TWI639005B - Testing system for semiconductor package component and its thermal barrier layer element - Google Patents

Abstract

A detection system for a semiconductor package component includes a test circuit board, a test pedestal, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base is adapted to receive an assay component. The probe pin is located on the test base to contact the component under test. The thermal barrier layer component is located between the test circuit board and the test pedestal, electrically connected and thermally insulated from the probe pin and the electrical contact.

Description

Semiconductor package component detection system and thermal barrier layer component thereof

The invention relates to a detection system, in particular to a detection system for a semiconductor package component.

In general, semiconductor package components (eg, semiconductor package wafers) are electrically tested after fabrication to ensure the quality of the semiconductor package components at the time of shipment. When performing electrical detection, the component (DUT) is placed on the test socket of a detecting device, so that the end of the component (such as the solder ball) is electrically connected to the test circuit board ( Load board), thereby electrically testing the component under test.

However, when performing high-temperature detection on the component under test, the tester often finds that the actual temperature of the component under test on the test pedestal is significantly lower than the set temperature of the test device, resulting in insufficient accuracy of the test data for the high-temperature test, so the component under test cannot The detection is performed in an environment of a predetermined temperature.

Therefore, how to develop a solution to improve the above The lack of inconvenience and inconvenience is an important issue that the relevant industry is currently unable to delay.

One embodiment of the present invention provides a thermal barrier layer component of a detection system. The thermal barrier layer component includes an insulating pad and at least one electrically conductive insulating portion. The conductive heat insulating portion is formed on the insulating mat, and the conductive heat insulating portion has an aerogel containing a carbon nanotube or has a silicone containing a carbon nanotube.

In one or more embodiments of the present invention, the insulating mat includes a pad body and at least one receiving area formed in the pad body and connected to the opposite surfaces of the pad body, and the conductive heat insulating portion is integrally formed in the receiving area. Inside.

In one or more embodiments of the invention, the insulating mat includes a pad body and at least a consistent aperture. The through hole penetrates the pad body and connects the opposite surfaces of the pad body, and the conductive heat insulating portion covers one surface and the through hole.

In one or more embodiments of the present invention, when there are at least one conductive heat insulating portion, the conductive heat insulating portions are spaced apart on the insulating mat.

In one or more embodiments of the invention, the electrically conductive thermally insulating portions are arranged in a matrix.

In one or more embodiments of the invention, the surface of the electrically conductive insulating portion has a recessed groove.

Another embodiment of the present invention provides a detection system for a semiconductor package component. The detection system includes a test circuit board, a test base, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base is adapted to receive an assay component. The probe pin is located on the test base for electrically connecting the component to be tested and the electrical contact. Thermal barrier element is located on the probe pin Between the electrical contact and the electrical contact, the probe pin and the electrical contact electrically reduce the heat transfer between the probe pin and the electrical contact.

In one or more embodiments of the invention, the thermal barrier layer component includes an insulating pad and at least one electrically conductive insulating portion. The insulating mat is sandwiched between the test board and the test pedestal. The conductive heat insulating portion is formed on the insulating pad and directly sandwiched between the electrical contact and the probe pin for thermally blocking the probe pin and the electrical contact.

In one or more embodiments of the present invention, the insulating mat includes a pad body and at least one receiving area formed in the pad body and connected to the opposite surfaces of the pad body, and the conductive heat insulating portion is integrally formed in the receiving area. Inside.

In one or more embodiments of the invention, the insulating mat includes a pad body and at least a consistent aperture. The through hole penetrates the pad body and connects the opposite surfaces of the pad body, and the conductive heat insulating portion covers one surface and the through hole, and the probe pin protrudes into the through hole and contacts the conductive heat insulating portion.

In one or more embodiments of the present invention, when the conductive heat insulating portion, the at least one electrical contact and the probe pin are respectively plural, the conductive heat insulating portions are spaced apart on the insulating mat, and each conductive heat insulating portion Do not be clamped between one of the electrical contacts and one of the probe pins.

In one or more embodiments of the invention, the electrically conductive thermally insulating portions are arranged in a matrix.

In one or more embodiments of the present invention, the surface of the conductive heat insulating portion has a recessed groove, and the probe pin protrudes into the recessed groove.

In one or more embodiments of the invention, the electrically conductive insulating portion has an aerogel comprising a carbon nanotube or a silicone comprising a carbon nanotube.

Another embodiment of the present invention provides a semiconductor package component Detection system. The detection system includes a test circuit board, a test base, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base has a recess. The recess is for receiving a component to be tested. The probe pin is located on the test base for electrically connecting the component to be tested and the electrical contact. The thermal barrier layer element is located within the recess and covers the probe pin for electrically guiding the probe pin and the test component and at least slowing heat transfer between the probe pin and the test component.

Thus, with the detection system described in the above embodiments, since the thermal barrier layer component is interposed between the probe pin and the electrical contact, or between the probe pin and the test component, the test base and the test component The heat received does not quickly dissipate in the direction of the test board, which not only reduces the chance of the test data of the component being tested, but also ensures that the heat does not harm the test board.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10, 11, 12, 13‧‧‧ Inspection system

100‧‧‧Test circuit board

101‧‧‧One side of the test circuit board

110‧‧‧Electrical contacts

200‧‧‧Test base

210‧‧‧ Groove

211‧‧‧ underside of the groove

220‧‧‧ pipeline

300, 301, 302, 303‧ ‧ thermal barrier elements

310‧‧‧Insulation mat

311‧‧‧The body

311A‧‧‧ first surface

311B‧‧‧ second surface

312‧‧‧ accommodating area

313‧‧‧through holes

320‧‧‧Electrical insulation

321‧‧‧recessed trough

322‧‧‧ curved bottom surface

400‧‧‧Probe pin

410‧‧‧Upper end

420‧‧‧ lower end

500‧‧‧Distributed arm

600‧‧‧heater

700‧‧‧temperature sensor

800‧‧‧Inspected components

810‧‧‧Endpoint

A1, A2, M‧‧‧ areas

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 1 is a partial enlarged view of a region M of FIG. 1; FIG. 3 is a partial exploded view of FIG. 2; FIG. 4 is a top view of the thermal barrier layer of FIG. 1; A partially enlarged view of a detection system according to an embodiment of the present invention; and a sixth enlarged view of the detection system according to an embodiment of the present invention; Figure 7 is a side elevational view of a detection system in accordance with an embodiment of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and for the purpose of illustration However, it should be understood that these practical details are not intended to limit the invention. That is to say, in the hollow body embodiment of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

In view of the fact that the actual temperature of the above semiconductor package component (hereinafter referred to as the test component) on the test pedestal is significantly lower than the set temperature of the detection system, the test data of the test component is not accurate enough, and the inventor proves the test base after the experiment. The thermal energy of the seat and the tested component is partially dissipated toward the test circuit board by the guidance of the probe pin connected between the test base and the test circuit board, resulting in the actual location of the test component and the test pedestal. The temperature cannot be approximated or equivalent to the set temperature of the detection device. In view of the above, the present invention provides a detection system with a thermal barrier design that can at least slow down the heat transfer between the component under test and the test circuit board, thereby allowing the component to be inspected in a predetermined temperature environment, thereby improving the Verify the accuracy of the test data of the component at high temperature.

1 is a side elevational view of a detection system 10 in accordance with an embodiment of the present invention. Fig. 2 is a partial enlarged view of a region M of Fig. 1. Fig. 3 is a partial exploded view of Fig. 2. As shown in FIG. 1 to FIG. 3 , in the present embodiment, the semiconductor package component detection system 10 includes a test circuit board 100 , a test pedestal 200 , a thermal barrier layer component 300 , and a plurality of probe pins . 400. Test board 100 has a plurality of electrical contacts 110. The electrical contacts 110 are spaced apart from one side 101 of the test circuit board 100. Test base 200 has a recess 210. The recess 210 is for receiving a semiconductor package component (for example, a semiconductor package wafer, hereinafter referred to as the test component 800). These probe pins 400 are located on the test pedestal 200 and are spaced apart within the test pedestal 200. Each probe pin 400 passes through the conduit 220 of the test base 200 such that one end of each probe pin 400 (i.e., the upper end 410 of the probe pin 400) extends into the recess 210 or at least from the bottom surface 211 of the recess 210. Upon exposure, the other end (i.e., the lower end 420 of the probe pin 400) abuts the thermal barrier element 300. The probe pin 400 includes a pogo pin, but is not limited thereto. The thermal barrier layer component 300 is located between the test circuit board 100 and the test pedestal 200, and can not only electrically connect the probe pin 400 and the electrical contact 110, but also can at least slow down the probe pin 400 and the electrical contact 110. The heat transfer between.

In this embodiment, in detail, the thermal barrier layer component 300 includes an insulating pad 310 and a plurality of conductive heat insulating portions 320. Each insulating pad 310 is located between the test circuit board 100 and the test pedestal 200. The conductive heat insulating portion 320 is formed on the insulating pad 310 and directly sandwiched between one of the electrical contacts 110 and one of the probe pins 400 for thermally blocking the probe pin 400 and the electrical contact 110. More specifically, the insulating mat 310 includes a pad body 311 and a plurality of receiving areas 312. The pad body 311 has a first surface 311A and a second surface 311B opposite to each other, and the first surface 311A faces the test circuit board 100. The receiving areas 312 are formed in the pad body 311 at intervals, and each of the receiving areas 312 connects the first surface 311A and the second surface 311B of the pad body 311. Each of the electrically conductive insulating portions 320 is integrally formed within the receiving area 312. The area A1 of the pad body 311 between any two receiving areas 312 is respectively aligned with the area A2 between any two electrical contacts 110.

In the present embodiment, when the thermal barrier layer component 300 is formed, the formed conductive thermal insulation portions 320 are first arranged in a mold, and then the liquid material of the insulating mat 310 is filled in the mold. After the insulating mat 310 is solidified and formed, the thermal barrier layer elements 300 having the same thickness or different thicknesses can be obtained after the mold is opened, wherein each of the conductive heat insulating portions 320 is filled in the receiving area 312, and is respectively first with the mat body 311. The surface 311A is flush with the second surface 311B.

As in Figures 1 and 2, the detection system 10 further includes a handler test arm 500. The dispensing arm 500 is configured to move a different test component 800 to the test pedestal 200 and remove the tested component 800 on the test pedestal 200 after testing is complete. Thus, when the hand test arm 800 places an expedited component 800 into the recess 210, the plurality of end points 810 of the component 800 (such as solder ball) are contacted one by one. The upper end portion 410 of the test device 800 is electrically connected to one of the electrical contacts 110 of the test circuit board 100 through the probe pin 400 and the conductive heat insulating portion 320 of the corresponding position. .

During the test, since the thermal barrier layer component 300 is sandwiched between the test circuit board 100 and the test pedestal 200, the thermal barrier layer component 300 can thermally block the probe pins 400 from the test circuit board 100, or at least The heat transfer between the probe pin 400 and the electrical contact 110 can be slowed down, so that the thermal energy received by the test susceptor 200 (including the component 800) is not quickly dissipated through the probe pin 400. In this way, not only is the opportunity for the test data of the component 800 to be less accurate, but also the thermal energy is not damaged to the test circuit board 100.

In addition, the detection system 10 further includes a heater 600 and a temperature sensor 700. The heater 600 is located on the dispensing arm 500 for the test base 200 (including the component 800 in question) is heated to a preset temperature to control the ambient temperature at the location of the test pedestal 200 (including the component 800 in question). Temperature sensor 700 is located in dispensing arm 500 or test pedestal 200 (not shown) for sensing the temperature of subject 800. However, the present invention is not necessarily limited to having a heater and a temperature sensor if only the test circuit board is not subjected to thermal energy damage.

4 is a top view of the thermal barrier layer element 300 of FIG. 1. As shown in FIG. 4, the conductive heat insulating portions 320 are spaced apart from each other on the insulating pad 310. For example, but not limited to, the conductive heat insulating portions 320 are arranged in a matrix on the insulating pad 310. However, the present invention is not limited to the arrangement of the conductive heat insulating portions 320 as long as the arrangement of the end points 810 of the test element 800, the probe pins 400, and the electrical contacts 110 of the test circuit board 100 is matched. In addition, the insulating pads 310 are rectangular, and the conductive heat insulating portions 320 are circular, and the area of the insulating pads 310 is not larger than the area of the bottom surface of the test pedestal 200. However, the present invention is not limited to the insulating pads 310 and the conductive heat insulating portion 320. The shape and the area of the insulating mat 310.

In the present embodiment, the material of the conductive heat insulating portion 320 is a carbon nanotube aerogel, which is an aerogel containing a carbon nano tube. Carbon tube aerogels are extremely light and elastic solid materials. Because of its strong structure, the carbon tube aerogel can support more than 100 times its weight. Carbon tube aerogel has a large number of holes (not more than 100 nm), and its pores are widely distributed and have good gas permeability. In addition, unlike other aerogels, carbon nanotube aerogels can be electrically connected to the conductors on either side of any of the above-mentioned conductive heat insulating portions because of the chain nature of the carbon nanotube aerogel. Conductive at the same time can also block heat transfer to provide good thermal barrier.

However, the present invention is not limited thereto as long as it can simultaneously conform to conduction and Insulation (or low thermal conductivity), the material of the conductive insulation can also be a carbon nanotube rubber, that is, a silicone having a carbon nanotube.

FIG. 5 is a partial enlarged view of the detecting system 11 according to an embodiment of the present invention. As shown in Fig. 5, the thermal barrier layer element 301 of Fig. 5 is substantially the same as the thermal barrier layer element 300 of Fig. 2, and the same components are denoted by the same reference numerals. However, the thermal barrier layer element 301 of FIG. 5 differs from the thermal barrier layer element 300 of FIG. 2 in that at least one or each of the electrically conductive thermally insulating portions 320 has a recessed groove 321 facing the surface of the probe pin 400. The recessed groove 321 has a curved bottom surface 322, and the curved bottom surface 322 is connected to the second surface 311B of the pad body 311. The probe pin 400 extends into the recessed groove 321 and abuts against the curved bottom surface 322 of the recessed groove 321 . Since the curved bottom surface 322 has a certain curvature, the protruding probe pin 400 is not easily separated from the position of the conductive heat insulating portion 320 so as to be positioned at the corresponding conductive heat insulating portion 320, thereby maintaining the electrical conduction performance.

Figure 6 is a partial enlarged view of the detection system 12 in accordance with an embodiment of the present invention. As shown in Fig. 6, the thermal barrier layer element 302 of Fig. 6 is substantially the same as the thermal barrier layer element 300 of Fig. 2, and the same components are denoted by the same reference numerals. However, the thermal barrier layer element 302 of FIG. 6 differs from the thermal barrier layer element 300 of FIG. 2 in that the insulating pad 310 includes a pad body 311 and a plurality of through holes 313. The pad body 311 has a first surface 311A and a second surface 311B opposite to each other, and the first surface 311A faces the test circuit board 100. The through holes 313 are spaced apart from each other on the pad body 311, and each of the through holes 313 is connected to the first surface 311A and the second surface 311B of the pad body 311. Each of the conductive heat insulating portions 320 covers the first surface 311A and the through holes 313 such that each of the probe pins 400 protrudes into the corresponding through hole 313 and contacts the corresponding conductive heat insulating portion 320. Since the probe pin 400 can be effectively confined within the through hole 313, The corresponding probe pin 400 is brought into contact with the corresponding conductive heat insulating portion 320 so as not to be easily separated from the conductive heat insulating portion 320, thereby maintaining electrical conduction performance.

In addition, at least one or each of the conductive heat insulating portions 320 in the embodiment may have a recessed groove 321 as shown in FIG. 5 to reduce the probe pin 400 to the corresponding conductive heat insulating portion 320. The chance to slide on.

FIG. 7 is a side elevational view of the detection system 13 in accordance with an embodiment of the present invention. As shown in Fig. 7, the detecting system 13 of Fig. 7 is substantially the same as the detecting system 10 of Fig. 1, and the same components are denoted by the same reference numerals, and the difference is that the thermal barrier layer element 303 of Fig. 7 is not the first one. The thermal barrier layer component 300 is located between the test circuit board 100 and the test pedestal 200, but the thermal barrier layer component 303 is located on the bottom surface 211 of the recess 210 and covers the probe pins 400 for electrical conduction. The probe pin 400 is coupled to the subject element 800 and at least slows heat transfer between the probe pin 400 and the subject element 800.

Thus, when a component 800 is placed in the recess 210, the thermal barrier layer 303 is directly between the component 800 and the probe pins 400 such that each conductive insulator 320 is directly positioned Between one of the end points 810 of the component 800 and one of the probe pins 400, that is, each of the conductive insulating portions 320 contacts one of the upper end portions 410 of the probe pin 400 and one of the end points 810 of the tested component 800 (eg, Solder ball). At this time, since the lower end portion 420 of each probe pin 400 directly contacts one of the electrical contacts 110 of the test circuit board 100, each end point 810 of the test component 800 can pass through the conductive heat insulating portion 320 of the corresponding position. The electrical contact 110 of the test circuit board 100 is electrically connected to the probe pin 400.

During the test, since the thermal barrier layer element 303 is clamped to the test Between the component 800 and the probe pin 400, the thermal energy received by the test pedestal 200 (including the component to be tested 800) can be effectively prevented from being quickly dissipated through the probe pins 400, and the test data of the component 800 is not reduced accurately. The opportunity also ensures that thermal energy does not harm the test board 100.

Moreover, in this embodiment, the detection system 13 is also configured with a suitable positioning mechanism such that the thermal barrier layer element 303 is secured within the recess 210 so as not to be brought up or displaced as the detection process. The positioning mechanism fixes the thermal barrier layer element 303 to the bottom surface 211 of the recess 210, for example, by means of clamping or bonding. However, the invention is not limited thereto.

It should be understood that the present invention has the general knowledge that the thermal barrier layer element 303 of FIG. 7 can be changed to the thermal barrier layer elements 300-302 of FIG. 2, FIG. 5 and FIG. 6 in response to any need and limitation. .

Thus, with the detection system described in the above embodiments, whether the thermal barrier layer component is interposed between the probe pin and the electrical contact, or between the probe pin and the test component, the test pedestal and the The thermal energy received by the component can be ensured that it does not quickly dissipate in the direction of the test board, which not only reduces the chance of the test data of the high temperature detection of the component being affected, but also ensures that the thermal energy does not harm the test board.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (11)

A detection system for a semiconductor package component, comprising: a test circuit board having at least one electrical contact; a test base for accommodating a test component; at least one probe pin located on the test pedestal Electrically connecting the device to be tested and the electrical contact; and a thermal barrier layer between the probe pin and the electrical contact, electrically connecting the probe pin to the electrical contact a point for at least slowing heat transfer between the probe pin and the electrical contact. The detection system of claim 1, wherein the thermal barrier layer component comprises: an insulating pad sandwiched between the test circuit board and the test pedestal; and at least one electrically conductive insulating portion formed on the The insulating pad is directly sandwiched between the electrical contact and the probe pin for thermally blocking the probe pin and the electrical contact. The detecting system of claim 2, wherein the insulating pad comprises a pad body and at least one receiving area formed in the pad body and connected to two opposite surfaces of the pad body, wherein the conductive heat insulating portion is integrated Formed in the receiving area. The detecting system of claim 2, wherein the insulating pad comprises a pad body and at least a consistent hole, the through hole penetrating the pad body and connecting the pad The opposite surface of the body, wherein the conductive heat insulating portion covers one of the two opposite surfaces and the through hole, and the probe pin protrudes into the through hole and contacts the conductive heat insulating portion. The detection system of claim 2, wherein the at least one electrically conductive insulating portion, the at least one electrical contact, and the at least one probe pin are respectively plural, and the electrically conductive insulating portions are spaced apart from the insulating And each of the conductive heat insulating portions is respectively sandwiched between one of the electrical contacts and one of the probe pins. The detecting system of claim 5, wherein the conductive heat insulating portions are arranged in a matrix manner. The detecting system of claim 2, wherein the surface of the conductive heat insulating portion has a recessed groove, and the probe pin protrudes into the recessed groove. The detecting system according to claim 2, wherein the conductive heat insulating portion has an aerogel containing a carbon nanotube or has a silicone containing a carbon nanotube. A detection system for a semiconductor package component, comprising: a test circuit board having at least one electrical contact; a test base having a recess for receiving a test component; at least one probe pin, Located on the test pedestal for electrically connecting the tested component to the electrical contact; a thermal barrier layer member located in the recess covering the probe pin for electrically guiding the probe pin and the test component, and at least slowing down between the probe pin and the test component heat transfer. The detection system of claim 9, wherein the thermal barrier layer component comprises: an insulating pad sandwiched between the test circuit board and the test pedestal; and at least one electrically conductive insulating portion formed on the The insulating pad is directly sandwiched between the electrical contact and the probe pin for thermally blocking the probe pin and the electrical contact. The detecting system according to claim 10, wherein the conductive heat insulating portion has an aerogel containing a carbon nanotube or has a silicone containing a carbon nanotube.