TW202129290A - Press testing mechanism, testing apparatus and testing method - Google Patents
Press testing mechanism, testing apparatus and testing method Download PDFInfo
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Abstract
Description
本發明是有關於壓測機構、測試設備及測試方法,且更具體言之,是有關於電性測試之壓測機構、測試設備及測試方法。The present invention relates to a pressure testing mechanism, testing equipment and testing method, and more specifically, to a pressure testing mechanism, testing equipment and testing method for electrical testing.
現行半導體晶片或半導體封裝結構的壓測方式主要是先透過吸取頭將半導體晶片或半導體封裝結構吸取至測試板的測試座上,接著調整浮動氣囊給予半導體晶片或半導體封裝結構施加壓力,以使半導體晶片或半導體封裝結構頂抵於測試板上對應的探針進行電性測試。然而,浮動氣囊所施加之壓力並不等於半導體晶片或半導體封裝結構實際承受的壓力,因此,當半導體晶片或半導體封裝結構經壓測後有損傷時,無法確定其是否因壓測之壓力過大而受損。The current pressure testing method for semiconductor wafers or semiconductor packaging structures is mainly to first suck the semiconductor wafer or semiconductor packaging structure onto the test seat of the test board through the picking head, and then adjust the floating air bag to apply pressure to the semiconductor wafer or semiconductor packaging structure to make the semiconductor The chip or semiconductor package structure is pressed against the corresponding probe on the test board for electrical testing. However, the pressure exerted by the floating airbag is not equal to the actual pressure of the semiconductor chip or semiconductor package structure. Therefore, when the semiconductor chip or semiconductor package structure is damaged after pressure testing, it is impossible to determine whether it is caused by excessive pressure testing. Damaged.
在一實施例中,一種壓測機構包括一壓力裝置、一吸取治具、一轉接件、至少一支撐結構及一壓感器。所述吸取治具與所述壓力裝置間隔設置。所述轉接件設置於所述壓力裝置與所述吸取治具之間。所述支撐結構連接所述壓力裝置與所述吸取治具。所述壓感器設置於所述轉接件與所述壓力裝置之間。In one embodiment, a pressure measuring mechanism includes a pressure device, a suction jig, an adapter, at least one supporting structure, and a pressure sensor. The suction jig is spaced apart from the pressure device. The adapter is arranged between the pressure device and the suction jig. The supporting structure connects the pressure device and the suction jig. The pressure sensor is arranged between the adapter and the pressure device.
在一實施例中,一種測試設備包括一分料裝置、一壓測機構、一測試電路板及至少一測試座。所述壓測機構裝設於所述分料裝置。所述壓測機構包括一壓力裝置、一吸取治具、一轉接件、至少一支撐結構及一壓感器。所述壓力裝置連接所述分料裝置。所述吸取治具與所述壓力裝置間隔設置。所述轉接件設置於所述壓力裝置與所述吸取治具之間。所述支撐結構連接所述壓力裝置與所述吸取治具。所述壓感器設置於所述轉接件與所述壓力裝置之間。所述測試電路板對應所述壓測機構,用以測試一待測物。所述測試座設置於所述測試電路板上,用以容置所述待測物,且所述測試座對應所述壓測機構之所述吸取治具。In one embodiment, a test equipment includes a material distributing device, a pressure test mechanism, a test circuit board, and at least one test seat. The pressure measuring mechanism is installed in the material distributing device. The pressure measurement mechanism includes a pressure device, a suction jig, an adapter, at least one supporting structure and a pressure sensor. The pressure device is connected to the material distributing device. The suction jig is spaced apart from the pressure device. The adapter is arranged between the pressure device and the suction jig. The supporting structure connects the pressure device and the suction jig. The pressure sensor is arranged between the adapter and the pressure device. The test circuit board corresponds to the pressure test mechanism and is used to test an object under test. The test seat is arranged on the test circuit board for accommodating the object to be tested, and the test seat corresponds to the suction jig of the pressure test mechanism.
在一實施例中,一種測試方法包括:提供一壓測機構、一測試電路板及至少一測試座,所述壓測機構包括一壓力裝置、一吸取治具、一轉接件及一壓感器,所述吸取治具與所述壓力裝置間隔設置,所述轉接件設置於所述壓力裝置與所述吸取治具之間,所述壓感器設置於所述轉接件與所述壓力裝置之間,所述測試電路板對應所述壓測機構,所述測試座設置於所述測試電路板上,且所述測試座對應所述壓測機構之所述吸取治具;以所述吸取治具吸取一待測物至所述測試座內;及利用一馬達將所述壓力裝置、所述轉接件及所述吸取治具向下移動,以施加一壓力於所述壓感器及所述待測物上,並使所述待測物接觸所述測試電路板之複數個量測探針,及藉由所述壓感器測得施加於所述待測物上之壓力值。In one embodiment, a test method includes: providing a pressure test mechanism, a test circuit board, and at least one test seat, the pressure test mechanism including a pressure device, a suction jig, an adapter, and a pressure sensor The suction jig and the pressure device are arranged at intervals, the adapter is arranged between the pressure device and the suction jig, and the pressure sensor is arranged between the adapter and the pressure device. Between the pressure devices, the test circuit board corresponds to the pressure test mechanism, the test seat is disposed on the test circuit board, and the test seat corresponds to the suction jig of the pressure test mechanism; The suction jig sucks an object to be tested into the test seat; and a motor is used to move the pressure device, the adapter and the suction jig downward to apply a pressure on the pressure sensor On the device and the object under test, and make the object under test contact a plurality of measuring probes of the test circuit board, and the pressure applied to the object under test is measured by the pressure sensor value.
貫穿圖式及實施方式使用共同參考編號以指示相同或相似組件。自結合附圖的以下詳細描述將更容易理解本發明之實施例。Common reference numbers are used throughout the drawings and embodiments to indicate the same or similar components. It will be easier to understand the embodiments of the present invention from the following detailed description in conjunction with the accompanying drawings.
以下揭示內容提供用於實施所提供主題之不同特徵的許多不同實施例或實例。在下文描述組件及配置之特定實例以闡明本發明之特定態樣。當然,此等組件、值、操作、材料及配置僅為實例且不意欲為限制性的。舉例而言,在本文中所提供之描述中,第一特徵在第二特徵上方或上的形成可包括第一特徵以及第二特徵直接接觸地形成或安置的實施例,且亦可包括額外特徵可在第一特徵與第二特徵之間形成或安置使得第一特徵與第二特徵可不直接接觸的實施例。另外,本發明可在本文中所提供之各種實例中重複參考數字及/或字母。此重複係出於簡化及清楚之目的,且本身並不指示所論述各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to clarify specific aspects of the invention. Of course, these components, values, operations, materials, and configurations are only examples and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature on or on the second feature may include an embodiment in which the first feature and the second feature are formed or arranged in direct contact, and may also include additional features An embodiment may be formed or disposed between the first feature and the second feature so that the first feature and the second feature may not directly contact. In addition, the present invention may repeat reference numbers and/or letters in various examples provided herein. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.
圖1顯示本發明之一實施例之壓測機構1之立體分解圖。圖2顯示本發明之一實施例之壓測機構1於不同視角(與圖1相反之視角)之立體分解圖。圖3顯示圖1之組合圖。圖4顯示圖3之俯視圖。配合參閱圖1至圖4,本發明之壓測機構1包括一壓力裝置10、一吸取治具20、一轉接件30、至少一支撐結構40、一壓感器50及一密封件60。Fig. 1 shows a three-dimensional exploded view of a
所述壓力裝置10包括一第一座體11、一第二座體12、一氣壓件13、一移動件14及一結合座15。所述第一座體11具有一氣壓孔115,所述氣壓孔115貫穿所述第一座體11,且所述氣壓孔115係可連接一氣壓源,以供一氣壓輸入。所述第二座體12結合於所述第一座體11。在一實施例中,所述第二座體12係可藉由螺絲或螺栓固定於所述第一座體11。The
所述氣壓件13設置於所述第一座體11與所述第二座體12之間。在一實施例中,所述第一座體11之所述氣壓孔115係對應所述氣壓件13,以使經由所述氣壓孔115輸入之氣壓能直接推動所述氣壓件13。在一實施例中,所述氣壓件13係可為彈性片(例如:矽膠彈性片或橡膠彈性片),因此,所述氣壓件13(即彈性片)受氣壓推動時能產生向下彎曲之動作。亦即,所述氣壓件13(即彈性片)之中間部位受氣壓推動時會鼓起,而形成弧狀突起。The
所述移動件14連接所述第二座體12,且所述移動件14對應所述氣壓件13。在一實施例中,所述移動件14貫穿所述第二座體12,且所述移動件14之一端(或一表面)係可抵接所述氣壓件13,以使所述氣壓件13受氣壓推動時,能同步推動所述移動件14。舉例而言,當所述氣壓件13之中間部位受氣壓推動而鼓起時,該所述氣壓件13之中間部位能頂抵所述移動件14之中間部位,而推動所述移動件14。The moving
所述結合座15連接所述移動件14。在一實施例中,所述結合座15具有一第一表面151、一第二表面152及複數個容置槽153。所述第一表面151朝向所述第二座體12。所述第二表面152相對於所述第一表面151。所述容置槽153凹設於所述第二表面152。The
所述吸取治具20與所述壓力裝置10間隔設置,用以吸取一待測物。在一實施例中,所述吸取治具20具有一表面21、一抽氣孔23及一環槽25。所述表面21朝向所述壓力裝置10。所述抽氣孔23貫穿所述吸取治具20,且所述抽氣孔23具有一第一開口231及一第二開口232。所述第一開口231顯露於所述表面21。所述第二開口232相對於所述第一開口231。所述環槽25凹設於所述表面21,且所述環槽25圍繞所述抽氣孔23之所述第一開口231。The
所述轉接件30設置於所述壓力裝置10與所述吸取治具20之間,用以連接所述壓力裝置10與所述吸取治具20,且所述轉接件30係可連接不同尺寸或不同規格之所述吸取治具20。在一實施例中,所述轉接件30具有一第一表面31、一第二表面32、一側面33、一容置槽34及一抽氣通道37。所述第一表面31朝向所述壓力裝置10(例如:所述結合座15之所述第二表面152)。所述第二表面32相對於所述第一表面31。所述側面33延伸於所述第一表面31與所述第二表面32之間。所述容置槽34凹設於所述第一表面31,且所述容置槽34內具有一底面35。所述容置槽34係為一盲孔,其並未貫穿所述轉接件30。The
所述抽氣通道37連通所述第二表面32及所述側面33,且所述抽氣通道37具有一第一通道口371及一第二通道口372。所述第一通道口371對應所述吸取治具20之所述抽氣孔23(例如:所述第一開口231)。所述第二通道口372顯露於所述側面33。在一實施例中,所述抽氣通道37之所述第二通道口372係可連接一抽氣裝置,以使所述抽氣裝置所產生之真空吸力能經由所述抽氣通道37及所述吸取治具20之所述抽氣孔23作用於所述待測物上。在一實施例中,所述結合座15係可設置於所述第二座體12與所述轉接件30之間。The
圖5顯示本發明之一實施例之支撐結構40之立體示意圖。配合參閱圖1、圖4及圖5,所述至少一支撐結構40連接所述壓力裝置10與所述吸取治具20,且所述至少一支撐結構40貫穿所述轉接件30。在一實施例中,所述至少一支撐結構40包括一支撐套筒41及一連接件42。所述支撐套筒41貫穿所述轉接件30,以使所述轉接件30可沿著所述支撐套筒41上下移動。所述連接件42(例如:螺絲)貫穿所述吸取治具20及所述支撐套筒41,且所述連接件42之一端421連接所述壓力裝置10之所述結合座15,以將所述轉接件30限位於所述壓力裝置10與所述吸取治具20之間。由於所述轉接件30可沿著所述支撐套筒41上下移動,因此,可進一步消除所述連接件42(例如:螺絲)的鬆緊度問題。FIG. 5 shows a three-dimensional schematic diagram of a supporting
再參閱圖1、圖2及圖4,所述壓感器50設置於所述轉接件30與所述壓力裝置10之間。在一實施例中,所述壓感器50係可設置於所述轉接件30之所述容置槽34。此外,所述壓感器50具有一感測凸部52,所述感測凸部52朝向所述壓力裝置10(例如:所述結合座15),且經由按壓所述感測凸部52可測得一壓力值。在一實施例中,所述壓感器50係可為荷重元(Load cell)。Referring again to FIGS. 1, 2 and 4, the
所述密封件60設置於所述吸取治具20與所述轉接件30之間,用以維持所述吸取治具20之所述抽氣孔23與所述轉接件30之所述抽氣通道37之間的真空度。在一實施例中,所述密封件60係可設置於所述吸取治具20之所述環槽25,且所述密封件60環繞所述吸取治具20之所述抽氣孔23(例如:所述第一開口231)。在一實施例中,所述密封件60係可為海綿密封環或塑膠密封環。The sealing
本發明於所述壓測機構1中設置所述壓感器50,可在壓測過程中即時測得施加於待測物上之壓力值,進而避免因壓測之壓力過大而造成待測物受損。且若待測物經壓測後有損傷,亦可判斷出待測物之受損原因是壓測之壓力過大造成還是待測物之自身因素造成。In the present invention, the
圖6顯示本發明之一實施例之壓測機構1a之立體分解圖。圖6之壓測機構1a與圖1至圖5之壓測機構1大致相同,其不同處在於圖6之壓測機構1a更包括一緩衝件70。如圖6所示,所述緩衝件70設置於所述壓感器50與所述壓力裝置10之間,且所述壓感器50之所述感測凸部52抵接所述緩衝件70。在一實施例中,所述緩衝件70之至少一部份設置於所述轉接件30之所述容置槽34內。所述緩衝件70係可避免所述壓力裝置10(例如:所述結合座15)直接壓觸所述壓感器50之所述感測凸部52,造成所述感測凸部52之磨損。Fig. 6 shows a three-dimensional exploded view of a
圖7顯示本發明之一實施例之壓測機構1b之立體分解圖。圖7之壓測機構1b與圖6之壓測機構1a大致相同,其不同處僅在於圖7之壓感器50a的配置。如圖7所示,所述壓感器50a之所述感測凸部52係位於所述轉接件30之所述容置槽34內,且所述感測凸部52抵接所述容置槽34內之所述底面35。FIG. 7 shows a three-dimensional exploded view of a
圖8顯示本發明之一實施例之壓測機構1c之立體分解圖。圖8之壓測機構1c與圖1至圖5之壓測機構1大致相同,其不同處在於圖8之轉接件30a省略容置槽34。如圖8所示,所述轉接件30a具有一凸出部36,所述凸出部36凸設於所述第一表面31。而所述壓感器50c係設置於所述轉接件30a之所述凸出部36與所述壓力裝置10(例如:所述結合座15)之間。在一實施例中,所述壓感器50c係可貼設於所述轉接件30a之所述凸出部36上,且所述壓感器50c係可為薄膜型壓力感測器(Thin film pressure sensor)。Fig. 8 shows a three-dimensional exploded view of a
圖9顯示本發明之一實施例之測試設備9之示意圖。圖10顯示本發明之一實施例之測試電路板4、測試座5及待測物8之配置俯視圖。配合參閱圖9及圖10,本發明之測試設備9包括一分料裝置2、一壓測機構(例如:壓測機構1)、一測試機3、一測試電路板4及至少一測試座5。Fig. 9 shows a schematic diagram of a
所述壓測機構(例如:壓測機構1)裝設於所述分料裝置2。所述壓測機構係可為圖1至圖4之壓測機構1、圖6之壓測機構1a、圖7之壓測機構1b或圖8之壓測機構1c。如圖9所示,所述壓測機構1之所述壓力裝置10係連接所述分料裝置2之一馬達6。The pressure measuring mechanism (for example, the pressure measuring mechanism 1) is installed in the
再參閱圖9及圖10,所述測試機3對應所述分料裝置2之所述馬達6。在一實施例中,所述測試機3係設置於所述馬達6之下方。所述測試機3係可設定及調整針對一待測物8(例如:半導體晶片或半導體封裝結構)之測試條件。9 and 10 again, the
所述測試電路板4設置於所述測試機3上,且電性連接所述測試機3。此外,所述測試電路板4對應所述壓測機構1,用以測試所述待測物8。在一實施例中,所述測試電路板4係具有複數個量測探針7,用以測試所述待測物8。The
所述至少一測試座5設置於所述測試電路板4上,用以容置及定位所述待測物8,且所述測試座5對應所述壓測機構1之所述吸取治具20。The at least one
在一實施例中,所述測試機3係可利用程式語言控制所述量測探針7之資料取得動作(包括但不限於:控制所述壓力裝置10之作動及接收所述量測探針7之測試訊號資料)。In one embodiment, the
關於本發明之測試方法係詳細說明如下,唯並不意謂本發明僅侷限於此等實施例所揭示之內容。The test method of the present invention is described in detail as follows, but it does not mean that the present invention is only limited to the content disclosed in these embodiments.
參閱圖11,其係顯示本發明測試方法中之壓測機構、測試板及測試座之配置側視圖。本發明之測試方法的步驟(a)是提供一壓測機構、一測試電路板4及至少一測試座5。所述壓測機構係可為圖1至圖4之壓測機構1、圖6之壓測機構1a、圖7之壓測機構1b或圖8之壓測機構1c。以下係以圖1至圖4之壓測機構1進行測試方法說明,但不以此為限。Refer to FIG. 11, which is a side view showing the configuration of the pressure test mechanism, the test board, and the test seat in the test method of the present invention. The step (a) of the test method of the present invention is to provide a pressure test mechanism, a
如圖1至圖4所示,所述壓測機構1包括一壓力裝置10、一吸取治具20、一轉接件30、至少一支撐結構40、一壓感器50及一密封件60。As shown in FIGS. 1 to 4, the
所述壓力裝置10包括一第一座體11、一第二座體12、一氣壓件13、一移動件14及一結合座15。所述第一座體11具有一氣壓孔115,所述氣壓孔115貫穿所述第一座體11,且所述氣壓孔115係可連接一氣壓源,以供一氣壓輸入。所述第二座體12結合於所述第一座體11。所述氣壓件13設置於所述第一座體11與所述第二座體12之間。在一實施例中,所述第一座體11之所述氣壓孔115係對應所述氣壓件13,以使經由所述氣壓孔115輸入之氣壓能直接推動所述氣壓件13。所述移動件14連接所述第二座體12,且所述移動件14對應所述氣壓件13。在一實施例中,所述移動件14之一端係可抵接所述氣壓件13,以使所述氣壓件13受氣壓推動時,能同步推動所述移動件14。所述結合座15連接所述移動件14。The
所述吸取治具20與所述壓力裝置10間隔設置,用以吸取一待測物。所述轉接件30設置於所述壓力裝置10與所述吸取治具20之間,用以連接所述壓力裝置10與所述吸取治具20,且所述轉接件30係可連接不同尺寸或不同規格之所述吸取治具20。所述至少一支撐結構40連接所述壓力裝置10與所述吸取治具20,且所述至少一支撐結構40貫穿所述轉接件30。The
所述壓感器50設置於所述轉接件30與所述壓力裝置10之間。在一實施例中,所述壓感器50係可設置於所述轉接件30之一容置槽34。此外,所述壓感器50具有一感測凸部52,所述感測凸部52朝向所述壓力裝置10(例如:所述結合座15),且經由按壓所述感測凸部52可測得一壓力值。在一實施例中,所述壓感器50係為荷重元(Load cell)。所述密封件60設置於所述吸取治具20與所述轉接件30之間,用以維持所述吸取治具20之所述抽氣孔23與所述轉接件30之所述抽氣通道37之間的真空度。The
再參閱圖11,所述壓測機構1係可連接一馬達6,所述馬達6用以移動所述壓測機構1。所述測試電路板4對應所述壓測機構1。所述至少一測試座5設置於所述測試電路板4上,且所述測試座5對應所述壓測機構1之所述吸取治具20。在一實施例中,如圖9所示,所述測試電路板4係可設置於一測試機3上,且電性連接所述測試機3。在一實施例中,所述測試電路板4係具有複數個量測探針7,用以取得測試資料。Referring again to FIG. 11, the
參閱圖12,其係顯示本發明測試方法中之吸取治具吸取一待測物至測試座內之示意圖。本發明之測試方法的步驟(b)是以所述吸取治具20吸取一待測物8(例如:半導體晶片或半導體封裝結構)至所述測試座5內。在該步驟(b)中,所述待測物8之吸取及放置操作係配合所述馬達6及所述壓力裝置10完成。Refer to FIG. 12, which shows a schematic diagram of the suction fixture in the test method of the present invention sucking a test object into the test seat. The step (b) of the testing method of the present invention is to suck a test object 8 (for example, a semiconductor chip or a semiconductor package structure) into the
參閱圖13,其係顯示本發明測試方法中之利用馬達將壓力裝置、轉接件與吸取治具向下移動及施加一壓力於壓感器及待測物上之示意圖。本發明之測試方法的步驟(c)是利用所述馬達6將所述壓力裝置10、所述轉接件30及所述吸取治具20向下移動,以施加一壓力於所述壓感器50(例如:所述感測凸部52)及所述待測物8上,並使所述待測物8接觸所述測試座5之所述量測探針7,及藉由所述壓感器50測得施加於所述待測物8上之壓力值。在該步驟(c)中,係可利用一氣壓92驅動所述氣壓件13及所述移動件14,以使所述移動件14向下移動所述轉接件30及所述吸取治具20,進而調整施加於所述待測物8上之壓力值。由於所述轉接件30係可沿著所述至少一支撐結構40(例如:所述支撐套筒41)上下移動,因此,可進一步消除所述連接件42(例如:螺絲)的鬆緊度問題。Refer to FIG. 13, which shows a schematic diagram of using a motor to move the pressure device, the adapter and the suction jig downward and apply a pressure on the pressure sensor and the object under test in the testing method of the present invention. Step (c) of the testing method of the present invention is to use the
在一實施例中,所述氣壓件13係可為彈性片(例如:矽膠彈性片或橡膠彈性片),因此,所述氣壓件13(即彈性片)受所述氣壓92推動時會向下彎曲,進而頂推所述移動件14之一端,以移動所述移動件14。In one embodiment, the
在壓測過程中,所述壓感器50可即時測得施加於所述待測物8上之壓力值,進而避免因壓測之壓力過大而造成所述待測物8受損。倘若在測試完成後,仍發現所述待測物8有損傷,即可判斷出是由所述待測物8之自身因素造成,而非壓測之壓力過大因素造成。During the pressure measurement process, the
上述實施例僅為說明本發明之原理及其功效,並非限制本發明,因此習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。The above-mentioned embodiments only illustrate the principles and effects of the present invention, and do not limit the present invention. Therefore, those skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the scope of patent application described later.
1:壓測機構
2:分料裝置
3:測試機
4:測試電路板
5:測試座
6:馬達
7:量測探針
8:待測物
9:測試設備
10:壓力裝置
11:第一座體
12:第二座體
13:氣壓件
14:移動件
15:結合座
20:吸取治具
21:表面
23:抽氣孔
25:環槽
30:轉接件
30a:轉接件
31:第一表面
32:第二表面
33:側面
34:容置槽
35:底面
36:凸出部
37:抽氣通道
40:支撐結構
41:支撐套筒
42:連接件
50:壓感器
50a:壓感器
50c:壓感器
52:感測凸部
60:密封件
70:緩衝件
92:氣壓
115:氣壓孔
151:第一表面
152:第二表面
153:容置槽
231:第一開口
232:第二開口
371:第一通道口
372:第二通道口
421:連接件之一端1: Pressure testing mechanism
2: Distributing device
3: Test machine
4: Test the circuit board
5: Test seat
6: Motor
7: Measuring probe
8: Object to be tested
9: Test equipment
10: Pressure device
11: The first block
12: The second block
13: pneumatic parts
14: Moving parts
15: Combination seat
20: draw fixture
21: Surface
23: Exhaust hole
25: ring groove
30:
當結合附圖閱讀時,自以下詳細描述易於理解本發明之一些實施例的態樣。應注意,各種結構可能未按比例繪製,且各種結構之尺寸可出於論述清晰起見任意增大或減小。When read in conjunction with the accompanying drawings, it is easy to understand the aspects of some embodiments of the present invention from the following detailed description. It should be noted that the various structures may not be drawn to scale, and the size of the various structures may be increased or decreased arbitrarily for clarity of discussion.
圖1顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 1 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.
圖2顯示本發明之一實施例之壓測機構於不同視角(與圖1相反之視角)之立體分解圖。FIG. 2 shows a three-dimensional exploded view of a pressure measuring mechanism in an embodiment of the present invention in different viewing angles (a viewing angle opposite to that of FIG. 1).
圖3顯示圖1之組合圖。Figure 3 shows the combined diagram of Figure 1.
圖4顯示圖3之俯視圖。Fig. 4 shows the top view of Fig. 3.
圖5顯示本發明之一實施例之支撐結構之立體示意圖。Fig. 5 shows a three-dimensional schematic diagram of a supporting structure according to an embodiment of the present invention.
圖6顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 6 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.
圖7顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 7 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.
圖8顯示本發明之一實施例之壓測機構之立體分解圖。Fig. 8 shows a three-dimensional exploded view of a pressure measuring mechanism according to an embodiment of the present invention.
圖9顯示本發明之一實施例之測試設備之示意圖。Fig. 9 shows a schematic diagram of a test device according to an embodiment of the present invention.
圖10顯示本發明之一實施例之測試電路板、測試座及待測物之配置俯視圖。FIG. 10 shows a top view of the arrangement of the test circuit board, the test socket, and the object under test according to an embodiment of the present invention.
圖11顯示本發明測試方法中之壓測機構、測試板及測試座之配置側視圖。Fig. 11 shows a side view of the arrangement of the pressure test mechanism, the test board and the test seat in the test method of the present invention.
圖12顯示本發明測試方法中之吸取治具吸取一待測物至測試座內之示意圖。FIG. 12 shows a schematic diagram of the suction fixture in the test method of the present invention sucking a test object into the test seat.
圖13顯示本發明測試方法中之利用馬達將壓力裝置、轉接件與吸取治具向下移動及施加一壓力於壓感器及待測物上之示意圖。FIG. 13 shows a schematic diagram of using a motor to move the pressure device, the adapter and the suction jig downward and apply a pressure on the pressure sensor and the object under test in the testing method of the present invention.
1:壓測機構1: Pressure testing mechanism
10:壓力裝置10: Pressure device
11:第一座體11: The first block
12:第二座體12: The second block
13:氣壓件13: pneumatic parts
14:移動件14: Moving parts
15:結合座15: Combination seat
20:吸取治具20: draw fixture
21:表面21: Surface
23:抽氣孔23: Exhaust hole
25:環槽25: ring groove
30:轉接件30: Adapter
31:第一表面31: The first surface
32:第二表面32: second surface
33:側面33: side
34:容置槽34: accommodating slot
35:底面35: Bottom
37:抽氣通道37: Exhaust channel
40:支撐結構40: Supporting structure
41:支撐套筒41: Support sleeve
42:連接件42: Connector
50:壓感器50: pressure sensor
52:感測凸部52: Sensing convex part
60:密封件60: Seal
115:氣壓孔115: Air pressure hole
151:第一表面151: First Surface
152:第二表面152: second surface
231:第一開口231: The first opening
371:第一通道口371: First Channel Port
372:第二通道口372: Second Channel Port
421:連接件之一端421: One end of the connecting piece
Claims (19)
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US4758785A (en) * | 1986-09-03 | 1988-07-19 | Tektronix, Inc. | Pressure control apparatus for use in an integrated circuit testing station |
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