1286864 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種測試治具之壓板模組，特別 關於-種可調整高度之測試治具之塵板模組。 ’、有 【先前技術】 習知一半導體封裝構造係至少包含一基板、至少一曰 片以及複數個電連接元件，當該晶片與該些電連接元件；： 設置於該基板後’該半導體封裝構造必須被送至測試廢 仃各項測試，以確保該半導體封裝構造係為正常運 各項測試巾，皆必須將該料體封裝構造@定於機台上 否則會造成測試錯誤甚至破壞該半導體封襞構造σ之产 形’因此’機台中用以固定該半導體封裝構造： 測試機台中重要之一環。 馬 如第1圖所示，習知-測試治具之壓板模組1〇〇係包 含有-基貞110、一溫度感測元件12〇以及一密合墊圈 130 '、中該基座110係、具有一氣體流道111，如第2圖所 示，該測試治具之壓板模組1〇〇係以該基座u〇觸壓一待 測物10，且使該溫度感測元件12〇接觸該待測物之一 晶片11，以及使該密合墊圈13〇接觸該待測物10之一基 板12，其中該密合墊圈13〇係使該測試治具之壓板模組 100與該待測物1〇之間形成一氣密空間，一真空抽取設備 (圖未緣出）係藉由該氣體流道1 π進行抽真空步驟以吸 取該待測物10進行測試，該溫度感測元件12〇係連接至 一線路121，該線路121係將該溫度感測元件12〇所偵測 1286864 之該待測物10之該晶片12之溫度訊號傳遞給一動態溫度 • 控制系統（Active Temperature Controller，ATC )(圖未繪 出），並藉由該動態溫度控制系統來調控該待測物丨〇之溫 度以使該待測物10之溫度保持在一定值，以利各項測試 步驟之進行，其中該線路121係位於該基座11〇之一線路 通道112内。如第2圖所示，由於該壓板模組1〇〇係為一 體成型，因此當該壓板模組100觸壓該待測物1〇時，常 • 因壓力過大或該真空抽取設備之吸力太強，而使該壓板模 組100之該基座110撞擊該待測物10之該晶片u，導致 該晶片11發生碎裂或角隅損壞之情形。或者，如第3圖 所示，當該晶片11之厚度較薄時，當該壓板模組1〇〇壓 觸該待測物10時，該密合墊圈13〇係已接觸該基板Η， 而該溫度感測元件120卻未接觸該晶片u，導致該晶片 11之正確溫度與該溫度感測元件12〇之所感測之溫度並不 鲁 相同，因此為因應不同厚度之待測物需備製不同尺寸之壓 板模組’使得測試成本亦相對增加。 【發明内容】 ， 本發明之主要目的係在於提供一種測試治具之壓板 模組，一擋止件係設置於一基座之一凹穴内，藉由位於該 基座與該擋止件間之一彈性元件使該擋止件緊密接觸一 待測物。 依據本發明，一種測試治具之壓板模組，其係用以固 定一待測物並量測該待測物之溫度，該壓板模組係包含一 基座、一擋止件以及一彈性元件。該基座係具有一凹穴， 6 1286864 =止=:置於該凹穴内’該擔止件係具有-溫度感測 二止=Γ件係位於該基座與該擂缚之間，以頂推 該^止件伸出於該凹穴，另該麼板模組係包含複數個固定 兀件，以調整該檔止件伸出於該凹穴的 【實施方式】 請參閱第4圖，本發明之一具體實施例係揭示一種測 =治具之壓板模組200,其係用以固定_待測物ι〇並孩測 該待測物之溫度，該壓板模組2GG係包含_基座21〇、 一擋止件220以及—彈性元件23G。該基座21〇係固定於 一測試機台之—測試頭（圖未繪出），該基座21G係具有 一凹穴2U ’該擋止件22〇係設置於該凹穴2ιι内，該彈 性元件230係位於該基座21〇與該擋幻牛22〇之間，該彈 性元件230係可為一 i縮彈簧，並且該彈性元件23〇係用 以頂推該擋止件220,以使該擋止件顯露於該凹穴2ΐι外， 其中該彈性元件23〇之彈簧線徑與彈性Μ可依照該待測 物1〇所能承受之壓力值來選擇/在本實施例中，該壓板 模組200係另包含有複數個固定元件24〇，例如螺絲，該 -固疋元件240係接合於該基座21 〇，且該些、固定元件240 係位於該凹穴211之外侧，當該彈性元件230頂推該擋止 件220時’該些固定元件24〇係用以限制該擋止件22〇脫 出該基座210之該凹穴211，即該擋止件22〇之移動距離 係被限位於該彈性元件23 〇與該些固定元件240之間，當 未進行測試時’該彈性元件23〇係頂推該擋止件220使其 接觸該些固定元件240。此外’由於本實施例中之該些固 7 1286864 定元件240係為螺絲，因此可依照該待測物ι〇所能承受 之壓力值調整該些固定元件240與該基座210之螺合深 度。該擋止件220係具有一溫度感測元件22 1用以偵測該 待測物10之一晶片11之溫度，在本實施例中，該擋止件 220係具有一第一線路通道223，該基座210係具有一第 二線路通道214，該第一線路通道223係對應該第二線路 通道214，該擋止件220之該溫度感測元件221係連接至 一線路221 a，其中該線路221 a係穿設於該第一線路通道 223與該第二線路通道214，較佳地，該第一線路通道223 之直徑D1係小於該第二線路通道214之直握D 2，可避免 該壓板模組200之該擋止件220於該基座210之該凹穴211 内移動時產生位移差距而對該線路221a造成損壞。請參 閱第5圖，其係為該壓板模組2〇〇之底視圖，在本實施例 中’該基座210係具有一對位孔213，該擋止件22〇係具 一對位元件222，藉由該對位元件222對位嵌合於該對位 孔2 13，以利該基座21 〇之該第二線路通道2丨4順利連通 該擋止件220之該第一線路通道223，以使該溫度感測元 件221之該線路221a能穿設於該第二線路通道214與該 第一線路通道223。在本實施例中，該線路221a係將該溫 度感測元件221所偵測之溫度訊號傳遞至一動態溫度控制 系統（Active Temperature Controller，ATC)(圖未繪出）， 該動態溫度控制系統之功能係在於進行各項測試時使該 待測物10之溫度保持為一定值。 請參閱第4及6圖，該壓板模組200係另包含有一密 1286864 合墊圈250,該基座210係包含一氣體流道2i2，該密合 墊圈250係設置於該基座21〇。當進行測試時，該擋止件 220係接觸該待測物10之該晶片u，該密合墊圈25〇係 接觸該待測物10之一基板12，以使該壓板模組2〇〇與該 涛刺物10之間形成一氣密空間，其中該密合墊圈25〇係 為『口』型或『0』型等封閉之幾何形狀，以利一真空抽 取設備（圖未繪出）藉由該氣體流道212吸取該待測物10 進行測試步驟。 接著請參閱第7圖，該真空抽取設備（圖未繪出）係 藉由該氣體流道212吸取該待測物1〇，該待測物1〇之該 晶片11係壓觸該擋止件220,使得該擋止件22〇縮入該凹 六211中，以避免因該測試治具之壓板模組2〇〇過度施壓 或該真空抽取設備之吸力太強而造成該待測物1〇之該晶 片11損壞’此外，在本實施例中，由於該第一線路通道 223之直徑D1係小於該第二線路通道214之直徑D2，因 馨 此當該擋止件220被觸壓縮入該凹穴211中時，該線路 22 la不會因該擋止件22〇在該基座21〇之該凹穴211内移 動而造成該線路221a被該擋止件220與該基座210破壞。 在本實施例中’該第二線路通道214之一開口端214 a係 可以一密封膠260填滿，以防止氣體經由該第二線路通道 214流動而造成該真空抽取設備無法吸取該待测物1〇。 請參閱第8圖，當該待測物1 〇之該晶片丨丨較薄時， 依照該待測物10之該晶片n所能承受之壓力值調整該些 固定元件240與該基座210之螺合深度，並可選擇不同彈 9 1286864 > 彼與彈性k值之該彈性元件23〇，以避免該擋止件220 展該待測物10之該晶片U，在本實施例中，藉由調整 一固定元件240與該基座210之螺合深度，以利該擋止 件220觸壓該晶片u，並使該溫度感測元件221能接觸該 待測物1 〇之該晶片i!，以偵測該晶片i i之正確溫度。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 • 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 第1圖··一種習知測試治具之壓板模組之截面示意圖。 第2圖：習知測試治具之壓板模組壓觸至一待測物且損壞 該待測物之一晶片之截面示意圖。 第3圖·習知測試治具之壓板模組壓觸至該待測物但無法 侦測該待測物之該晶片溫度之截面示意圖。 •帛4圖：依據本發明之一具體實施例，一種測試治具之壓 板模組之截面示意圖。 第5圖··依據本發明之一具體實施例，該測試治具之壓板 模組之底視圖。 第6圖·依據本發明之一具體實施例，該測試治具之壓板 模組預接觸一待測物之截面示意圖。 第7圖·依據本發明之一具體實施例，該測試治具之壓板 模、纟且完全接觸該待測物之截面示意圖。 第8圖·依據本發明之一具體實施例，該測試治具之壓板 10 1286.864 模組完全接觸晶片厚度較薄之該待測物之截面 示意圖。 【主要元件符號說明】 10 待測物 11 晶片 12 基板 100 壓板模組 110 基座 111 氣體流道 112 線路通道 120 溫度感測元件 121 線路 130 密合墊圈 200 壓板模組 210 基座 211 凹穴 212 氣體流道 213 對位孔 214 第二線路通道 214a 開口端 220 擋止件 221 溫度感測元件 221a 線路 222 對位元件 223 第一線路通道 230 彈性元件 240 固定元件 250 密合墊圈 260 密封膠 D1 第一線路通道直徑 D2 第二線路通道直徑 111286864 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a pressure plate module for a test fixture, and more particularly to a dust plate module for a height-adjustable test fixture. A prior art semiconductor package structure includes at least a substrate, at least one gusset, and a plurality of electrical connection components, and the semiconductor and the electrical connection components are disposed on the substrate. The structure must be sent to the test waste test to ensure that the semiconductor package structure is normal for each test towel, and the material package structure must be set on the machine, otherwise it will cause test errors or even damage the semiconductor. The structure of the sealing structure σ is thus used to fix the semiconductor package structure in the machine: one of the important rings in the test machine. As shown in FIG. 1 , the pressure plate module 1 of the conventional test fixture comprises a base 110, a temperature sensing element 12〇, and a close gasket 130′, wherein the base 110 is And having a gas flow path 111, as shown in FIG. 2, the pressure plate module 1 of the test fixture is pressed against the object to be tested 10 by the base u, and the temperature sensing element 12 is turned on. Contacting one of the wafers 11 of the object to be tested, and bringing the sealing gasket 13 into contact with one of the substrates 12 of the object to be tested 10, wherein the sealing gasket 13 is used to hold the pressure plate module 100 of the test fixture An airtight space is formed between the measuring objects, and a vacuum pumping device (not shown) is subjected to a vacuuming step by the gas flow path 1 π to suck the test object 10 for testing. The temperature sensing element 12 is tested. The system is connected to a line 121, which transmits the temperature signal of the wafer 12 of the object 10 to be detected by the temperature sensing component 12 to a dynamic temperature control system (Active Temperature Controller, ATC) (not shown), and the dynamic temperature control system is used to regulate the object to be tested Degrees so that the temperature of the object 10 remains at a constant value, in order to facilitate the conduct of a test step, wherein the line 121 lines located in one of the base line channel 112 11〇. As shown in FIG. 2, since the pressure plate module 1 is integrally formed, when the pressure plate module 100 touches the object to be tested, the pressure is too large or the suction force of the vacuum extraction device is too The susceptor 110 of the platen module 100 strikes the wafer u of the object to be tested 10, causing the wafer 11 to be chipped or damaged. Or, as shown in FIG. 3, when the thickness of the wafer 11 is thin, when the platen module 1 is pressed against the object to be tested 10, the close-fitting gasket 13 has contacted the substrate, and The temperature sensing element 120 does not contact the wafer u, so that the correct temperature of the wafer 11 is not the same as the temperature sensed by the temperature sensing element 12, and therefore, it is required to prepare the object to be tested according to different thicknesses. Different sizes of platen modules' have led to a relatively high cost of testing. SUMMARY OF THE INVENTION The main object of the present invention is to provide a pressure plate module for testing a fixture. A stopper is disposed in a recess of a base, and is located between the base and the stopper. An elastic member brings the stopper into close contact with an object to be tested. According to the present invention, a pressure plate module for testing a fixture is used for fixing a test object and measuring the temperature of the object to be tested, and the pressure plate module includes a base, a stopper and an elastic component. . The base has a recess, 6 1286864 = stop =: placed in the recess 'the support member has - temperature sensing two = the element is located between the base and the tie, to top Pushing the stop member to protrude from the recess, and the board module includes a plurality of fixed jaws to adjust the stopper to protrude from the recess. [Embodiment] Please refer to FIG. 4, One embodiment of the invention discloses a pressure plate module 200 for measuring a fixture, which is used for fixing a _substance ι and measuring the temperature of the object to be tested, and the platen module 2GG includes a pedestal 21〇, a stop 220 and an elastic element 23G. The base 21 is fixed to a test machine (test head (not shown)), and the base 21G has a recess 2U. The stop 22 is disposed in the recess 2, The elastic member 230 is located between the base 21 and the block, and the elastic member 230 is a spring, and the elastic member 23 is used to push the stop 220 to The stopper is exposed to the recess 2, wherein the spring diameter and the elastic Μ of the elastic member 23 are selected according to the pressure value of the object to be tested 1 / in the embodiment, The platen module 200 further includes a plurality of fixing members 24, such as screws, and the fixing member 240 is coupled to the base 21, and the fixing members 240 are located outside the recess 211. When the elastic member 230 pushes the stopper 220, the fixing members 24 are used to restrict the stopper 22 from coming out of the pocket 211 of the base 210, that is, the movement of the stopper 22 The distance is limited between the elastic member 23 〇 and the fixing members 240. When the test is not performed, the elastic member 23〇 Pushing the stop member 220 into contact with the plurality of fixing member 240. In addition, since the fixing member 240 of the embodiment is a screw, the screwing depth of the fixing member 240 and the base 210 can be adjusted according to the pressure value that the object to be tested can withstand. . The stopper 220 has a temperature sensing component 22 1 for detecting the temperature of the wafer 11 of the object to be tested 10 . In the embodiment, the stopper 220 has a first line channel 223 . The base 210 has a second line channel 214 corresponding to the second line channel 214. The temperature sensing element 221 of the block 220 is connected to a line 221a. The line 221a is disposed through the first line channel 223 and the second line channel 214. Preferably, the diameter D1 of the first line channel 223 is smaller than the straight line D2 of the second line channel 214, which can be avoided. When the stopper 220 of the platen module 200 moves in the recess 211 of the base 210, a displacement gap is generated to damage the line 221a. Please refer to FIG. 5 , which is a bottom view of the pressure plate module 2 . In the embodiment, the base 210 has a pair of position holes 213 , and the stop member 22 has a pair of position components. The second line channel 2 丨 4 of the pedestal 21 顺利 is smoothly connected to the first line channel of the blocking member 220 by the alignment of the aligning element 222 in the aligning hole 2 13 . 223 , so that the line 221 a of the temperature sensing component 221 can pass through the second line channel 214 and the first line channel 223 . In this embodiment, the line 221a transmits the temperature signal detected by the temperature sensing component 221 to an Active Temperature Controller (ATC) (not shown), and the dynamic temperature control system The function is to keep the temperature of the analyte 10 at a certain value when performing various tests. Referring to Figures 4 and 6, the platen module 200 further includes a dense 1286864 gasket 250. The base 210 includes a gas flow passage 2i2, and the gasket 250 is disposed on the base 21〇. When the test is performed, the blocking member 220 contacts the wafer u of the object to be tested 10, and the sealing gasket 25 contacts the substrate 12 of the object to be tested 10 to make the platen module 2 An airtight space is formed between the spurs 10, wherein the close-fitting washer 25 is a closed geometry such as a "mouth" type or a "0" type to facilitate a vacuum extraction device (not shown). The gas flow path 212 draws the test object 10 for a test step. Referring to FIG. 7, the vacuum extraction device (not shown) draws the object to be tested 1 by the gas flow path 212, and the wafer 11 of the object to be tested 1 is pressed against the stopper. 220, the stop member 22 is retracted into the concave portion 211 to avoid excessive pressure applied by the pressure plate module 2 of the test fixture or the suction force of the vacuum extraction device is too strong to cause the object to be tested 1 The wafer 11 is damaged. Further, in the embodiment, since the diameter D1 of the first line channel 223 is smaller than the diameter D2 of the second line channel 214, the stopper 220 is pressed into the body. In the recess 211, the line 22 la is not damaged by the stopper 22 and the base 210 due to the movement of the stopper 22 in the recess 211 of the base 21〇. . In the present embodiment, the open end 214a of the second line channel 214 can be filled with a sealant 260 to prevent gas from flowing through the second line channel 214, thereby causing the vacuum extraction device to not pick up the object to be tested. 1〇. Referring to FIG. 8 , when the wafer 丨丨 of the object to be tested is thin, the fixing elements 240 and the susceptor 210 are adjusted according to the pressure value of the wafer n of the object 10 to be tested. The depth of the screwing is selected, and the elastic member 23 弹性 of the elastic k value is selected to prevent the blocking member 220 from spreading the wafer U of the object to be tested 10, in this embodiment, The depth of the screwing of the fixing component 240 and the base 210 is adjusted, so that the stopper 220 touches the wafer u, and the temperature sensing component 221 can contact the wafer i of the object to be tested 1! To detect the correct temperature of the wafer ii. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are protected by the present invention. range. [Simple description of the drawings] Fig. 1 is a schematic cross-sectional view of a pressure plate module of a conventional test fixture. Fig. 2 is a schematic cross-sectional view showing a wafer of a test piece of the test fixture pressed against a sample to be tested and damaged. Fig. 3 is a schematic cross-sectional view showing the temperature of the wafer in which the pressure plate module of the test fixture is pressed against the object to be tested but cannot detect the object to be tested. • Figure 4: A schematic cross-sectional view of a pressure plate module of a test fixture in accordance with an embodiment of the present invention. Figure 5 is a bottom view of the platen module of the test fixture in accordance with an embodiment of the present invention. Fig. 6 is a cross-sectional view showing a pre-contact of a test piece of the test fixture according to an embodiment of the present invention. Figure 7 is a schematic cross-sectional view of the test piece of the test fixture in accordance with an embodiment of the present invention. Figure 8 is a cross-sectional view of the test piece of the test fixture according to an embodiment of the present invention. The 10138.864 module of the test fixture is completely in contact with the thinner wafer. [Main component symbol description] 10 DUT 11 Wafer 12 Substrate 100 Platen module 110 Base 111 Gas flow path 112 Line channel 120 Temperature sensing element 121 Line 130 Closed washer 200 Platen module 210 Base 211 Pocket 212 Gas flow path 213 alignment hole 214 second line channel 214a open end 220 stopper 221 temperature sensing element 221a line 222 alignment element 223 first line channel 230 elastic element 240 fixing element 250 close gasket 260 sealant D1 One line channel diameter D2 second line channel diameter 11