TW202129290A - Press testing mechanism, testing apparatus and testing method - Google Patents

Press testing mechanism, testing apparatus and testing method Download PDF

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Publication number
TW202129290A
TW202129290A TW109102437A TW109102437A TW202129290A TW 202129290 A TW202129290 A TW 202129290A TW 109102437 A TW109102437 A TW 109102437A TW 109102437 A TW109102437 A TW 109102437A TW 202129290 A TW202129290 A TW 202129290A
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Taiwan
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pressure
test
adapter
pressure device
suction jig
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TW109102437A
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Chinese (zh)
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TWI733318B (en
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李仕瀚
謝榮林
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台灣福雷電子股份有限公司
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Priority to TW109102437A priority Critical patent/TWI733318B/en
Priority to CN202110079527.8A priority patent/CN113238133A/en
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Publication of TW202129290A publication Critical patent/TW202129290A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A press testing mechanism includes a pressure device, a chuck, an adapter, at least a support structure and a force sensor. The chuck is spaced apart from the pressure device. The adapter is disposed between the pressure device and the chuck. The support structure connects the pressure device and the chuck. The force sensor is disposed between the adapter and the pressure device.

Description

壓測機構、測試設備及測試方法Pressure testing mechanism, testing equipment and testing method

本發明是有關於壓測機構、測試設備及測試方法,且更具體言之,是有關於電性測試之壓測機構、測試設備及測試方法。The present invention relates to a pressure testing mechanism, testing equipment and testing method, and more specifically, to a pressure testing mechanism, testing equipment and testing method for electrical testing.

現行半導體晶片或半導體封裝結構的壓測方式主要是先透過吸取頭將半導體晶片或半導體封裝結構吸取至測試板的測試座上,接著調整浮動氣囊給予半導體晶片或半導體封裝結構施加壓力,以使半導體晶片或半導體封裝結構頂抵於測試板上對應的探針進行電性測試。然而,浮動氣囊所施加之壓力並不等於半導體晶片或半導體封裝結構實際承受的壓力,因此,當半導體晶片或半導體封裝結構經壓測後有損傷時,無法確定其是否因壓測之壓力過大而受損。The current pressure testing method for semiconductor wafers or semiconductor packaging structures is mainly to first suck the semiconductor wafer or semiconductor packaging structure onto the test seat of the test board through the picking head, and then adjust the floating air bag to apply pressure to the semiconductor wafer or semiconductor packaging structure to make the semiconductor The chip or semiconductor package structure is pressed against the corresponding probe on the test board for electrical testing. However, the pressure exerted by the floating airbag is not equal to the actual pressure of the semiconductor chip or semiconductor package structure. Therefore, when the semiconductor chip or semiconductor package structure is damaged after pressure testing, it is impossible to determine whether it is caused by excessive pressure testing. Damaged.

在一實施例中,一種壓測機構包括一壓力裝置、一吸取治具、一轉接件、至少一支撐結構及一壓感器。所述吸取治具與所述壓力裝置間隔設置。所述轉接件設置於所述壓力裝置與所述吸取治具之間。所述支撐結構連接所述壓力裝置與所述吸取治具。所述壓感器設置於所述轉接件與所述壓力裝置之間。In one embodiment, a pressure measuring mechanism includes a pressure device, a suction jig, an adapter, at least one supporting structure, and a pressure sensor. The suction jig is spaced apart from the pressure device. The adapter is arranged between the pressure device and the suction jig. The supporting structure connects the pressure device and the suction jig. The pressure sensor is arranged between the adapter and the pressure device.

在一實施例中,一種測試設備包括一分料裝置、一壓測機構、一測試電路板及至少一測試座。所述壓測機構裝設於所述分料裝置。所述壓測機構包括一壓力裝置、一吸取治具、一轉接件、至少一支撐結構及一壓感器。所述壓力裝置連接所述分料裝置。所述吸取治具與所述壓力裝置間隔設置。所述轉接件設置於所述壓力裝置與所述吸取治具之間。所述支撐結構連接所述壓力裝置與所述吸取治具。所述壓感器設置於所述轉接件與所述壓力裝置之間。所述測試電路板對應所述壓測機構,用以測試一待測物。所述測試座設置於所述測試電路板上,用以容置所述待測物,且所述測試座對應所述壓測機構之所述吸取治具。In one embodiment, a test equipment includes a material distributing device, a pressure test mechanism, a test circuit board, and at least one test seat. The pressure measuring mechanism is installed in the material distributing device. The pressure measurement mechanism includes a pressure device, a suction jig, an adapter, at least one supporting structure and a pressure sensor. The pressure device is connected to the material distributing device. The suction jig is spaced apart from the pressure device. The adapter is arranged between the pressure device and the suction jig. The supporting structure connects the pressure device and the suction jig. The pressure sensor is arranged between the adapter and the pressure device. The test circuit board corresponds to the pressure test mechanism and is used to test an object under test. The test seat is arranged on the test circuit board for accommodating the object to be tested, and the test seat corresponds to the suction jig of the pressure test mechanism.

在一實施例中,一種測試方法包括:提供一壓測機構、一測試電路板及至少一測試座,所述壓測機構包括一壓力裝置、一吸取治具、一轉接件及一壓感器,所述吸取治具與所述壓力裝置間隔設置,所述轉接件設置於所述壓力裝置與所述吸取治具之間,所述壓感器設置於所述轉接件與所述壓力裝置之間,所述測試電路板對應所述壓測機構,所述測試座設置於所述測試電路板上,且所述測試座對應所述壓測機構之所述吸取治具;以所述吸取治具吸取一待測物至所述測試座內;及利用一馬達將所述壓力裝置、所述轉接件及所述吸取治具向下移動,以施加一壓力於所述壓感器及所述待測物上,並使所述待測物接觸所述測試電路板之複數個量測探針,及藉由所述壓感器測得施加於所述待測物上之壓力值。In one embodiment, a test method includes: providing a pressure test mechanism, a test circuit board, and at least one test seat, the pressure test mechanism including a pressure device, a suction jig, an adapter, and a pressure sensor The suction jig and the pressure device are arranged at intervals, the adapter is arranged between the pressure device and the suction jig, and the pressure sensor is arranged between the adapter and the pressure device. Between the pressure devices, the test circuit board corresponds to the pressure test mechanism, the test seat is disposed on the test circuit board, and the test seat corresponds to the suction jig of the pressure test mechanism; The suction jig sucks an object to be tested into the test seat; and a motor is used to move the pressure device, the adapter and the suction jig downward to apply a pressure on the pressure sensor On the device and the object under test, and make the object under test contact a plurality of measuring probes of the test circuit board, and the pressure applied to the object under test is measured by the pressure sensor value.

貫穿圖式及實施方式使用共同參考編號以指示相同或相似組件。自結合附圖的以下詳細描述將更容易理解本發明之實施例。Common reference numbers are used throughout the drawings and embodiments to indicate the same or similar components. It will be easier to understand the embodiments of the present invention from the following detailed description in conjunction with the accompanying drawings.

以下揭示內容提供用於實施所提供主題之不同特徵的許多不同實施例或實例。在下文描述組件及配置之特定實例以闡明本發明之特定態樣。當然,此等組件、值、操作、材料及配置僅為實例且不意欲為限制性的。舉例而言,在本文中所提供之描述中,第一特徵在第二特徵上方或上的形成可包括第一特徵以及第二特徵直接接觸地形成或安置的實施例,且亦可包括額外特徵可在第一特徵與第二特徵之間形成或安置使得第一特徵與第二特徵可不直接接觸的實施例。另外,本發明可在本文中所提供之各種實例中重複參考數字及/或字母。此重複係出於簡化及清楚之目的,且本身並不指示所論述各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to clarify specific aspects of the invention. Of course, these components, values, operations, materials, and configurations are only examples and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature on or on the second feature may include an embodiment in which the first feature and the second feature are formed or arranged in direct contact, and may also include additional features An embodiment may be formed or disposed between the first feature and the second feature so that the first feature and the second feature may not directly contact. In addition, the present invention may repeat reference numbers and/or letters in various examples provided herein. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

圖1顯示本發明之一實施例之壓測機構1之立體分解圖。圖2顯示本發明之一實施例之壓測機構1於不同視角(與圖1相反之視角)之立體分解圖。圖3顯示圖1之組合圖。圖4顯示圖3之俯視圖。配合參閱圖1至圖4,本發明之壓測機構1包括一壓力裝置10、一吸取治具20、一轉接件30、至少一支撐結構40、一壓感器50及一密封件60。Fig. 1 shows a three-dimensional exploded view of a pressure measuring mechanism 1 according to an embodiment of the present invention. FIG. 2 shows a three-dimensional exploded view of the pressure measuring mechanism 1 of an embodiment of the present invention in different viewing angles (the viewing angle opposite to FIG. 1 ). Figure 3 shows the combined diagram of Figure 1. Fig. 4 shows the top view of Fig. 3. With reference to FIGS. 1 to 4, the pressure measuring mechanism 1 of the present invention includes a pressure device 10, a suction jig 20, an adapter 30, at least one supporting structure 40, a pressure sensor 50 and a sealing member 60.

所述壓力裝置10包括一第一座體11、一第二座體12、一氣壓件13、一移動件14及一結合座15。所述第一座體11具有一氣壓孔115,所述氣壓孔115貫穿所述第一座體11,且所述氣壓孔115係可連接一氣壓源,以供一氣壓輸入。所述第二座體12結合於所述第一座體11。在一實施例中,所述第二座體12係可藉由螺絲或螺栓固定於所述第一座體11。The pressure device 10 includes a first seat body 11, a second seat body 12, a pneumatic member 13, a moving member 14 and a coupling seat 15. The first base body 11 has an air pressure hole 115, the air pressure hole 115 penetrates the first base body 11, and the air pressure hole 115 can be connected to an air pressure source for an air pressure input. The second seat body 12 is combined with the first seat body 11. In one embodiment, the second base body 12 can be fixed to the first base body 11 by screws or bolts.

所述氣壓件13設置於所述第一座體11與所述第二座體12之間。在一實施例中,所述第一座體11之所述氣壓孔115係對應所述氣壓件13,以使經由所述氣壓孔115輸入之氣壓能直接推動所述氣壓件13。在一實施例中,所述氣壓件13係可為彈性片(例如:矽膠彈性片或橡膠彈性片),因此,所述氣壓件13(即彈性片)受氣壓推動時能產生向下彎曲之動作。亦即,所述氣壓件13(即彈性片)之中間部位受氣壓推動時會鼓起,而形成弧狀突起。The air pressure member 13 is disposed between the first seat body 11 and the second seat body 12. In one embodiment, the air pressure hole 115 of the first seat 11 corresponds to the air pressure member 13 so that the air pressure input through the air pressure hole 115 can directly push the air pressure member 13. In one embodiment, the air pressure member 13 may be an elastic sheet (for example, a silicone elastic sheet or a rubber elastic sheet). Therefore, the air pressure member 13 (ie, elastic sheet) can be bent downward when pushed by air pressure. action. That is, the middle part of the air pressure member 13 (ie, the elastic sheet) will bulge when pushed by air pressure to form an arc-shaped protrusion.

所述移動件14連接所述第二座體12,且所述移動件14對應所述氣壓件13。在一實施例中,所述移動件14貫穿所述第二座體12,且所述移動件14之一端(或一表面)係可抵接所述氣壓件13,以使所述氣壓件13受氣壓推動時,能同步推動所述移動件14。舉例而言,當所述氣壓件13之中間部位受氣壓推動而鼓起時,該所述氣壓件13之中間部位能頂抵所述移動件14之中間部位,而推動所述移動件14。The moving part 14 is connected to the second base 12, and the moving part 14 corresponds to the air pressure part 13. In one embodiment, the moving member 14 penetrates the second base 12, and one end (or a surface) of the moving member 14 can abut the air pressure member 13, so that the air pressure member 13 When pushed by air pressure, the moving part 14 can be pushed synchronously. For example, when the middle part of the air pressure member 13 is pushed by air pressure to bulge, the middle part of the air pressure member 13 can abut against the middle part of the moving part 14 to push the moving part 14.

所述結合座15連接所述移動件14。在一實施例中,所述結合座15具有一第一表面151、一第二表面152及複數個容置槽153。所述第一表面151朝向所述第二座體12。所述第二表面152相對於所述第一表面151。所述容置槽153凹設於所述第二表面152。The coupling base 15 is connected to the moving part 14. In one embodiment, the coupling base 15 has a first surface 151, a second surface 152 and a plurality of accommodating grooves 153. The first surface 151 faces the second seat body 12. The second surface 152 is opposite to the first surface 151. The receiving groove 153 is recessed on the second surface 152.

所述吸取治具20與所述壓力裝置10間隔設置,用以吸取一待測物。在一實施例中,所述吸取治具20具有一表面21、一抽氣孔23及一環槽25。所述表面21朝向所述壓力裝置10。所述抽氣孔23貫穿所述吸取治具20,且所述抽氣孔23具有一第一開口231及一第二開口232。所述第一開口231顯露於所述表面21。所述第二開口232相對於所述第一開口231。所述環槽25凹設於所述表面21,且所述環槽25圍繞所述抽氣孔23之所述第一開口231。The suction jig 20 and the pressure device 10 are spaced apart to suck an object to be tested. In one embodiment, the suction jig 20 has a surface 21, a suction hole 23 and a ring groove 25. The surface 21 faces the pressure device 10. The suction hole 23 penetrates the suction jig 20, and the suction hole 23 has a first opening 231 and a second opening 232. The first opening 231 is exposed on the surface 21. The second opening 232 is opposite to the first opening 231. The ring groove 25 is recessed on the surface 21, and the ring groove 25 surrounds the first opening 231 of the suction hole 23.

所述轉接件30設置於所述壓力裝置10與所述吸取治具20之間,用以連接所述壓力裝置10與所述吸取治具20,且所述轉接件30係可連接不同尺寸或不同規格之所述吸取治具20。在一實施例中,所述轉接件30具有一第一表面31、一第二表面32、一側面33、一容置槽34及一抽氣通道37。所述第一表面31朝向所述壓力裝置10(例如:所述結合座15之所述第二表面152)。所述第二表面32相對於所述第一表面31。所述側面33延伸於所述第一表面31與所述第二表面32之間。所述容置槽34凹設於所述第一表面31,且所述容置槽34內具有一底面35。所述容置槽34係為一盲孔,其並未貫穿所述轉接件30。The adapter 30 is arranged between the pressure device 10 and the suction jig 20 to connect the pressure device 10 and the suction jig 20, and the adapter 30 can be connected to different The suction jig 20 of different sizes or specifications. In one embodiment, the adapter 30 has a first surface 31, a second surface 32, a side surface 33, a receiving groove 34 and an air suction channel 37. The first surface 31 faces the pressure device 10 (for example, the second surface 152 of the coupling base 15). The second surface 32 is opposite to the first surface 31. The side surface 33 extends between the first surface 31 and the second surface 32. The accommodating groove 34 is recessed on the first surface 31, and the accommodating groove 34 has a bottom surface 35 therein. The accommodating groove 34 is a blind hole, which does not penetrate the adapter 30.

所述抽氣通道37連通所述第二表面32及所述側面33,且所述抽氣通道37具有一第一通道口371及一第二通道口372。所述第一通道口371對應所述吸取治具20之所述抽氣孔23(例如:所述第一開口231)。所述第二通道口372顯露於所述側面33。在一實施例中,所述抽氣通道37之所述第二通道口372係可連接一抽氣裝置,以使所述抽氣裝置所產生之真空吸力能經由所述抽氣通道37及所述吸取治具20之所述抽氣孔23作用於所述待測物上。在一實施例中,所述結合座15係可設置於所述第二座體12與所述轉接件30之間。The suction passage 37 communicates with the second surface 32 and the side surface 33, and the suction passage 37 has a first passage opening 371 and a second passage opening 372. The first passage opening 371 corresponds to the suction hole 23 of the suction jig 20 (for example, the first opening 231). The second passage opening 372 is exposed on the side surface 33. In one embodiment, the second passage opening 372 of the suction channel 37 can be connected to a suction device so that the vacuum suction force generated by the suction device can pass through the suction channel 37 and the suction device. The suction hole 23 of the suction jig 20 acts on the object to be tested. In an embodiment, the coupling seat 15 may be disposed between the second seat body 12 and the adapter 30.

圖5顯示本發明之一實施例之支撐結構40之立體示意圖。配合參閱圖1、圖4及圖5,所述至少一支撐結構40連接所述壓力裝置10與所述吸取治具20,且所述至少一支撐結構40貫穿所述轉接件30。在一實施例中,所述至少一支撐結構40包括一支撐套筒41及一連接件42。所述支撐套筒41貫穿所述轉接件30,以使所述轉接件30可沿著所述支撐套筒41上下移動。所述連接件42(例如:螺絲)貫穿所述吸取治具20及所述支撐套筒41,且所述連接件42之一端421連接所述壓力裝置10之所述結合座15,以將所述轉接件30限位於所述壓力裝置10與所述吸取治具20之間。由於所述轉接件30可沿著所述支撐套筒41上下移動,因此,可進一步消除所述連接件42(例如:螺絲)的鬆緊度問題。FIG. 5 shows a three-dimensional schematic diagram of a supporting structure 40 according to an embodiment of the present invention. Referring to FIGS. 1, 4 and 5 for cooperation, the at least one supporting structure 40 connects the pressure device 10 and the suction jig 20, and the at least one supporting structure 40 penetrates the adapter 30. In one embodiment, the at least one supporting structure 40 includes a supporting sleeve 41 and a connecting member 42. The supporting sleeve 41 penetrates the adapter 30 so that the adapter 30 can move up and down along the supporting sleeve 41. The connecting member 42 (for example, a screw) penetrates the suction jig 20 and the supporting sleeve 41, and one end 421 of the connecting member 42 is connected to the coupling seat 15 of the pressure device 10, so as to The adapter 30 is limited between the pressure device 10 and the suction jig 20. Since the adapter 30 can move up and down along the support sleeve 41, the tightness problem of the connecting member 42 (for example, a screw) can be further eliminated.

再參閱圖1、圖2及圖4,所述壓感器50設置於所述轉接件30與所述壓力裝置10之間。在一實施例中,所述壓感器50係可設置於所述轉接件30之所述容置槽34。此外,所述壓感器50具有一感測凸部52,所述感測凸部52朝向所述壓力裝置10(例如:所述結合座15),且經由按壓所述感測凸部52可測得一壓力值。在一實施例中,所述壓感器50係可為荷重元(Load cell)。Referring again to FIGS. 1, 2 and 4, the pressure sensor 50 is disposed between the adapter 30 and the pressure device 10. In one embodiment, the pressure sensor 50 may be disposed in the receiving groove 34 of the adapter 30. In addition, the pressure sensor 50 has a sensing protrusion 52, which faces the pressure device 10 (for example, the coupling base 15), and can be pressed by pressing the sensing protrusion 52. A pressure value is measured. In one embodiment, the pressure sensor 50 may be a load cell.

所述密封件60設置於所述吸取治具20與所述轉接件30之間,用以維持所述吸取治具20之所述抽氣孔23與所述轉接件30之所述抽氣通道37之間的真空度。在一實施例中,所述密封件60係可設置於所述吸取治具20之所述環槽25,且所述密封件60環繞所述吸取治具20之所述抽氣孔23(例如:所述第一開口231)。在一實施例中,所述密封件60係可為海綿密封環或塑膠密封環。The sealing member 60 is disposed between the suction jig 20 and the adapter 30 to maintain the air suction hole 23 of the suction jig 20 and the adapter 30 The degree of vacuum between channels 37. In one embodiment, the sealing member 60 can be disposed in the ring groove 25 of the suction jig 20, and the sealing member 60 surrounds the air suction hole 23 of the suction jig 20 (for example: The first opening 231). In one embodiment, the sealing member 60 can be a sponge sealing ring or a plastic sealing ring.

本發明於所述壓測機構1中設置所述壓感器50,可在壓測過程中即時測得施加於待測物上之壓力值,進而避免因壓測之壓力過大而造成待測物受損。且若待測物經壓測後有損傷,亦可判斷出待測物之受損原因是壓測之壓力過大造成還是待測物之自身因素造成。In the present invention, the pressure sensor 50 is installed in the pressure measurement mechanism 1, which can measure the pressure value applied to the object under test in real time during the pressure measurement process, thereby avoiding the object under test due to excessive pressure of the pressure measurement. Damaged. And if the object under test is damaged after the pressure test, it can also be judged whether the damage of the object under test is caused by the excessive pressure of the pressure test or caused by the object's own factors.

圖6顯示本發明之一實施例之壓測機構1a之立體分解圖。圖6之壓測機構1a與圖1至圖5之壓測機構1大致相同,其不同處在於圖6之壓測機構1a更包括一緩衝件70。如圖6所示,所述緩衝件70設置於所述壓感器50與所述壓力裝置10之間,且所述壓感器50之所述感測凸部52抵接所述緩衝件70。在一實施例中,所述緩衝件70之至少一部份設置於所述轉接件30之所述容置槽34內。所述緩衝件70係可避免所述壓力裝置10(例如:所述結合座15)直接壓觸所述壓感器50之所述感測凸部52,造成所述感測凸部52之磨損。Fig. 6 shows a three-dimensional exploded view of a pressure measuring mechanism 1a according to an embodiment of the present invention. The pressure measurement mechanism 1a of FIG. 6 is substantially the same as the pressure measurement mechanism 1 of FIGS. 1 to 5, and the difference is that the pressure measurement mechanism 1a of FIG. As shown in FIG. 6, the buffer member 70 is disposed between the pressure sensor 50 and the pressure device 10, and the sensing protrusion 52 of the pressure sensor 50 abuts the buffer member 70 . In one embodiment, at least a part of the buffer member 70 is disposed in the accommodating groove 34 of the adapter member 30. The buffer member 70 can prevent the pressure device 10 (for example: the coupling seat 15) from directly pressing against the sensing protrusion 52 of the pressure sensor 50, causing wear of the sensing protrusion 52 .

圖7顯示本發明之一實施例之壓測機構1b之立體分解圖。圖7之壓測機構1b與圖6之壓測機構1a大致相同,其不同處僅在於圖7之壓感器50a的配置。如圖7所示,所述壓感器50a之所述感測凸部52係位於所述轉接件30之所述容置槽34內,且所述感測凸部52抵接所述容置槽34內之所述底面35。FIG. 7 shows a three-dimensional exploded view of a pressure measuring mechanism 1b according to an embodiment of the present invention. The pressure measuring mechanism 1b of FIG. 7 is substantially the same as the pressure measuring mechanism 1a of FIG. 6, and the difference lies in the configuration of the pressure sensor 50a of FIG. As shown in FIG. 7, the sensing protrusion 52 of the pressure sensor 50a is located in the accommodating groove 34 of the adapter 30, and the sensing protrusion 52 abuts against the container. The bottom surface 35 in the slot 34 is placed.

圖8顯示本發明之一實施例之壓測機構1c之立體分解圖。圖8之壓測機構1c與圖1至圖5之壓測機構1大致相同,其不同處在於圖8之轉接件30a省略容置槽34。如圖8所示,所述轉接件30a具有一凸出部36,所述凸出部36凸設於所述第一表面31。而所述壓感器50c係設置於所述轉接件30a之所述凸出部36與所述壓力裝置10(例如:所述結合座15)之間。在一實施例中,所述壓感器50c係可貼設於所述轉接件30a之所述凸出部36上,且所述壓感器50c係可為薄膜型壓力感測器(Thin film pressure sensor)。Fig. 8 shows a three-dimensional exploded view of a pressure measuring mechanism 1c according to an embodiment of the present invention. The pressure measuring mechanism 1c of FIG. 8 is substantially the same as the pressure measuring mechanism 1 of FIGS. 1 to 5, except that the adaptor 30a of FIG. As shown in FIG. 8, the adapter 30 a has a protruding portion 36, and the protruding portion 36 protrudes from the first surface 31. The pressure sensor 50c is disposed between the protruding portion 36 of the adapter 30a and the pressure device 10 (for example, the coupling seat 15). In one embodiment, the pressure sensor 50c can be attached to the protruding portion 36 of the adapter 30a, and the pressure sensor 50c can be a thin film pressure sensor (Thin film pressure sensor).

圖9顯示本發明之一實施例之測試設備9之示意圖。圖10顯示本發明之一實施例之測試電路板4、測試座5及待測物8之配置俯視圖。配合參閱圖9及圖10,本發明之測試設備9包括一分料裝置2、一壓測機構(例如:壓測機構1)、一測試機3、一測試電路板4及至少一測試座5。Fig. 9 shows a schematic diagram of a testing device 9 according to an embodiment of the present invention. FIG. 10 shows a top view of the arrangement of the test circuit board 4, the test socket 5, and the object under test 8 according to an embodiment of the present invention. With reference to Figures 9 and 10, the testing equipment 9 of the present invention includes a distributing device 2, a pressure measuring mechanism (for example: pressure measuring mechanism 1), a testing machine 3, a testing circuit board 4, and at least one testing seat 5 .

所述壓測機構(例如:壓測機構1)裝設於所述分料裝置2。所述壓測機構係可為圖1至圖4之壓測機構1、圖6之壓測機構1a、圖7之壓測機構1b或圖8之壓測機構1c。如圖9所示,所述壓測機構1之所述壓力裝置10係連接所述分料裝置2之一馬達6。The pressure measuring mechanism (for example, the pressure measuring mechanism 1) is installed in the material distributing device 2. The pressure measuring mechanism may be the pressure measuring mechanism 1 to FIG. 4, the pressure measuring mechanism 1a of FIG. 6, the pressure measuring mechanism 1b of FIG. 7, or the pressure measuring mechanism 1c of FIG. As shown in FIG. 9, the pressure device 10 of the pressure measuring mechanism 1 is connected to a motor 6 of the distributing device 2.

再參閱圖9及圖10,所述測試機3對應所述分料裝置2之所述馬達6。在一實施例中,所述測試機3係設置於所述馬達6之下方。所述測試機3係可設定及調整針對一待測物8(例如:半導體晶片或半導體封裝結構)之測試條件。9 and 10 again, the testing machine 3 corresponds to the motor 6 of the distributing device 2. In one embodiment, the testing machine 3 is arranged under the motor 6. The test machine 3 can set and adjust the test conditions for a test object 8 (for example, a semiconductor chip or a semiconductor package structure).

所述測試電路板4設置於所述測試機3上,且電性連接所述測試機3。此外,所述測試電路板4對應所述壓測機構1,用以測試所述待測物8。在一實施例中,所述測試電路板4係具有複數個量測探針7,用以測試所述待測物8。The test circuit board 4 is disposed on the test machine 3 and is electrically connected to the test machine 3. In addition, the test circuit board 4 corresponds to the pressure test mechanism 1 for testing the object 8 under test. In one embodiment, the test circuit board 4 has a plurality of measurement probes 7 for testing the object 8 under test.

所述至少一測試座5設置於所述測試電路板4上,用以容置及定位所述待測物8,且所述測試座5對應所述壓測機構1之所述吸取治具20。The at least one test socket 5 is disposed on the test circuit board 4 for accommodating and positioning the object 8 to be tested, and the test socket 5 corresponds to the suction jig 20 of the pressure test mechanism 1 .

在一實施例中,所述測試機3係可利用程式語言控制所述量測探針7之資料取得動作(包括但不限於:控制所述壓力裝置10之作動及接收所述量測探針7之測試訊號資料)。In one embodiment, the testing machine 3 can use a programming language to control the data acquisition action of the measurement probe 7 (including but not limited to: controlling the action of the pressure device 10 and receiving the measurement probe 7 test signal data).

關於本發明之測試方法係詳細說明如下,唯並不意謂本發明僅侷限於此等實施例所揭示之內容。The test method of the present invention is described in detail as follows, but it does not mean that the present invention is only limited to the content disclosed in these embodiments.

參閱圖11,其係顯示本發明測試方法中之壓測機構、測試板及測試座之配置側視圖。本發明之測試方法的步驟(a)是提供一壓測機構、一測試電路板4及至少一測試座5。所述壓測機構係可為圖1至圖4之壓測機構1、圖6之壓測機構1a、圖7之壓測機構1b或圖8之壓測機構1c。以下係以圖1至圖4之壓測機構1進行測試方法說明,但不以此為限。Refer to FIG. 11, which is a side view showing the configuration of the pressure test mechanism, the test board, and the test seat in the test method of the present invention. The step (a) of the test method of the present invention is to provide a pressure test mechanism, a test circuit board 4 and at least one test seat 5. The pressure measuring mechanism may be the pressure measuring mechanism 1 to FIG. 4, the pressure measuring mechanism 1a of FIG. 6, the pressure measuring mechanism 1b of FIG. 7, or the pressure measuring mechanism 1c of FIG. The following is a description of the testing method with the pressure testing mechanism 1 shown in FIGS. 1 to 4, but not limited to this.

如圖1至圖4所示,所述壓測機構1包括一壓力裝置10、一吸取治具20、一轉接件30、至少一支撐結構40、一壓感器50及一密封件60。As shown in FIGS. 1 to 4, the pressure measurement mechanism 1 includes a pressure device 10, a suction jig 20, an adapter 30, at least one supporting structure 40, a pressure sensor 50 and a sealing member 60.

所述壓力裝置10包括一第一座體11、一第二座體12、一氣壓件13、一移動件14及一結合座15。所述第一座體11具有一氣壓孔115,所述氣壓孔115貫穿所述第一座體11,且所述氣壓孔115係可連接一氣壓源,以供一氣壓輸入。所述第二座體12結合於所述第一座體11。所述氣壓件13設置於所述第一座體11與所述第二座體12之間。在一實施例中,所述第一座體11之所述氣壓孔115係對應所述氣壓件13,以使經由所述氣壓孔115輸入之氣壓能直接推動所述氣壓件13。所述移動件14連接所述第二座體12,且所述移動件14對應所述氣壓件13。在一實施例中,所述移動件14之一端係可抵接所述氣壓件13,以使所述氣壓件13受氣壓推動時,能同步推動所述移動件14。所述結合座15連接所述移動件14。The pressure device 10 includes a first seat body 11, a second seat body 12, a pneumatic member 13, a moving member 14 and a coupling seat 15. The first base body 11 has an air pressure hole 115, the air pressure hole 115 penetrates the first base body 11, and the air pressure hole 115 can be connected to an air pressure source for an air pressure input. The second seat body 12 is combined with the first seat body 11. The air pressure member 13 is disposed between the first seat body 11 and the second seat body 12. In one embodiment, the air pressure hole 115 of the first seat 11 corresponds to the air pressure member 13 so that the air pressure input through the air pressure hole 115 can directly push the air pressure member 13. The moving part 14 is connected to the second base 12, and the moving part 14 corresponds to the air pressure part 13. In one embodiment, one end of the moving member 14 can abut against the air pressure member 13 so that when the air pressure member 13 is pushed by air pressure, the moving member 14 can be pushed synchronously. The coupling base 15 is connected to the moving part 14.

所述吸取治具20與所述壓力裝置10間隔設置,用以吸取一待測物。所述轉接件30設置於所述壓力裝置10與所述吸取治具20之間,用以連接所述壓力裝置10與所述吸取治具20,且所述轉接件30係可連接不同尺寸或不同規格之所述吸取治具20。所述至少一支撐結構40連接所述壓力裝置10與所述吸取治具20,且所述至少一支撐結構40貫穿所述轉接件30。The suction jig 20 and the pressure device 10 are spaced apart to suck an object to be tested. The adapter 30 is arranged between the pressure device 10 and the suction jig 20 to connect the pressure device 10 and the suction jig 20, and the adapter 30 can be connected to different The suction jig 20 of different sizes or specifications. The at least one supporting structure 40 connects the pressure device 10 and the suction jig 20, and the at least one supporting structure 40 penetrates the adapter 30.

所述壓感器50設置於所述轉接件30與所述壓力裝置10之間。在一實施例中,所述壓感器50係可設置於所述轉接件30之一容置槽34。此外,所述壓感器50具有一感測凸部52,所述感測凸部52朝向所述壓力裝置10(例如:所述結合座15),且經由按壓所述感測凸部52可測得一壓力值。在一實施例中,所述壓感器50係為荷重元(Load cell)。所述密封件60設置於所述吸取治具20與所述轉接件30之間,用以維持所述吸取治具20之所述抽氣孔23與所述轉接件30之所述抽氣通道37之間的真空度。The pressure sensor 50 is disposed between the adapter 30 and the pressure device 10. In one embodiment, the pressure sensor 50 may be disposed in a receiving groove 34 of the adapter 30. In addition, the pressure sensor 50 has a sensing protrusion 52, which faces the pressure device 10 (for example, the coupling base 15), and can be pressed by pressing the sensing protrusion 52. A pressure value is measured. In one embodiment, the pressure sensor 50 is a load cell. The sealing member 60 is disposed between the suction jig 20 and the adapter 30 to maintain the air suction hole 23 of the suction jig 20 and the adapter 30 The degree of vacuum between channels 37.

再參閱圖11,所述壓測機構1係可連接一馬達6,所述馬達6用以移動所述壓測機構1。所述測試電路板4對應所述壓測機構1。所述至少一測試座5設置於所述測試電路板4上,且所述測試座5對應所述壓測機構1之所述吸取治具20。在一實施例中,如圖9所示,所述測試電路板4係可設置於一測試機3上,且電性連接所述測試機3。在一實施例中,所述測試電路板4係具有複數個量測探針7,用以取得測試資料。Referring again to FIG. 11, the pressure measuring mechanism 1 can be connected to a motor 6, and the motor 6 is used to move the pressure measuring mechanism 1. The test circuit board 4 corresponds to the pressure test mechanism 1. The at least one test socket 5 is disposed on the test circuit board 4, and the test socket 5 corresponds to the suction jig 20 of the pressure test mechanism 1. In one embodiment, as shown in FIG. 9, the test circuit board 4 can be set on a test machine 3 and is electrically connected to the test machine 3. In one embodiment, the test circuit board 4 has a plurality of measurement probes 7 for obtaining test data.

參閱圖12,其係顯示本發明測試方法中之吸取治具吸取一待測物至測試座內之示意圖。本發明之測試方法的步驟(b)是以所述吸取治具20吸取一待測物8(例如:半導體晶片或半導體封裝結構)至所述測試座5內。在該步驟(b)中,所述待測物8之吸取及放置操作係配合所述馬達6及所述壓力裝置10完成。Refer to FIG. 12, which shows a schematic diagram of the suction fixture in the test method of the present invention sucking a test object into the test seat. The step (b) of the testing method of the present invention is to suck a test object 8 (for example, a semiconductor chip or a semiconductor package structure) into the test seat 5 by the sucking jig 20. In this step (b), the sucking and placing operation of the test object 8 is completed in cooperation with the motor 6 and the pressure device 10.

參閱圖13,其係顯示本發明測試方法中之利用馬達將壓力裝置、轉接件與吸取治具向下移動及施加一壓力於壓感器及待測物上之示意圖。本發明之測試方法的步驟(c)是利用所述馬達6將所述壓力裝置10、所述轉接件30及所述吸取治具20向下移動,以施加一壓力於所述壓感器50(例如:所述感測凸部52)及所述待測物8上,並使所述待測物8接觸所述測試座5之所述量測探針7,及藉由所述壓感器50測得施加於所述待測物8上之壓力值。在該步驟(c)中,係可利用一氣壓92驅動所述氣壓件13及所述移動件14,以使所述移動件14向下移動所述轉接件30及所述吸取治具20,進而調整施加於所述待測物8上之壓力值。由於所述轉接件30係可沿著所述至少一支撐結構40(例如:所述支撐套筒41)上下移動,因此,可進一步消除所述連接件42(例如:螺絲)的鬆緊度問題。Refer to FIG. 13, which shows a schematic diagram of using a motor to move the pressure device, the adapter and the suction jig downward and apply a pressure on the pressure sensor and the object under test in the testing method of the present invention. Step (c) of the testing method of the present invention is to use the motor 6 to move the pressure device 10, the adapter 30, and the suction jig 20 downward to apply a pressure to the pressure sensor 50 (for example, the sensing protrusion 52) and the object to be measured 8, and the object to be measured 8 is brought into contact with the measuring probe 7 of the test seat 5, and by the pressure The sensor 50 measures the pressure value applied to the test object 8. In this step (c), an air pressure 92 can be used to drive the air pressure part 13 and the moving part 14 so that the moving part 14 moves the adapter part 30 and the suction jig 20 downward. , And then adjust the pressure value applied to the test object 8. Since the adapter 30 can move up and down along the at least one supporting structure 40 (for example: the supporting sleeve 41), the tightness problem of the connecting member 42 (for example: screws) can be further eliminated .

在一實施例中,所述氣壓件13係可為彈性片(例如:矽膠彈性片或橡膠彈性片),因此,所述氣壓件13(即彈性片)受所述氣壓92推動時會向下彎曲,進而頂推所述移動件14之一端,以移動所述移動件14。In one embodiment, the air pressure member 13 may be an elastic sheet (for example, a silicone elastic sheet or a rubber elastic sheet). Therefore, the air pressure member 13 (ie, the elastic sheet) will downward when pushed by the air pressure 92. Bending, and then pushing one end of the moving part 14 to move the moving part 14.

在壓測過程中,所述壓感器50可即時測得施加於所述待測物8上之壓力值,進而避免因壓測之壓力過大而造成所述待測物8受損。倘若在測試完成後,仍發現所述待測物8有損傷,即可判斷出是由所述待測物8之自身因素造成,而非壓測之壓力過大因素造成。During the pressure measurement process, the pressure sensor 50 can instantly measure the pressure value applied to the object 8 to be measured, so as to avoid damage to the object 8 due to excessive pressure measurement. If the test object 8 is still found to be damaged after the test is completed, it can be determined that the test object 8 is caused by its own factors, rather than the excessive pressure of the pressure test.

上述實施例僅為說明本發明之原理及其功效,並非限制本發明,因此習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。The above-mentioned embodiments only illustrate the principles and effects of the present invention, and do not limit the present invention. Therefore, those skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the scope of patent application described later.

1:壓測機構 2:分料裝置 3:測試機 4:測試電路板 5:測試座 6:馬達 7:量測探針 8:待測物 9:測試設備 10:壓力裝置 11:第一座體 12:第二座體 13:氣壓件 14:移動件 15:結合座 20:吸取治具 21:表面 23:抽氣孔 25:環槽 30:轉接件 30a:轉接件 31:第一表面 32:第二表面 33:側面 34:容置槽 35:底面 36:凸出部 37:抽氣通道 40:支撐結構 41:支撐套筒 42:連接件 50:壓感器 50a:壓感器 50c:壓感器 52:感測凸部 60:密封件 70:緩衝件 92:氣壓 115:氣壓孔 151:第一表面 152:第二表面 153:容置槽 231:第一開口 232:第二開口 371:第一通道口 372:第二通道口 421:連接件之一端1: Pressure testing mechanism 2: Distributing device 3: Test machine 4: Test the circuit board 5: Test seat 6: Motor 7: Measuring probe 8: Object to be tested 9: Test equipment 10: Pressure device 11: The first block 12: The second block 13: pneumatic parts 14: Moving parts 15: Combination seat 20: draw fixture 21: Surface 23: Exhaust hole 25: ring groove 30: Adapter 30a: Adapter 31: The first surface 32: second surface 33: side 34: accommodating slot 35: Bottom 36: Protruding part 37: Exhaust channel 40: Supporting structure 41: Support sleeve 42: Connector 50: pressure sensor 50a: pressure sensor 50c: pressure sensor 52: Sensing convex part 60: Seal 70: Buffer 92: air pressure 115: Air pressure hole 151: First Surface 152: second surface 153: Containment Slot 231: The first opening 232: second opening 371: First Channel Port 372: Second Channel Port 421: One end of the connecting piece

當結合附圖閱讀時,自以下詳細描述易於理解本發明之一些實施例的態樣。應注意,各種結構可能未按比例繪製,且各種結構之尺寸可出於論述清晰起見任意增大或減小。When read in conjunction with the accompanying drawings, it is easy to understand the aspects of some embodiments of the present invention from the following detailed description. It should be noted that the various structures may not be drawn to scale, and the size of the various structures may be increased or decreased arbitrarily for clarity of discussion.

圖1顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 1 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.

圖2顯示本發明之一實施例之壓測機構於不同視角(與圖1相反之視角)之立體分解圖。FIG. 2 shows a three-dimensional exploded view of a pressure measuring mechanism in an embodiment of the present invention in different viewing angles (a viewing angle opposite to that of FIG. 1).

圖3顯示圖1之組合圖。Figure 3 shows the combined diagram of Figure 1.

圖4顯示圖3之俯視圖。Fig. 4 shows the top view of Fig. 3.

圖5顯示本發明之一實施例之支撐結構之立體示意圖。Fig. 5 shows a three-dimensional schematic diagram of a supporting structure according to an embodiment of the present invention.

圖6顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 6 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.

圖7顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 7 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.

圖8顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 8 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.

圖9顯示本發明之一實施例之測試設備之示意圖。Fig. 9 shows a schematic diagram of a test device according to an embodiment of the present invention.

圖10顯示本發明之一實施例之測試電路板、測試座及待測物之配置俯視圖。FIG. 10 shows a top view of the arrangement of the test circuit board, the test socket, and the object under test according to an embodiment of the present invention.

圖11顯示本發明測試方法中之壓測機構、測試板及測試座之配置側視圖。Fig. 11 shows a side view of the arrangement of the pressure test mechanism, the test board and the test seat in the test method of the present invention.

圖12顯示本發明測試方法中之吸取治具吸取一待測物至測試座內之示意圖。FIG. 12 shows a schematic diagram of the suction fixture in the test method of the present invention sucking a test object into the test seat.

圖13顯示本發明測試方法中之利用馬達將壓力裝置、轉接件與吸取治具向下移動及施加一壓力於壓感器及待測物上之示意圖。FIG. 13 shows a schematic diagram of using a motor to move the pressure device, the adapter and the suction jig downward and apply a pressure on the pressure sensor and the object under test in the testing method of the present invention.

1:壓測機構1: Pressure testing mechanism

10:壓力裝置10: Pressure device

11:第一座體11: The first block

12:第二座體12: The second block

13:氣壓件13: pneumatic parts

14:移動件14: Moving parts

15:結合座15: Combination seat

20:吸取治具20: draw fixture

21:表面21: Surface

23:抽氣孔23: Exhaust hole

25:環槽25: ring groove

30:轉接件30: Adapter

31:第一表面31: The first surface

32:第二表面32: second surface

33:側面33: side

34:容置槽34: accommodating slot

35:底面35: Bottom

37:抽氣通道37: Exhaust channel

40:支撐結構40: Supporting structure

41:支撐套筒41: Support sleeve

42:連接件42: Connector

50:壓感器50: pressure sensor

52:感測凸部52: Sensing convex part

60:密封件60: Seal

115:氣壓孔115: Air pressure hole

151:第一表面151: First Surface

152:第二表面152: second surface

231:第一開口231: The first opening

371:第一通道口371: First Channel Port

372:第二通道口372: Second Channel Port

421:連接件之一端421: One end of the connecting piece

Claims (19)

一種壓測機構,包括: 一壓力裝置; 一吸取治具,其與所述壓力裝置間隔設置; 一轉接件,設置於所述壓力裝置與所述吸取治具之間; 至少一支撐結構,連接所述壓力裝置與所述吸取治具;及一壓感器,設置於所述轉接件與所述壓力裝置之間。A pressure measurement mechanism, including: A pressure device; A suction jig, which is arranged spaced apart from the pressure device; An adapter, arranged between the pressure device and the suction jig; At least one supporting structure is connected to the pressure device and the suction jig; and a pressure sensor is arranged between the adapter and the pressure device. 如請求項1之壓測機構,其中所述壓力裝置包括一第一座體、一第二座體、一氣壓件及一移動件,所述第一座體具有一氣壓孔,所述氣壓孔貫穿所述第一座體,所述第二座體結合於所述第一座體,所述氣壓件設置於所述第一座體與所述第二座體之間,且所述氣壓孔對應所述氣壓件,所述移動件連接所述第二座體,且所述移動件對應所述氣壓件。The pressure measurement mechanism of claim 1, wherein the pressure device includes a first seat body, a second seat body, an air pressure member, and a moving member, the first seat body has an air pressure hole, and the air pressure hole Through the first seat body, the second seat body is combined with the first seat body, the air pressure member is disposed between the first seat body and the second seat body, and the air pressure hole Corresponding to the pneumatic element, the moving element is connected to the second base body, and the moving element corresponds to the pneumatic element. 如請求項2之壓測機構,其中所述壓力裝置另包括一結合座,所述結合座設置於所述第二座體與所述轉接件之間,且所述結合座連接所述移動件。Such as the pressure measurement mechanism of claim 2, wherein the pressure device further includes a coupling seat, the coupling seat is disposed between the second seat body and the adapter, and the coupling seat is connected to the mobile Pieces. 如請求項3之壓測機構,其中所述結合座具有一表面及複數個容置槽,所述表面朝向所述轉接件,所述容置槽凹設於所述表面。Such as the pressure measurement mechanism of claim 3, wherein the coupling base has a surface and a plurality of accommodating grooves, the surface faces the adapter, and the accommodating groove is recessed on the surface. 如請求項1之壓測機構,其中所述轉接件具有一第一表面及一容置槽,所述第一表面朝向所述壓力裝置,所述容置槽凹設於所述第一表面,所述壓感器設置於所述轉接件之所述容置槽。The pressure measurement mechanism of claim 1, wherein the adapter has a first surface and an accommodating groove, the first surface faces the pressure device, and the accommodating groove is recessed on the first surface , The pressure sensor is arranged in the accommodating groove of the adapter. 如請求項5之壓測機構,其中所述壓感器具有一感測凸部,所述感測凸部位於所述轉接件之所述容置槽內。The pressure measurement mechanism of claim 5, wherein the pressure sensor has a sensing protrusion, and the sensing protrusion is located in the accommodating groove of the adapter. 如請求項5之壓測機構,另包括一緩衝件,所述緩衝件設置於所述壓感器與所述壓力裝置之間。For example, the pressure measurement mechanism of claim 5 further includes a buffer member, and the buffer member is arranged between the pressure sensor and the pressure device. 如請求項1之壓測機構,其中所述轉接件具有一第一表面及一凸出部,所述第一表面朝向所述壓力裝置,所述凸出部凸設於所述第一表面,所述壓感器設置於所述轉接件之所述凸出部與所述壓力裝置之間。The pressure measurement mechanism of claim 1, wherein the adapter has a first surface and a protruding portion, the first surface faces the pressure device, and the protruding portion protrudes from the first surface , The pressure sensor is arranged between the protruding part of the adapter and the pressure device. 如請求項1之壓測機構,其中所述轉接件具有一第一表面、一第二表面、一側面及一抽氣通道,所述第一表面朝向所述壓力裝置,所述第二表面相對於所述第一表面,所述側面延伸於所述第一表面與所述第二表面之間,所述抽氣通道連通所述第二表面及所述側面。The pressure measurement mechanism of claim 1, wherein the adapter has a first surface, a second surface, a side surface, and a suction channel, the first surface faces the pressure device, and the second surface Relative to the first surface, the side surface extends between the first surface and the second surface, and the air suction channel communicates with the second surface and the side surface. 如請求項1之壓測機構,其中所述至少一支撐結構貫穿所述轉接件。According to the pressure measurement mechanism of claim 1, wherein the at least one supporting structure penetrates the adapter. 如請求項1之壓測機構,其中所述至少一支撐結構包括一支撐套筒及一連接件,所述支撐套筒貫穿所述轉接件,所述連接件貫穿所述吸取治具及所述支撐套筒,且所述連接件之一端連接所述壓力裝置。The pressure measurement mechanism of claim 1, wherein the at least one supporting structure includes a supporting sleeve and a connecting piece, the supporting sleeve penetrates the adapter piece, and the connecting piece penetrates the suction jig and the connecting piece. The supporting sleeve, and one end of the connecting piece is connected with the pressure device. 如請求項1之壓測機構,另包括一密封件,所述密封件設置於所述吸取治具與所述轉接件之間。For example, the pressure measurement mechanism of claim 1 further includes a sealing element, and the sealing element is arranged between the suction jig and the adapter. 一種測試設備,包括: 一分料裝置; 一壓測機構,裝設於所述分料裝置,所述壓測機構包括: 一壓力裝置,連接所述分料裝置; 一吸取治具,其與所述壓力裝置間隔設置; 一轉接件,設置於所述壓力裝置與所述吸取治具之間;至少一支撐結構,連接所述壓力裝置與所述吸取治具;及一壓感器,設置於所述轉接件與所述壓力裝置之間;一測試電路板,對應所述壓測機構,用以測試一待測物;及 至少一測試座,設置於所述測試電路板上,用以容置所述待測物,且所述測試座對應所述壓測機構之所述吸取治具。A test equipment including: A feeding device; A pressure measuring mechanism installed in the material distributing device, the pressure measuring mechanism comprising: A pressure device connected to the distributing device; A suction jig, which is arranged spaced apart from the pressure device; An adapter, which is arranged between the pressure device and the suction jig; at least one support structure, which connects the pressure device and the suction jig; and a pressure sensor, which is arranged on the adapter Between the pressure device and the pressure device; a test circuit board corresponding to the pressure test mechanism for testing an object to be tested; and At least one test socket is arranged on the test circuit board for accommodating the object to be tested, and the test socket corresponds to the suction jig of the pressure test mechanism. 如請求項13之測試設備,其中所述轉接件具有一第一表面及一容置槽,所述第一表面朝向所述壓力裝置,所述容置槽凹設於所述第一表面,所述壓感器設置於所述轉接件之所述容置槽。The test equipment of claim 13, wherein the adapter has a first surface and a receiving groove, the first surface faces the pressure device, and the receiving groove is recessed on the first surface, The pressure sensor is arranged in the accommodating groove of the adapter. 如請求項13之測試設備,其中所述轉接件具有一第一表面及一凸出部,所述第一表面朝向所述壓力裝置,所述凸出部凸設於所述第一表面,所述壓感器設置於所述轉接件之所述凸出部與所述壓力裝置之間。The test equipment of claim 13, wherein the adapter has a first surface and a protruding part, the first surface faces the pressure device, and the protruding part protrudes from the first surface, The pressure sensor is arranged between the protruding part of the adapter and the pressure device. 如請求項13之測試設備,其中所述轉接件具有一第一表面、一第二表面、一側面及一抽氣通道,所述第一表面朝向所述壓力裝置,所述第二表面相對於所述第一表面,所述側面延伸於所述第一表面與所述第二表面之間,所述抽氣通道連通所述第二表面及所述側面。The test equipment of claim 13, wherein the adapter has a first surface, a second surface, a side surface, and a suction channel, the first surface faces the pressure device, and the second surface is opposite On the first surface, the side surface extends between the first surface and the second surface, and the air suction channel communicates with the second surface and the side surface. 一種測試方法,包括: (a)提供一壓測機構、一測試電路板及至少一測試座,所述壓測機構包括一壓力裝置、一吸取治具、一轉接件及一壓感器,所述吸取治具與所述壓力裝置間隔設置,所述轉接件設置於所述壓力裝置與所述吸取治具之間,所述壓感器設置於所述轉接件與所述壓力裝置之間,所述測試電路板對應所述壓測機構,所述測試座設置於所述測試電路板上,且所述測試座對應所述壓測機構之所述吸取治具; (b)以所述吸取治具吸取一待測物至所述測試座內;及 (c)利用一馬達將所述壓力裝置、所述轉接件及所述吸取治具向下移動,以施加一壓力於所述壓感器及所述待測物上,並使所述待測物接觸所述測試電路板之複數個量測探針,及藉由所述壓感器測得施加於所述待測物上之壓力值。A test method including: (a) Provide a pressure test mechanism, a test circuit board and at least one test seat. The pressure test mechanism includes a pressure device, a suction fixture, an adapter, and a pressure sensor. The pressure device is arranged at intervals, the adapter is arranged between the pressure device and the suction jig, the pressure sensor is arranged between the adapter and the pressure device, and the test The circuit board corresponds to the pressure test mechanism, the test seat is disposed on the test circuit board, and the test seat corresponds to the suction jig of the pressure test mechanism; (b) Use the suction jig to suck a test object into the test seat; and (c) Use a motor to move the pressure device, the adapter, and the suction jig downward to apply a pressure on the pressure sensor and the object to be measured, and make the The test object contacts a plurality of measurement probes of the test circuit board, and the pressure value applied to the test object is measured by the pressure sensor. 如請求項17之測試方法,其中在該步驟(a)中,所述壓測機構另包括至少一支撐結構,所述至少一支撐結構連接所述壓力裝置與所述吸取治具;在該步驟(c)中,所述轉接件係沿著所述至少一支撐結構上下移動。Such as the test method of claim 17, wherein in the step (a), the pressure measurement mechanism further includes at least one support structure, and the at least one support structure connects the pressure device and the suction jig; in this step In (c), the adaptor moves up and down along the at least one supporting structure. 如請求項17之測試方法,其中在該步驟(a)中,所述壓力裝置包括第一座體、一第二座體、一氣壓件及一移動件,所述第二座體結合於所述第一座體,所述氣壓件設置於所述第一座體與所述第二座體之間,所述移動件連接所述第二座體,且所述移動件對應所述氣壓件;及步驟(c)包括: (c1)利用一氣壓驅動所述氣壓件及所述移動件,以使所述移動件向下移動所述轉接件及所述吸取治具。The test method of claim 17, wherein in the step (a), the pressure device includes a first seat body, a second seat body, a pneumatic member, and a moving member, and the second seat body is coupled to the The first seat body, the air pressure member is disposed between the first seat body and the second seat body, the movable member is connected to the second seat body, and the movable member corresponds to the air pressure member ; And step (c) includes: (c1) Using an air pressure to drive the air pressure member and the moving member, so that the moving member moves the adapter and the suction jig downward.
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