CN101231964A - Semiconductor component voltage stabilization testing method and testing tool - Google Patents
Semiconductor component voltage stabilization testing method and testing tool Download PDFInfo
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- CN101231964A CN101231964A CN 200710004350 CN200710004350A CN101231964A CN 101231964 A CN101231964 A CN 101231964A CN 200710004350 CN200710004350 CN 200710004350 CN 200710004350 A CN200710004350 A CN 200710004350A CN 101231964 A CN101231964 A CN 101231964A
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Abstract
The invention provides a semiconductor element stable voltage testing method and a testing fixture thereof. The testing method is that after a lower squeeze head sucks a semiconductor element to be tested, and moves the semiconductor element to the testing fixture, and the semiconductor element is fixed, the lower squeeze head applies barotropic gas pressure and mechanical pressure inside and outside the semiconductor element to be tested so that the semiconductor element to be tested touches and is conductive to the testing fixture smoothly without warp; a testing system tests the functionality of the semiconductor element. The structure of the stable voltage testing fixture is that: a lower seat supported by a buffer spring is arranged in an underplate; the connecting ends on the tops of a plurality of pairs of probes in the lower seat do not protrude into the locating slot of the lower seat. By adopting the invention, as when the semiconductor element to be tested is pressed and falls down together with the lower seat, the probes protrude and touch the connection point on the bottom surface of the semiconductor element to be tested, the semiconductor element is not damaged easily during the testing process.
Description
Technical field
The present invention is about the method for testing and the equipment of semiconductor element, makes semiconductor element to be measured contact the measurement jig that carries out function detecting method and use thereof with probe under the voltage stabilizing state especially in regard to a kind of.
Background technology
For guaranteeing the semiconductor element product quality, product after semiconductor element structure dress is finished detects, in the structure process of assembling of semiconductor element, after specific structure dress technology, the step that also can detect the semi-finished product of semiconductor element, wherein because of after chip is attached to the step of substrate and electric connection, before the step of unshaped adhesive body coating chip, therefore whether class relationship the function of semiconductor element correct, so behind this structure dress processing step, promptly can carry out functional detection to the semiconductor element semi-finished product by a detection system.
The relevant test mode of utilizing detection system the semiconductor element semi-finished product to be carried out functional detection at present, as shown in Figures 7 and 8, mainly utilize a push-down head 80 to draw semiconductor element 90 semi-finished product to be measured with vacuum (negative pressure) suction type, in the location notch 71 of the measurement jig 70 of controlled again dislocation detection system, and it is imposed downward mechanical pressure, the plural contact of semiconductor element 90 semi-finished product bottom surfaces is contacted with corresponding probe 72 in the tool 70 respectively, secondly, carry out functional detection by system in the detection system by 72 pairs of semiconductor elements 90 to be measured of these probes, whether the function of judging semiconductor element 90 is correct, and after detecting, draw semiconductor element 90 dislocation prepositions by push-down head 80 again, and finish the detection of semiconductor element 90.
Yet, in the aforementioned known semiconductor element test process, because of push-down head 80 is drawn semiconductor element 90 dislocations to be measured behind measurement jig 70, soon directly press down semiconductor element 90, its bottom surface is contacted with the probe 72 that protrudes out tool 70 location notchs 71 bottom surfaces, wherein, push-down head 80 is for cooperating vacuum-pumping equipment and avoiding chip to be designed to hollow form, so only provide a mechanical pressure to semiconductor element 90 peripheral positions, the part probe 72 that then is subjected to stretching out tool 70 location notchs 71 bottom surfaces as for position, semiconductor element 90 inner circle imposes active force upwards, it is middle high to cause semiconductor element 90 to form, the warpage shape distortion that periphery is low, make chip on the semiconductor element 90, solder joint or passive component etc. split because of buckling deformation produces, peel off or situation such as displacement, influence the product quality and the rate of finished products of semiconductor element.
In addition, plural probe 72 tops in the measurement jig 70 all protrude out tool 70 location notchs 71 bottom surfaces, when push-down head 80 is drawn semiconductor element 90 dislocations to be measured in measurement jig 70, the contact of puncture semiconductor element 90 bottom surfaces is easily impacted on probe 72 tops, or make probe 72 impaired, the useful life of reducing these probes 72.
Summary of the invention
Main purpose of the present invention is to provide an a kind of semiconductor element voltage stabilizing method of testing and a voltage stabilizing measurement jig, when overcoming present semiconductor element test, because of the influence of improper active force being arranged down, defective such as chip in the semiconductor element to be measured or solder joint etc. are split or peel off.
For reaching above-mentioned purpose, technical scheme proposed by the invention includes a semiconductor element voltage stabilizing method of testing and a voltage stabilizing measurement jig, wherein, the step of semiconductor element voltage stabilizing method of testing comprises: utilize push-down head to pick up after semiconductor element to be measured moves in the measurement jig location with the negative-pressure adsorption means, stop the negative-pressure adsorption effect again, by push-down head the peripheral position of semiconductor element to be measured is imposed a downward mechanical pressure then, and provide a barotropic gas pressure to act on position, semiconductor element to be measured inner circle by push-down head inside, semiconductor element concora crush to be measured supported be affixed on measurement jig, plural probe in the tool is contacted with the corresponding contact in semiconductor element to be measured bottom surface, by described these probes semiconductor element to be measured is carried out functional detection by test macro again, whether the function of judging semiconductor element is correct, afterwards, stop mechanical compression and the malleation air feed of push-down head to semiconductor element, change and draw to detect the back semiconductor element with the negative pressure ventilation means and move to the pre-position, and finish the test jobs of semiconductor element.
In the aforesaid semiconductor element voltage stabilizing method of testing, when push-down head imposes mechanical compression and malleation supply gas pressure to semiconductor element, also can provide a rightabout and pressure stabilization function power by measurement jig, the strength size of pressure stabilization function power contacts semiconductor element to be measured plural probe following in the voltage stabilizing state and in the measurement jig between mechanical compression active force and barotropic gas pressure.
The voltage stabilizing measurement jig then comprises:
One pedestal comprises opening storage tank and several coupling holes up and is distributed in the storage tank bottom land, and pedestal can be stretched for the electrical connection carrier of test macro and establish wherein, makes the electrical connector that is electrically connected carrier be positioned at storage tank;
One probe location-plate is mounted in the storage tank of pedestal, and is resisted against on the electrical connection carrier, is provided with the place, periphery that plurality of probes location hole and number containing hole are distributed in described these probe location holes in the probe location-plate;
The number probes, what be inserted in the probe location-plate respectively respectively visits location hole, be electrically connected corresponding electrical connector in the carrier, and probe location-plate end face is stretched out in described these probe upper ends;
The number buffer spring installs respectively in the containing hole of probe location-plate, and probe location-plate end face is stretched out in its upper end;
One lower seat, be installed in and be positioned at probe location-plate top in the storage tank of pedestal, be described these its bottom surfaces of buffer spring jacking, but and and probe location-plate end face between keep the space of an oscilaltion activity, be provided with plural probe aperture in the lower seat, one location notch and plural registration holes, location notch is located at the lower seat top, and the laying scope that includes described these probe aperture is connected, described these probe aperture provide a probe correspondence to insert wherein respectively, and when lower seat does not descend, the end that touches of probe upper end does not protrude out to location notch, and described these registration holes are distributed in the peripheral place of location notch, and the position of the corresponding buffer spring of difference;
Count bolt, pass registration holes, the buffer spring of lower seat respectively, be locked in again in the coupling hole of pedestal.
In sum, the present invention is by the conceptual design of technique scheme, and its characteristics include at least:
1. with regard to method of testing: voltage stabilizing method of testing of the present invention is mainly when push-down head presses down dislocation in the semiconductor element of measurement jig, except that a mechanical pressure is provided, and import the barotropic gas pressure that a strength is slightly less than mechanical pressure by inside, in order to comprehensive payment measurement jig middle probe opposition, and can being pressed against reposefully, semiconductor element carries out functional detection in the tool, and can effectively avoid because of the influence of improper active force down, situation such as chip in the semiconductor element to be measured or solder joint etc. are split or peel off.
2. with regard to measurement jig:
Voltage stabilizing measurement jig proposed by the invention mainly utilizes a lower seat design by number buffer spring contact is set in the tool pedestal, making the plural probe upper end of being located in the lower seat touch end does not protrude in its location notch when lower seat does not move down, contact with the contact of semiconductor element bottom surface, and then avoid probe in semiconductor element dislocation tool, directly to impact and damage with described these probes.
Description of drawings
Fig. 1 is the schematic flow sheet of semiconductor element voltage stabilizing method of testing of the present invention;
Fig. 2 is the forward sight generalized section of first preferred embodiment of voltage stabilizing measurement jig of the present invention;
Fig. 3 is the first preferred embodiment schematic top plan view of voltage stabilizing measurement jig of the present invention;
Fig. 4 is the forward sight generalized section of second preferred embodiment of voltage stabilizing measurement jig of the present invention;
Fig. 5,6 is the user mode reference diagram of first preferred embodiment of voltage stabilizing measurement jig of the present invention;
Fig. 7,8 is for having semiconductor element now by the generalized section that detects in the measurement jig of dislocation test macro.
The main element symbol description:
1 measurement jig, 2 circuit support plates
3 battery lead plates, 4 contacts
5 probe connectors, 6 holding holes
7 semiconductor elements, 8 push-down heads
9 leads
10 pedestals, 11 storage tanks
12 fixing holes, 13 coupling holes
14 through holes, 15 upper pedestals
16 lower bases, 17 set bolts
18 sheath 19 through holes that are spirally connected
20 probe location-plates, 21 bolts
22 probe location holes, 23 containing holes
30 probes 31 touch end
40 buffer springs
50 lower seats, 51 probe aperture
52 location notchs, 53 registration holes
54 pedestals, 55 ring-type frameworks
56 linings, 57 activity spaces
60 bolts, 70 measurement jigs
71 location notchs, 72 probes
80 push-down heads, 90 semiconductor elements
Embodiment
As shown in Figure 1, disclose the schematic flow sheet of semiconductor element voltage stabilizing method of testing of the present invention, cooperation is consulted flow chart and can be learnt that semiconductor element voltage stabilizing method of testing comprises following steps:
One picks up after semiconductor element to be measured moves in the measurement jig book office location by push-down head with the negative-pressure adsorption means, stops the negative-pressure adsorption effect, and described negative pressure size is according to semiconductor element to be measured and set;
One mechanical compression means impose predetermined mechanical pressure by push-down head to the peripheral position of semiconductor element to be measured, and described mechanical pressure size is set according to semiconductor element to be measured;
One imposes predetermined gas pressure through push-down head to position, semiconductor element to be measured inner circle with malleation air feed means, and carry out synchronously with the mechanical compression means, the employed gas pressure of malleation air feed means is less than mechanical pressure, on the test job face of measurement jig, be straight not bending in order to guarantee that semiconductor element to be measured is smooth, and the contact that makes semiconductor element to be measured bottom surface contacts with corresponding probe in the test job face of measurement jig respectively, and can effectively avoid semiconductor element warpage to be measured, and make the chip on it, passive component or solder joint etc. split, peel off or problem such as displacement;
One carries out functional detection by the plural probe in the measurement jig to semiconductor element to be measured by test macro, judges whether the function of semiconductor element is correct;
And one stop the step of mechanical compression and malleation air feed, and change to draw with the negative pressure ventilation means and detect the back semiconductor element and move to the pre-position.
In the semiconductor element voltage stabilizing method of testing of the present invention, also can be when mechanical compression means and malleation air feed means be carried out, provide a rightabout pressure stabilization function power by measurement jig, the strength size of pressure stabilization function power between mechanical compression active force and barotropic gas pressure, guarantee semiconductor element to be measured in the voltage stabilizing state down with measurement jig in be positioned at test job face place plural probe contact.
As Fig. 2,3, shown in 4, disclose the floor map of two kinds of preferred embodiments of voltage stabilizing measurement jig of the present invention, by can see among the figure and, but the electrical connection carrier of voltage stabilizing measurement jig 1 winding test macro uses together, be electrically connected carrier and can be circuit support plate (Load Board) 2 (person as shown in Figure 2) or battery lead plate 3 (person as shown in Figure 4), and on the electrical connection carrier and have a plural electrical connector, wherein be electrically connected carrier when being circuit support plate 2, described these electrical connectors are the contact of being located on the circuit support plate 24, when the electrical connection carrier was battery lead plate 3, described these electrical connectors were then for being located at the probe connector 5 in the battery lead plate 3.
The composition structure of relevant voltage stabilizing measurement jig 1 of the present invention comprises a pedestal 10, a probe location-plate 20, number probe 30, number buffer spring 40, a lower seat 50 and number bolt 60, wherein:
Probe location-plate 20 is installed in the storage tank 11 of pedestal 10, be resisted against on battery lead plate 3 or the circuit support plate 2, and can further be fixed by number bolt 21, probe location-plate 20 is provided with plurality of probes location hole 22 and counts the place, periphery that containing hole 23 is distributed in described these probe location holes 22, described these probe location holes 22 also provide a probe 30 with its bottom installing wherein respectively, and described again these containing holes 23 provide buffer spring 40 to insert wherein.
Described these probes 30 are inserted in each probe location hole 22 of probe location-plate 20 respectively with its bottom, the upper end then protrudes upward probe location-plate 20 end faces respectively, wherein, preferred embodiment as shown in Figure 4, when probe location-plate 20 is installed in battery lead plate 3 end faces, make the corresponding probe connector 5 on described these probe 30 lower ends difference butt battery lead plates 3, preferred embodiment as shown in Figure 2, when probe location-plate 20 is located at circuit support plate 2 end faces, corresponding contact 4 on 30 difference of described these probes butt circuit support plate, 2 upper surfaces, and described these probe 30 upper ends have to touch holds 31, contacts the usefulness of conducting in order to the contact with semiconductor element to be measured bottom surface.
Described these buffer springs 40 are inserted respectively in the containing hole 23 of probe location-plate 20, and be resisted against (person as shown in Figure 2) on the circuit support plate 2 with the bottom, or downwards by behind battery lead plate 3 holding holes 6, be resisted against on storage tank 11 bottom surfaces of pedestal 10 (person as shown in Figure 4), described these buffer spring 40 upper ends are also stretched out probe location-plate 20 end faces respectively.
Aforesaid lower seat 50 can be a pedestal 54 and a ring-type framework 55 and is mounted on pedestal 54 end faces and constitutes, and the inner space that utilizes ring-type framework 55 is corresponding to semiconductor element shape to be measured, provide semiconductor element to be measured to insert the location notch 52 of location usefulness in order to formation, and composite type structure design whereby, make lower seat 50 can pass through to change the ring-type framework 55 of different size, and can be applicable to the usefulness of the semiconductor element detection of multiple different size.
Described these bolts 60 are locked in the coupling hole 13 of pedestal 10 after from top to bottom passing the registration holes 53, buffer spring 40, circuit support plate 2 (or battery lead plate 3) of lower seat 50 respectively.
Can install the no oil supply lining 56 that a wear-resistant material is made in each registration holes 53 of aforementioned lower seat 50, provide bolt 60 to pass wherein, after guaranteeing measurement jig 1 long-time the use, avoid because of the wearing and tearing off normal, in order to keep the accuracy of test jobs, can install the sheath 18 that is spirally connected again in the coupling hole 13 of pedestal 10, provide bolt 60 be spirally connected fixing wherein.
When the designed measurement jig of the present invention is applied to the semiconductor element test system, it is mounted on the board of test macro in conjunction with battery lead plate 3 or circuit support plate 2, and make described these probes directly or indirectly electrically connect test macro, embodiment with measurement jig 1 combined circuit support plate 2 is an example, shown in Fig. 5,6, its test process that is applied to semiconductor element is:
Utilizing push-down head to pick up semiconductor element to be measured with the negative-pressure adsorption means earlier moves in the location notch 52 of lower seat 50 of measurement jig 1 behind the location, stop the negative-pressure adsorption effect again, at this moment, because of described these probe 30 upper ends touch end 31 before lower seat 50 does not move down, do not protrude in the location notch 52 and contact, so can avoid described these probes thorns to hit semiconductor element bottom surface contact and damage with the contact of semiconductor element 7 bottom surfaces.
Secondly, impose a downward mechanical pressure by 8 pairs of semiconductor elements to be measured of push-down head, 7 peripheral positions, and provide a barotropic gas pressure to act on position, semiconductor element to be measured 7 inner circle by push-down head 8 inside, semiconductor element 7 to be measured is pressed against on the lower seat 50 reposefully, makes chip, passive component or solder joint etc. on it split, peel off so as to avoiding semiconductor element warpage to be measured or displacement etc.
Afterwards, further overcome again described these buffer springs 40 upwards the elastic force of contact lower seat 50 (mechanical pressure is greater than the elastic force of buffer spring 40, and elastic force is greater than barotropic gas pressure), and semiconductor element 7 to be measured is moved down in company with described these buffer springs 40 of lower seat 50 compressions, and then the end 31 that touches of described these probe 30 upper ends is contacted with the corresponding contact in semiconductor element to be measured 7 bottom surfaces, carry out functional detection by test macro by 30 pairs of semiconductor elements 7 to be measured of described these probes again, whether the function of judging semiconductor element 7 is correct, afterwards, stop mechanical compression and the malleation air feed of push-down head to semiconductor element 7, change and draw to detect back semiconductor element 7 with the negative pressure ventilation means and move to the pre-position, and finish the detection operation of semiconductor element.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when not limiting claim of the present invention with this, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (7)
1. a semiconductor element voltage stabilizing method of testing is characterized in that, described semiconductor element voltage stabilizing method of testing comprises following steps:
Utilize push-down head to pick up semiconductor element to be measured and move to book office location in the measurement jig, stop the negative-pressure adsorption effect again with the negative-pressure adsorption means;
Utilize push-down head the peripheral position of semiconductor element to be measured to be imposed a mechanical pressure with the mechanical compression means;
Utilize push-down head inside position, described semiconductor element to be measured inner circle to be imposed barotropic gas pressure with malleation air feed means, carry out synchronously with described mechanical compression means, the employed gas pressure of described malleation air feed means is less than mechanical pressure, make described semiconductor element to be measured smooth, the plural contact of described semiconductor element to be measured bottom surface is contacted with corresponding probe in the described test job face respectively in the test job face of measurement jig;
By the plural probe in the measurement jig described semiconductor element to be measured is carried out functional detection by test macro, judge whether the function of described semiconductor element is correct;
And stop mechanical compression and malleation air feed, and change and draw to detect the back semiconductor element with the negative pressure ventilation means and move to the pre-position.
2. semiconductor element voltage stabilizing method of testing according to claim 1, it is characterized in that, when mechanical compression means and malleation air feed means are carried out synchronously, also can provide a rightabout pressure stabilization function power by measurement jig, the strength size of described pressure stabilization function power contacts semiconductor element to be measured plural probe following in the voltage stabilizing state and in the measurement jig between mechanical compression active force and barotropic gas pressure.
3. a voltage stabilizing measurement jig in conjunction with the electrical connection carrier of test macro, electrically connects and the described electrical connector that is electrically connected carrier, and the usefulness of semiconductor element test is provided, and it is characterized in that described voltage stabilizing measurement jig comprises:
One pedestal comprises opening storage tank and several coupling holes up and is distributed in described storage tank bottom land, and described pedestal can be stretched for described electrical connection carrier and establish wherein, makes its electrical connector be positioned at storage tank;
One probe location-plate is mounted in the storage tank of described pedestal, and is resisted against on the described electrical connection carrier, is provided with the place, periphery that plurality of probes location hole and number containing hole are distributed in described these probe location holes in the described probe location-plate;
The number probes, what be inserted in described probe location-plate respectively respectively visits location hole, be electrically connected corresponding electrical connector in the described electrical connection carrier, and described probe location-plate end face is stretched out in described these probe upper ends;
The number buffer spring installs respectively in the containing hole of described probe location-plate, and probe location-plate end face is stretched out in its upper end;
One lower seat, be installed in and be positioned at described probe location-plate top in the storage tank of described pedestal, be described these its bottom surfaces of buffer spring jacking, but and and described probe location-plate end face between keep the space of an oscilaltion activity, be provided with plural probe aperture in the described lower seat, one location notch and plural registration holes, described location notch is located at described lower seat top, and the laying scope that includes described these probe aperture is connected, described these probe aperture provide a probe correspondence to insert wherein respectively, and when described lower seat does not descend, the end that touches of described probe upper end does not protrude out to location notch, described these registration holes are distributed in the peripheral place of described location notch, the position of a corresponding buffer spring respectively;
Count bolt, pass registration holes, the buffer spring of described lower seat respectively, be locked in again in the coupling hole of described pedestal.
4. voltage stabilizing measurement jig according to claim 3 is characterized in that, described lower seat is mounted on the described pedestal end face by a pedestal and a ring-type framework and is constituted, and the inner space of described ring-type framework forms described location notch.
5. according to claim 3 or 4 described voltage stabilizing measurement jigs, it is characterized in that installing has or not the oil supply lining in each registration holes of described lower seat, passes wherein for described bolt.
6. according to claim 3 or 4 described voltage stabilizing measurement jigs, it is characterized in that installing one sheath that is spirally connected provides described bolt spiral shell to establish wherein in the coupling hole of described pedestal.
7. voltage stabilizing measurement jig according to claim 5 is characterized in that, installing one sheath that is spirally connected provides described bolt spiral shell to establish wherein in the coupling hole of described pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710004350 CN101231964A (en) | 2007-01-23 | 2007-01-23 | Semiconductor component voltage stabilization testing method and testing tool |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710004350 CN101231964A (en) | 2007-01-23 | 2007-01-23 | Semiconductor component voltage stabilization testing method and testing tool |
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| CN101231964A true CN101231964A (en) | 2008-07-30 |
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| CN 200710004350 Pending CN101231964A (en) | 2007-01-23 | 2007-01-23 | Semiconductor component voltage stabilization testing method and testing tool |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102393479A (en) * | 2011-09-16 | 2012-03-28 | 晶能光电（江西）有限公司 | Damage-prevention jig for needle changing in point measurement machine |
| CN103675395A (en) * | 2012-09-05 | 2014-03-26 | 英华达（上海）科技有限公司 | Detection system and detection method for detecting current of voltage-stabilized component |
| CN105137315A (en) * | 2014-05-28 | 2015-12-09 | 株洲南车时代电气股份有限公司 | Thyristor chip gate testing tool |
| CN105405736A (en) * | 2015-12-01 | 2016-03-16 | 珠海宝丰堂电子科技有限公司 | Vacuum chamber device |
| CN108732394A (en) * | 2017-04-14 | 2018-11-02 | 致茂电子(苏州)有限公司 | Electronic element press connection device with pressure under difference |
| CN113238133A (en) * | 2020-01-22 | 2021-08-10 | 台湾福雷电子股份有限公司 | Pressure testing mechanism, testing equipment and testing method |
| CN115739690A (en) * | 2022-11-24 | 2023-03-07 | 深圳市安泽通科技发展有限公司 | LED patch detection device and detection method |
| CN116705653A (en) * | 2023-05-17 | 2023-09-05 | 中山市博测达电子科技有限公司 | Semiconductor chip sorting test system |
-
2007
- 2007-01-23 CN CN 200710004350 patent/CN101231964A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102393479A (en) * | 2011-09-16 | 2012-03-28 | 晶能光电（江西）有限公司 | Damage-prevention jig for needle changing in point measurement machine |
| CN102393479B (en) * | 2011-09-16 | 2017-04-12 | 晶能光电（江西）有限公司 | Damage-prevention jig for needle changing in point measurement machine |
| CN103675395A (en) * | 2012-09-05 | 2014-03-26 | 英华达（上海）科技有限公司 | Detection system and detection method for detecting current of voltage-stabilized component |
| CN103675395B (en) * | 2012-09-05 | 2016-06-08 | 英华达（上海）科技有限公司 | Measure detection system and the detection method of voltage stabilizing assembly electric current |
| CN105137315A (en) * | 2014-05-28 | 2015-12-09 | 株洲南车时代电气股份有限公司 | Thyristor chip gate testing tool |
| CN105137315B (en) * | 2014-05-28 | 2018-04-13 | 株洲南车时代电气股份有限公司 | A kind of thyristor chip gate pole test fixture |
| CN105405736B (en) * | 2015-12-01 | 2017-09-29 | 珠海宝丰堂电子科技有限公司 | Vacuum chamber device |
| CN105405736A (en) * | 2015-12-01 | 2016-03-16 | 珠海宝丰堂电子科技有限公司 | Vacuum chamber device |
| CN108732394A (en) * | 2017-04-14 | 2018-11-02 | 致茂电子(苏州)有限公司 | Electronic element press connection device with pressure under difference |
| CN113238133A (en) * | 2020-01-22 | 2021-08-10 | 台湾福雷电子股份有限公司 | Pressure testing mechanism, testing equipment and testing method |
| CN115739690A (en) * | 2022-11-24 | 2023-03-07 | 深圳市安泽通科技发展有限公司 | LED patch detection device and detection method |
| CN115739690B (en) * | 2022-11-24 | 2023-10-27 | 深圳市安泽通科技发展有限公司 | LED patch detection equipment and detection method |
| CN116705653A (en) * | 2023-05-17 | 2023-09-05 | 中山市博测达电子科技有限公司 | Semiconductor chip sorting test system |
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