the first component 211 of the carrier has gas. The fluid pressure of the gas is used to drive the first bonding tool 241 and the second bonding tool 242 to move along the pressing axis A, so that the bonding of the second bonding tool 242 The component 2421 is pressed against the electronic component of the test seat 272 to perform the test operation. The cavity pressure detection unit uses the sensing component 251 of the pressure sensor 25 relative to the through hole 2113 to detect the pressure of the fluid flowing from the chamber 2111 into the through hole 2113 to detect whether the actual fluid pressure of the chamber 2111 meets the preset fluid pressure. The conveying device 60 is assembled on the machine 30 and is provided with at least one conveyor to convey the electronic component. In this embodiment, the first conveyor 61 of the conveying device 60 takes out the electronic component to be tested from the feeding device 40 and transfers it to the second conveyor 62. The second conveyor 62 carries the electronic component to be tested to the side of the test socket 272 of the test device, and the pick-up portion 2422 of the bonding mechanism takes out the electronic component to be tested and moves it into the test socket 272 to perform the test operation, and transfers the tested electronic component to the third conveyor 63 for unloading. The fourth conveyor 64 takes out the tested electronic component from the third conveyor 63 and transports it to the receiver of the receiving device 50 for classification and storage according to the test results. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve the practical benefit of improving the operating efficiency.

[Knowledge] 11A, 11B: Tester 12A, 12B: Electronic component 13: Moving arm 14A, 14B: Adapter 141A, 141B: Chamber 142A, 142B: Diaphragm 143A, 143B: Gas delivery pipeline 144: Fluid controller 145A, 145B: Adapter [Present invention] 20: Test device 211: First component 2111: Chamber 2112: Delivery channel 2113: Through hole 212: Second component 213: Adapter block 2121: Receptacle 2122: Pressing part 2123: Perforation 2124: Step surface 22: Fluid delivery pipeline 23: Fluid controller 241: First jointer 242: Second jointer 2421: Jointing component 2422: Pickup unit 25: Pressure sensor 251: Sensing component 252: Support frame 26: Moving arm 271: Circuit board 272: Test seat A: Press-fit axial direction 30: Machine 40: Feeding device 50: Receiving device 60: Conveying device 61: First conveyor 62: Second conveyor 63: Third conveyor 64: Fourth conveyor

Figure 1: Schematic diagram of a known test device. Figure 2: Schematic diagram of the joint mechanism of the present invention. Figure 3: Schematic diagram of the joint mechanism of the present invention applied to a test device. Figure 4: Schematic diagram of the use of the test device of the present invention. Figure 5: Schematic diagram of the use of the joint mechanism of the present invention. Figure 6: Schematic diagram of the test device of the present invention applied to a working machine.

20:Testing equipment

211: First part

2111: Chamber

2112:Transport channel

2113:Through hole

22: Fluid delivery pipeline

23: Fluid controller

241: First jointer

242: Second jointer

25: Pressure sensor

26: Mobile arm

272: Test seat

Claims (10)

A bonding mechanism includes: At least one bonding device: provided with a carrier and at least one bonding tool, the carrier is provided with at least one chamber inside, the chamber is connected to a fluid delivery pipeline for inputting fluid, the actual fluid pressure of the chamber can drive the bonding tool to displace along the axial direction of the bonding and press the electronic component with the lower pressure; At least one cavity pressure detection unit: at least one pressure detection part connected to the cavity is provided on the carrier, so that the pressure sensor can sense whether the actual fluid pressure in the cavity meets the preset fluid pressure through the pressure detection part in real time to ensure the lower pressure of the bonding tool. In the bonding mechanism as described in claim 1, the carrier is provided with at least one first component having the chamber for assembling at least one bonding tool. The bonding mechanism as described in claim 2, wherein the carrier is provided with the first component and the second component, the first component has the chamber, the chamber is connected to the fluid delivery pipeline, the second component is assembled below the first component and has a containing chamber inside, at least one bonding tool includes a first bonding tool and a second bonding tool, the first bonding tool is arranged in the chamber, and can be driven by the actual fluid pressure to move along the axial direction of the crimping, the second bonding tool is arranged in the containing chamber, and is overlapped below the first bonding tool for crimping electronic components. In the bonding mechanism as described in claim 1, the chamber of the carrier is equipped with a diaphragm, and the diaphragm is connected to the bonding tool. In the coupling mechanism described in claim 1, the pressure detection portion of the cavity pressure detection unit is a through hole connected to the cavity, one end of the through hole is connected to the cavity, and the other end is connected to the pressure sensor located outside the carrier. In the coupling mechanism described in claim 5, a pressure-testing pipeline is provided between the pressure-testing portion and the pressure sensor. As described in claim 1, the pressure detection portion of the cavity pressure detection unit is a receiving hole connected to the cavity for accommodating the pressure sensor. The coupling mechanism as described in claim 1 further includes a fluid controller for connecting at least one of the fluid delivery pipelines. A testing device, comprising: At least one testing mechanism: provided with at least one tester for testing electronic components; At least one bonding mechanism as described in any one of claims 1 to 8: for a bonding device to press the electronic component of the tester with a lower pressure, and to detect the actual fluid pressure of the bonding device to ensure the lower pressure of the bonding device. A work machine, comprising: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one tested electronic component; at least one test device as described in claim 9: arranged on the machine; a conveying device: arranged on the machine and provided with at least one conveyor for conveying electronic components; a central control device: for controlling and integrating the actions of various devices to perform automated operations.