CN113238133A - Pressure testing mechanism, testing equipment and testing method - Google Patents
Pressure testing mechanism, testing equipment and testing method Download PDFInfo
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- CN113238133A CN113238133A CN202110079527.8A CN202110079527A CN113238133A CN 113238133 A CN113238133 A CN 113238133A CN 202110079527 A CN202110079527 A CN 202110079527A CN 113238133 A CN113238133 A CN 113238133A
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- 238000012360 testing method Methods 0.000 title claims abstract description 125
- 230000007246 mechanism Effects 0.000 title claims abstract description 82
- 238000009530 blood pressure measurement Methods 0.000 claims abstract description 29
- 238000010998 test method Methods 0.000 claims abstract description 9
- 230000008878 coupling Effects 0.000 claims description 14
- 238000010168 coupling process Methods 0.000 claims description 14
- 238000005859 coupling reaction Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 8
- 238000005086 pumping Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 18
- 238000003825 pressing Methods 0.000 description 11
- 238000007789 sealing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Measuring Fluid Pressure (AREA)
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Abstract
The present disclosure relates to a pressure measurement mechanism, a test apparatus, and a test method. The pressure measuring mechanism comprises a pressure device, a suction jig, an adapter, at least one supporting structure and a pressure sensor. The suction jig and the pressure device are arranged at intervals. The adapter is arranged between the pressure device and the suction jig. The supporting structure is connected with the pressure device and the suction jig. The pressure sensor is arranged between the adapter piece and the pressure device.
Description
Technical Field
The present disclosure relates to a pressure test mechanism, a test apparatus, and a test method, and more particularly, to a pressure test mechanism, a test apparatus, and a test method for electrical testing.
Background
The existing pressure testing method of semiconductor chip or semiconductor package structure mainly comprises the steps of firstly sucking the semiconductor chip or semiconductor package structure onto a testing seat of a testing board through a sucking head, and then adjusting a floating air bag to apply pressure to the semiconductor chip or semiconductor package structure so as to enable the semiconductor chip or semiconductor package structure to be abutted against corresponding probes on the testing board for electrical testing. However, the pressure applied by the floating airbag is not equal to the pressure actually applied by the semiconductor chip or the semiconductor package, and therefore, when the semiconductor chip or the semiconductor package is damaged after being subjected to pressure measurement, it cannot be determined whether the semiconductor chip or the semiconductor package is damaged due to the excessive pressure of the pressure measurement.
Disclosure of Invention
In one embodiment, a pressure measurement mechanism includes a pressure device, a suction fixture, an adaptor, at least one support structure, and a pressure sensor. The suction jig and the pressure device are arranged at intervals. The adapter is arranged between the pressure device and the suction jig. The supporting structure is connected with the pressure device and the suction jig. The pressure sensor is arranged between the adapter piece and the pressure device.
In one embodiment, a testing apparatus includes a material separating device, a pressure testing mechanism, a testing circuit board and at least one testing seat. The pressure measuring mechanism is arranged on the material distributing device. The pressure measuring mechanism comprises a pressure device, a suction jig, an adapter, at least one supporting structure and a pressure sensor. The pressure device is connected with the material distributing device. The suction jig and the pressure device are arranged at intervals. The adapter is arranged between the pressure device and the suction jig. The supporting structure is connected with the pressure device and the suction jig. The pressure sensor is arranged between the adapter piece and the pressure device. The test circuit board corresponds to the pressure testing mechanism and is used for testing the object to be tested. The test seat is arranged on the test circuit board and used for containing the object to be tested, and the test seat corresponds to the suction jig of the pressure testing mechanism.
In one embodiment, a method of testing includes: providing a pressure testing mechanism, a testing circuit board and at least one testing seat, wherein the pressure testing mechanism comprises a pressure device, a suction jig, a switching piece and a pressure sensor, the suction jig and the pressure device are arranged at intervals, the switching piece is arranged between the pressure device and the suction jig, the pressure sensor is arranged between the switching piece and the pressure device, the testing circuit board corresponds to the pressure testing mechanism, the testing seat is arranged on the testing circuit board, and the testing seat corresponds to the suction jig of the pressure testing mechanism; sucking the object to be tested into the test seat by using the sucking jig; and downwards moving the pressure device, the adaptor and the suction jig by using a motor to apply pressure on the pressure sensor and the object to be tested, enabling the object to be tested to contact with the plurality of measuring probes of the test circuit board, and measuring the pressure value applied to the object to be tested by using the pressure sensor.
Drawings
Aspects of some embodiments of the present disclosure are readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and that the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion.
Fig. 1 shows an exploded perspective view of a pressure measurement mechanism according to an embodiment of the present disclosure.
Fig. 2 is an exploded perspective view of a pressure measurement mechanism according to an embodiment of the disclosure at a different viewing angle (opposite to the viewing angle of fig. 1).
Fig. 3 shows the combination of fig. 1.
Fig. 4 shows a top view of fig. 3.
Fig. 5 shows a perspective view of a support structure according to an embodiment of the disclosure.
Fig. 6 shows an exploded perspective view of a pressure measurement mechanism according to an embodiment of the present disclosure.
Fig. 7 shows an exploded perspective view of a pressure measurement mechanism according to an embodiment of the present disclosure.
Fig. 8 shows an exploded perspective view of a pressure measurement mechanism according to an embodiment of the present disclosure.
Fig. 9 shows a schematic diagram of a test apparatus of an embodiment of the present disclosure.
Fig. 10 is a top view illustrating an arrangement of a test circuit board, a test socket and an object under test according to an embodiment of the disclosure.
FIG. 11 shows a side view of the arrangement of the pressure testing mechanism, the testing board and the testing socket in the testing method of the present disclosure.
Fig. 12 is a schematic view illustrating the suction jig sucking the dut into the test socket according to the testing method of the present disclosure.
Fig. 13 is a schematic diagram illustrating the method of testing the present disclosure in which the pressure device, the adaptor and the suction jig are moved downward by the motor to apply pressure on the pressure sensor and the object to be tested.
Detailed Description
Common reference numbers are used throughout the drawings and the embodiments to indicate the same or similar components. Embodiments of the present disclosure will be more readily understood from the following detailed description in conjunction with the accompanying drawings.
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to illustrate specific aspects of the present disclosure. Of course, these components, values, operations, materials, and arrangements are merely examples and are not intended to be limiting. For example, in the description provided herein, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples provided herein. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Fig. 1 shows an exploded perspective view of a pressure measurement mechanism 1 according to an embodiment of the present disclosure. Fig. 2 is an exploded perspective view of the pressure measuring mechanism 1 according to an embodiment of the disclosure at a different viewing angle (a viewing angle opposite to that of fig. 1). Fig. 3 shows the combination of fig. 1. Fig. 4 shows a top view of fig. 3. Referring to fig. 1 to 4, a pressure measuring mechanism 1 of the present disclosure includes a pressure device 10, a suction jig 20, an adaptor 30, at least one supporting structure 40, a pressure sensor 50, and a sealing member 60.
The pressure device 10 includes a first seat 11, a second seat 12, an air pressure member 13, a moving member 14 and a coupling seat 15. The first seat 11 has an air pressure hole 115, the air pressure hole 115 penetrates through the first seat 11, and the air pressure hole 115 can be connected to an air pressure source to provide air pressure input. The second seat 12 is combined with the first seat 11. In an embodiment, the second seat 12 can be fixed to the first seat 11 by screws or bolts.
The pneumatic part 13 is disposed between the first seat 11 and the second seat 12. In an embodiment, the air pressure hole 115 of the first seat 11 corresponds to the air pressure member 13, so that the air pressure inputted through the air pressure hole 115 can directly push the air pressure member 13. In one embodiment, the pneumatic member 13 may be an elastic piece (e.g., a silicone elastic piece or a rubber elastic piece), so that the pneumatic member 13 (i.e., the elastic piece) can generate a downward bending action when pushed by air pressure. That is, the middle portion of the pneumatic member 13 (i.e., the elastic piece) is expanded when pushed by the air pressure, and forms an arc-shaped protrusion.
The moving part 14 is connected to the second seat 12, and the moving part 14 corresponds to the pneumatic part 13. In an embodiment, the moving part 14 penetrates through the second seat 12, and one end (or one surface) of the moving part 14 can abut against the pneumatic part 13, so that the pneumatic part 13 can synchronously push the moving part 14 when pushed by air pressure. For example, when the middle portion of the pneumatic piece 13 is pushed by air pressure to bulge, the middle portion of the pneumatic piece 13 can push against the middle portion of the moving piece 14 to push the moving piece 14.
The coupling seat 15 is connected to the moving member 14. In one embodiment, the combining seat 15 has a first surface 151, a second surface 152 and a plurality of receiving grooves 153. The first surface 151 faces the second seat 12. The second surface 152 is opposite to the first surface 151. The receiving groove 153 is concavely disposed on the second surface 152.
The sucking jig 20 is spaced apart from the pressure device 10 for sucking the object to be tested. In one embodiment, the suction jig 20 has a surface 21, a suction hole 23, and a ring groove 25. Said surface 21 facing said pressure means 10. The air suction hole 23 penetrates through the suction jig 20, and the air suction hole 23 has a first opening 231 and a second opening 232. The first opening 231 is exposed at the surface 21. The second opening 232 is opposite to the first opening 231. The ring groove 25 is recessed in the surface 21, and the ring groove 25 surrounds the first opening 231 of the pumping hole 23.
The adaptor 30 is disposed between the pressure device 10 and the suction jig 20 for connecting the pressure device 10 and the suction jig 20, and the adaptor 30 can be connected to the suction jigs 20 of different sizes or different specifications. In one embodiment, the adaptor 30 has a first surface 31, a second surface 32, a side surface 33, a receiving groove 34 and a suction channel 37. The first surface 31 faces the pressure device 10 (e.g., the second surface 152 of the coupling seat 15). The second surface 32 is opposite to the first surface 31. The side surface 33 extends between the first surface 31 and the second surface 32. The receiving groove 34 is concavely disposed on the first surface 31, and the receiving groove 34 has a bottom surface 35 therein. The receiving groove 34 is a blind hole, which does not penetrate through the adaptor 30.
The suction channel 37 connects the second surface 32 and the side surface 33, and the suction channel 37 has a first channel opening 371 and a second channel opening 372. The first channel 371 corresponds to the air-extracting hole 23 (e.g., the first opening 231) of the suction fixture 20. The second opening 372 is exposed at the side surface 33. In one embodiment, the second opening 372 of the pumping channel 37 can be connected to a pumping device, so that the vacuum suction force generated by the pumping device can act on the object to be tested through the pumping channel 37 and the pumping holes 23 of the suction jig 20. In an embodiment, the coupling seat 15 may be disposed between the second seat 12 and the adaptor 30.
Fig. 5 shows a perspective view of a support structure 40 according to an embodiment of the disclosure. Referring to fig. 1, fig. 4 and fig. 5, the at least one supporting structure 40 connects the pressure device 10 and the suction jig 20, and the at least one supporting structure 40 penetrates through the adaptor 30. In one embodiment, the at least one support structure 40 includes a support sleeve 41 and a connector 42. The support sleeve 41 extends through the adaptor 30 such that the adaptor 30 can move up and down along the support sleeve 41. The connecting member 42 (e.g., a screw) penetrates through the suction jig 20 and the supporting sleeve 41, and one end 421 of the connecting member 42 is connected to the combining seat 15 of the pressure device 10, so as to limit the adaptor 30 between the pressure device 10 and the suction jig 20. Since the adapter 30 can move up and down along the support sleeve 41, the tightness problem of the connection member 42 (e.g., a screw) can be further eliminated.
Referring again to fig. 1, 2 and 4, the pressure sensor 50 is disposed between the adaptor 30 and the pressure device 10. In an embodiment, the pressure sensor 50 may be disposed in the receiving groove 34 of the adaptor 30. The pressure sensor 50 has a sensing protrusion 52, the sensing protrusion 52 faces the pressure device 10 (e.g., the coupling seat 15), and a pressure value is measured by pressing the sensing protrusion 52. In one embodiment, the pressure sensor 50 may be a Load cell (Load cell).
The sealing member 60 is disposed between the suction jig 20 and the adaptor 30, and is used for maintaining a vacuum degree between the air suction hole 23 of the suction jig 20 and the air suction channel 37 of the adaptor 30. In one embodiment, the sealing member 60 can be disposed on the annular groove 25 of the suction jig 20, and the sealing member 60 surrounds the suction hole 23 (e.g., the first opening 231) of the suction jig 20. In one embodiment, the seal 60 may be a sponge seal ring or a plastic seal ring.
The pressure sensor 50 is arranged in the pressure measurement mechanism 1, so that the pressure value applied to the object to be measured can be measured in real time in the pressure measurement process, and the object to be measured is prevented from being damaged due to overlarge pressure during pressure measurement. And if the object to be detected is damaged after pressure measurement, whether the damage reason of the object to be detected is caused by overlarge pressure of the pressure measurement or the self factor of the object to be detected can be judged.
Fig. 6 shows an exploded perspective view of a pressure measuring mechanism 1a according to an embodiment of the present disclosure. The pressure measuring mechanism 1a of fig. 6 is substantially the same as the pressure measuring mechanism 1 of fig. 1 to 5, except that the pressure measuring mechanism 1a of fig. 6 further includes a buffer member 70. As shown in fig. 6, the buffer member 70 is disposed between the pressure sensor 50 and the pressure device 10, and the sensing protrusion 52 of the pressure sensor 50 abuts against the buffer member 70. In one embodiment, at least a portion of the buffer member 70 is disposed in the receiving groove 34 of the adaptor member 30. The buffer member 70 can prevent the pressure device 10 (e.g., the coupling seat 15) from directly pressing the sensing protrusion 52 of the pressure sensor 50, which causes the wear of the sensing protrusion 52.
Fig. 7 shows an exploded perspective view of the pressure measuring mechanism 1b according to an embodiment of the present disclosure. The pressure measuring mechanism 1b of fig. 7 is substantially the same as the pressure measuring mechanism 1a of fig. 6, and differs only in the arrangement of the pressure sensor 50a of fig. 7. As shown in fig. 7, the sensing protrusion 52 of the pressure sensor 50a is located in the receiving groove 34 of the adaptor 30, and the sensing protrusion 52 abuts against the bottom surface 35 in the receiving groove 34.
Fig. 8 shows an exploded perspective view of a pressure measuring mechanism 1c according to an embodiment of the present disclosure. The pressure measuring mechanism 1c of fig. 8 is substantially the same as the pressure measuring mechanism 1 of fig. 1 to 5, except that the accommodation groove 34 is omitted from the adaptor 30a of fig. 8. As shown in fig. 8, the adaptor 30a has a protrusion 36, and the protrusion 36 is protruded from the first surface 31. And the pressure sensor 50c is disposed between the protrusion 36 of the adaptor 30a and the pressure device 10 (e.g., the coupling seat 15). In an embodiment, the pressure sensor 50c may be attached to the protruding portion 36 of the adaptor 30a, and the pressure sensor 50c may be a Thin film pressure sensor (Thin film pressure sensor).
Fig. 9 shows a schematic diagram of a test apparatus 9 of an embodiment of the present disclosure. Fig. 10 shows a top view of the arrangement of the test circuit board 4, the test socket 5 and the object 8 to be tested according to an embodiment of the disclosure. Referring to fig. 9 and 10, the testing apparatus 9 of the present disclosure includes a material separating device 2, a pressing mechanism (e.g., pressing mechanism 1), a testing machine 3, a testing circuit board 4, and at least one testing seat 5.
The pressure measuring mechanism (such as the pressure measuring mechanism 1) is arranged on the material distributing device 2. The pressure measuring mechanism may be the pressure measuring mechanism 1 of fig. 1 to 4, the pressure measuring mechanism 1a of fig. 6, the pressure measuring mechanism 1b of fig. 7, or the pressure measuring mechanism 1c of fig. 8. As shown in fig. 9, the pressure device 10 of the pressure measuring mechanism 1 is connected to the motor 6 of the feed divider 2.
Referring again to fig. 9 and 10, the testing machine 3 corresponds to the motor 6 of the feed divider 2. In one embodiment, the testing machine 3 is disposed below the motor 6. The tester 3 can set and adjust test conditions for an object 8 to be tested (e.g., a semiconductor chip or a semiconductor package).
The test circuit board 4 is disposed on the testing machine 3 and electrically connected to the testing machine 3. In addition, the test circuit board 4 corresponds to the pressure measurement mechanism 1 and is used for testing the object to be tested 8. In one embodiment, the test circuit board 4 has a plurality of measurement probes 7 for testing the object 8.
The at least one test seat 5 is disposed on the test circuit board 4 for accommodating and positioning the object 8 to be tested, and the test seat 5 corresponds to the suction jig 20 of the pressure testing mechanism 1.
In one embodiment, the testing machine 3 may utilize programming language to control the data acquisition of the measurement probe 7 (including, but not limited to, controlling the operation of the pressure device 10 and receiving test signal data from the measurement probe 7).
The following detailed description of the test methods of the present disclosure is not intended to limit the disclosure to the embodiments disclosed herein.
Referring to fig. 11, a side view of the arrangement of the pressure testing mechanism, the testing board and the testing socket in the testing method of the present disclosure is shown. Step (a) of the testing method of the present disclosure is to provide a pressure testing mechanism, a test circuit board 4 and at least one test socket 5. The pressure measuring mechanism may be the pressure measuring mechanism 1 of fig. 1 to 4, the pressure measuring mechanism 1a of fig. 6, the pressure measuring mechanism 1b of fig. 7, or the pressure measuring mechanism 1c of fig. 8. The following description will describe the test method using the pressure measuring mechanism 1 of fig. 1 to 4, but not limited thereto.
As shown in fig. 1 to 4, the pressure measuring mechanism 1 includes a pressure device 10, a suction jig 20, an adaptor 30, at least one support structure 40, a pressure sensor 50, and a sealing member 60.
The pressure device 10 includes a first seat 11, a second seat 12, an air pressure member 13, a moving member 14 and a coupling seat 15. The first seat 11 has an air pressure hole 115, the air pressure hole 115 penetrates through the first seat 11, and the air pressure hole 115 can be connected to an air pressure source to provide air pressure input. The second seat 12 is combined with the first seat 11. The pneumatic part 13 is disposed between the first seat 11 and the second seat 12. In an embodiment, the air pressure hole 115 of the first seat 11 corresponds to the air pressure member 13, so that the air pressure inputted through the air pressure hole 115 can directly push the air pressure member 13. The moving part 14 is connected to the second seat 12, and the moving part 14 corresponds to the pneumatic part 13. In one embodiment, one end of the moving member 14 may abut against the pneumatic pressing member 13, so that the pneumatic pressing member 13 can synchronously push the moving member 14 when being pushed by air pressure. The coupling seat 15 is connected to the moving member 14.
The sucking jig 20 is spaced apart from the pressure device 10 for sucking the object to be tested. The adaptor 30 is disposed between the pressure device 10 and the suction jig 20 for connecting the pressure device 10 and the suction jig 20, and the adaptor 30 can be connected to the suction jigs 20 of different sizes or different specifications. The at least one supporting structure 40 connects the pressure device 10 and the suction jig 20, and the at least one supporting structure 40 penetrates through the adaptor 30.
The pressure sensor 50 is disposed between the adaptor 30 and the pressure device 10. In an embodiment, the pressure sensor 50 may be disposed in the receiving groove 34 of the adaptor 30. The pressure sensor 50 has a sensing protrusion 52, the sensing protrusion 52 faces the pressure device 10 (e.g., the coupling seat 15), and a pressure value is measured by pressing the sensing protrusion 52. In one embodiment, the pressure sensor 50 is a Load cell (Load cell). The sealing member 60 is disposed between the suction jig 20 and the adaptor 30, and is used for maintaining a vacuum degree between the air suction hole 23 of the suction jig 20 and the air suction channel 37 of the adaptor 30.
Referring again to fig. 11, the pressure measuring mechanism 1 may be connected to a motor 6, and the motor 6 is used for moving the pressure measuring mechanism 1. The test circuit board 4 corresponds to the pressure measurement mechanism 1. The at least one test seat 5 is disposed on the test circuit board 4, and the test seat 5 corresponds to the suction jig 20 of the pressure measurement mechanism 1. In one embodiment, as shown in fig. 9, the test circuit board 4 may be disposed on the testing machine 3 and electrically connected to the testing machine 3. In one embodiment, the test circuit board 4 has a plurality of measurement probes 7 for obtaining test data.
Referring to fig. 12, a schematic diagram of the absorption fixture absorbing the object to be tested into the test socket in the testing method of the present disclosure is shown. In the testing method of the present disclosure, in the step (b), the object 8 to be tested (e.g., a semiconductor chip or a semiconductor package) is sucked into the testing seat 5 by the sucking jig 20. In step (b), the sucking and placing operation of the object to be measured 8 is performed in cooperation with the motor 6 and the pressing means 10.
Referring to fig. 13, a schematic diagram of the pressure device, the adaptor and the suction jig moving downward and applying pressure on the pressure sensor and the object to be tested by using the motor in the testing method of the present disclosure is shown. Step (c) of the testing method of the present disclosure is to move the pressure device 10, the adaptor 30 and the suction jig 20 downward by using the motor 6 to apply pressure on the pressure sensor 50 (e.g., the sensing protrusion 52) and the object 8 to be tested, and make the object 8 to be tested contact with the measuring probe 7 of the test socket 5, and measure the pressure value applied to the object 8 to be tested by the pressure sensor 50. In step (c), the pneumatic part 13 and the moving part 14 may be driven by the pneumatic pressure 92, so that the moving part 14 moves the adaptor 30 and the sucking jig 20 downward, thereby adjusting the pressure applied to the object 8. The tightness of the connection 42, e.g., a screw, is further eliminated because the adapter 30 is movable up and down along the at least one support structure 40, e.g., the support sleeve 41.
In one embodiment, the pneumatic pressing member 13 may be a resilient piece (e.g., a silicone resilient piece or a rubber resilient piece), so that the pneumatic pressing member 13 (i.e., the resilient piece) bends downward when pushed by the air pressure 92, and pushes one end of the moving member 14 to move the moving member 14.
In the pressure measurement process, the pressure sensor 50 can measure the pressure value applied to the object 8 to be measured in real time, so as to avoid the object 8 to be measured from being damaged due to the overlarge pressure of the pressure measurement. If the object 8 is still damaged after the test is completed, it can be determined that the damage is caused by the self-factor of the object 8, not the excessive pressure factor of the pressure test.
The above-described embodiments are merely illustrative of the principles and utilities of the present disclosure and are not limiting, therefore, modifications and variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit of the disclosure. The scope of the disclosure is to be determined by the following claims.
Claims (19)
1. A pressure measurement mechanism, comprising:
a pressure device;
the suction jig is arranged at a distance from the pressure device;
the adapter is arranged between the pressure device and the suction jig;
at least one supporting structure which is connected with the pressure device and the suction jig; and
and the pressure sensor is arranged between the adapter piece and the pressure device.
2. The pressure measuring mechanism according to claim 1, wherein the pressure device includes a first seat, a second seat, a pneumatic member, and a moving member, the first seat has a pneumatic hole, the pneumatic hole penetrates through the first seat, the second seat is coupled to the first seat, the pneumatic member is disposed between the first seat and the second seat, and the pneumatic hole corresponds to the pneumatic member, the moving member is coupled to the second seat, and the moving member corresponds to the pneumatic member.
3. The pressure measuring mechanism according to claim 2, wherein the pressure device further comprises a coupling seat, the coupling seat is disposed between the second seat and the adaptor, and the coupling seat is connected to the moving member.
4. The pressure measurement mechanism of claim 3, wherein the coupling seat has a surface facing the adapter and a plurality of receiving grooves recessed in the surface.
5. The pressure measurement mechanism of claim 1, wherein the adaptor has a first surface facing the pressure device and a receiving groove recessed into the first surface, and the pressure sensor is disposed in the receiving groove of the adaptor.
6. The pressure measurement mechanism of claim 5, wherein the pressure sensor has a sensing protrusion, the sensing protrusion being located within the receiving slot of the adaptor.
7. The pressure measuring mechanism of claim 5, further comprising a buffer member disposed between the pressure sensor and the pressure device.
8. The pressure measurement mechanism of claim 1, wherein the adapter has a first surface facing the pressure device and a protrusion protruding from the first surface, the pressure sensor being disposed between the protrusion of the adapter and the pressure device.
9. The pressure measurement mechanism of claim 1, wherein the adapter has a first surface facing the pressure device, a second surface opposite the first surface, a side surface extending between the first surface and the second surface, and a pumping channel communicating the second surface and the side surface.
10. The pressure measurement mechanism of claim 1, wherein the at least one support structure extends through the adapter.
11. The pressure measurement mechanism of claim 1, wherein the at least one support structure comprises a support sleeve and a connector, the support sleeve penetrates through the adaptor, the connector penetrates through the suction fixture and the support sleeve, and one end of the connector is connected to the pressure device.
12. The pressure measurement mechanism of claim 1, further comprising a seal disposed between the suction fixture and the adaptor.
13. A test apparatus, comprising:
a material distributing device;
pressure measuring mechanism, it install in feed divider, pressure measuring mechanism includes:
the pressure device is connected with the material distributing device;
the suction jig is arranged at a distance from the pressure device;
the adapter is arranged between the pressure device and the suction jig;
at least one supporting structure which is connected with the pressure device and the suction jig; and
the pressure sensor is arranged between the adapter piece and the pressure device;
the test circuit board corresponds to the pressure testing mechanism and is used for testing the object to be tested; and
at least one test seat, it is set up on the said test circuit board, in order to hold the said test object, and the said test seat corresponds to the said absorption fixture of the said pressure testing mechanism.
14. The test apparatus as claimed in claim 13, wherein the adaptor has a first surface facing the pressure device and a receiving groove recessed in the first surface, the pressure sensor being disposed in the receiving groove of the adaptor.
15. The test apparatus of claim 13, wherein the adapter has a first surface facing the pressure device and a protrusion protruding from the first surface, the pressure sensor being disposed between the protrusion of the adapter and the pressure device.
16. The test apparatus of claim 13, wherein the adapter has a first surface facing the pressure device, a second surface opposite the first surface, a side surface extending between the first surface and the second surface, and a suction channel communicating the second surface and the side surface.
17. A method of testing, comprising:
(a) providing a pressure testing mechanism, a testing circuit board and at least one testing seat, wherein the pressure testing mechanism comprises a pressure device, a suction jig, a switching piece and a pressure sensor, the suction jig and the pressure device are arranged at intervals, the switching piece is arranged between the pressure device and the suction jig, the pressure sensor is arranged between the switching piece and the pressure device, the testing circuit board corresponds to the pressure testing mechanism, the testing seat is arranged on the testing circuit board, and the testing seat corresponds to the suction jig of the pressure testing mechanism;
(b) sucking the object to be tested into the test seat by using the sucking jig; and
(c) and the pressure device, the adapter piece and the suction jig are moved downwards by using a motor to apply pressure to the pressure sensor and the object to be tested, the object to be tested is contacted with the plurality of measuring probes of the test circuit board, and the pressure value applied to the object to be tested is measured by the pressure sensor.
18. The testing method of claim 17, wherein in step (a), the pressure testing mechanism further comprises at least one supporting structure, and the at least one supporting structure connects the pressure device and the suction fixture; in step (c), the adaptor is moved up and down along the at least one support structure.
19. The test method according to claim 17, wherein in the step (a), the pressure device comprises a first seat, a second seat, a pneumatic member, and a moving member, the second seat is combined with the first seat, the pneumatic member is disposed between the first seat and the second seat, the moving member is connected to the second seat, and the moving member corresponds to the pneumatic member; and step (c) comprises:
(c1) and driving the pneumatic part and the moving part by using air pressure so as to enable the moving part to move the adaptor part and the suction jig downwards.
Applications Claiming Priority (2)
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TW109102437A TWI733318B (en) | 2020-01-22 | 2020-01-22 | Press testing mechanism, testing apparatus and testing method |
TW109102437 | 2020-01-22 |
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TWI733318B (en) | 2021-07-11 |
TW202129290A (en) | 2021-08-01 |
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