TW202412212A - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
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- TW202412212A TW202412212A TW112105116A TW112105116A TW202412212A TW 202412212 A TW202412212 A TW 202412212A TW 112105116 A TW112105116 A TW 112105116A TW 112105116 A TW112105116 A TW 112105116A TW 202412212 A TW202412212 A TW 202412212A
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Abstract
本發明實施例的一種半導體裝置包括封裝基底、封裝組件及至少一個黏合圖案。封裝組件上具有熱介面材料(TIM)層。黏合圖案具有面對封裝基底的第一表面及與第一表面相對的第二表面,且所述至少一個黏合圖案的第二表面與熱介面材料層的表面實質上共面。
Description
本發明實施例是有關於一種半導體裝置。
由於各種電子組件(例如,電晶體、二極體、電阻器、電容器等)的積體密度的不斷提高,半導體行業已經歷快速發展。在很大程度上,積體密度的此種提高源於最小特徵大小(minimum feature size)的反復減小,此使得能夠將更多的較小組件整合至給定的面積中。該些較小的電子組件可能需要相比於先前的封裝利用更少面積的更小的封裝。目前,積體扇出型封裝因其緊湊性而越來越受歡迎。如何確保積體扇出型封裝的可靠性已成為本領域中的一項挑戰。
根據本發明的一實施例,一種半導體裝置包括封裝基底、封裝組件、蓋及至少一個黏合圖案。封裝組件接合至封裝基底。蓋包括第一部分及第二部分,所述第一部分藉由黏合層黏合至封裝基底,所述第二部分連接至所述第一部分並覆蓋封裝組件。黏合圖案黏合至封裝基底及蓋的第二部分之間並設置於封裝基底與蓋的第二部分之間。
根據本發明的一實施例,一種半導體裝置包括封裝基底、封裝組件及至少一個黏合圖案。封裝組件上具有熱介面材料(TIM)層。黏合圖案具有面對封裝基底的第一表面及與所述第一表面相對的第二表面,且所述至少一個黏合圖案的第二表面與TIM層的表面實質上共面。
根據本發明的一實施例,一種半導體裝置包括封裝基底、封裝組件、底部填充膠及至少一個黏合圖案。封裝組件接合至封裝基底。底部填充膠設置於封裝基底與封裝組件之間。黏合圖案不同於底部填充膠,且所述至少一個黏合圖案設置於底部填充膠上且與底部填充膠直接接觸。
以下揭露內容提供用於實施所提供標的物的不同特徵的諸多不同實施例或實例。以下闡述組件及排列的具體實例以簡化本揭露。當然,該些僅為實例且不旨在進行限制。舉例而言,以下說明中將第一特徵形成於第二特徵之上或第二特徵上可包括其中第一特徵與第二特徵被形成為直接接觸的實施例,且亦可包括其中第一特徵與第二特徵之間可形成有附加特徵進而使得所述第一特徵與所述第二特徵可不直接接觸的實施例。另外,本揭露可能在各種實例中重複使用參考編號及/或字母。此種重複使用是出於簡潔及清晰的目的,而不是自身表示所論述的實施例及/或配置之間的關係。
此外,為易於說明,本文中可能使用例如「位於……之下(beneath)」、「位於……下方(below)」、「下部的(lower)」、「位於……上方(above)」、「上部的(upper)」及類似用語等空間相對性用語來闡述圖中所示的一個元件或特徵與另一(其他)元件或特徵的關係。所述空間相對性用語旨在除圖中所繪示的定向外亦囊括裝置在使用或操作中的不同定向。設備可具有其他定向(旋轉90度或處於其他定向),且本文中所使用的空間相對性描述語可同樣相應地進行解釋。
亦可包括其他特徵及製程。舉例而言,可包括測試結構,以幫助對三維(three-dimensional,3D)封裝或三維積體電路(three-dimensional integrated circuit,3DIC)裝置進行驗證測試。測試結構可包括例如在重佈線層中或基底上形成的測試接墊,所述測試接墊使得能夠對3D封裝或3DIC裝置進行測試、對探針(probe)及/或探針卡(probe card)進行使用等。可對中間結構及最終結構實行驗證測試。另外,本文中所揭露的結構及方法可接合包括對已知良好晶粒(known good die)的中間驗證的測試方法一起使用,以提高收率(yield)並降低成本。
圖1A至圖1C是根據一些實施例在形成半導體裝置的方法中的各個階段的示意性剖面圖。
參照圖1A,在封裝基底100上放置封裝組件200。封裝基底100包括基底芯102,基底芯102可由半導體材料(例如矽、鍺、金剛石或類似材料)製成。作為另外一種選擇,亦可使用化合物材料,例如矽鍺、碳化矽、砷化鎵、砷化銦、磷化銦、碳化矽鍺、磷化鎵砷、磷化鎵銦、其組合或類似材料。另外,基底芯102可為絕緣體上半導體(semiconductor-on-insulator,SOI)基底。一般而言,SOI基底包括由例如磊晶矽、鍺、矽鍺、SOI、絕緣體上矽鍺(silicon germanium on insulator,SGOI)或其組合等半導體材料構成的層。在另一實施例中,基底芯102是例如玻璃纖維加強型樹脂芯(fiberglass reinforced resin core)等絕緣芯。一種實例性芯材料是例如阻燃劑4(FR4)等玻璃纖維樹脂。芯材料的替代物包括雙馬來醯亞胺-三嗪(bismaleimide-triazine,BT)樹脂,或者作為另外一種選擇包括印刷電路板(printed circuit board,PCB)材料或膜。
在一些實施例中,基底芯102包括主動裝置及被動裝置(未單獨示出)。可使用例如電晶體、電容器、電阻器、其組合及類似裝置等裝置來產生系統的設計的結構要求及功能要求。可使用任何適合的方法來形成所述裝置。在一些實施例中,基底芯102實質上不包括主動裝置及被動裝置。在一些實施例中,基底芯102更包括導通孔104,所述導通孔104亦可被稱為矽穿孔(through silicon via,TSV)。
封裝基底100亦可包括重佈線結構。在一些實施例中,重佈線結構由介電材料(例如,低介電常數(low-k)介電材料)與導電材料(例如,銅)構成的交替層形成,其中通孔對導電材料層進行內連,且可藉由任何適合的製程(例如沉積、鑲嵌或類似製程)形成所述重佈線結構。在其他實施例中,重佈線結構由介電材料(例如,構成膜例如味之素構成膜(Ajinomoto build-up film,ABF)或其他疊層)與導電材料(例如,銅)構成的交替層形成,其中通孔將導電材料層內連,且可藉由任何合適的製程(例如疊層、鍍覆或類似製程)形成。
在示出的實施例中,封裝基底100包括形成於基底芯102的相對表面上的重佈線結構106及108,使得基底芯102插入於重佈線結構106與重佈線結構108之間。導通孔104將重佈線結構106電性耦合至重佈線結構108。在替代性實施例中,省略重佈線結構106或重佈線結構108。
在一些實施例中,在重佈線結構106上形成接合接墊110及阻焊層112,其中接合接墊110藉由形成於阻焊層112中的開口暴露出。接合接墊110可為重佈線結構106的一部分,且可與重佈線結構106的其他導電特徵一起形成。阻焊層112可包含合適的絕緣材料(例如介電材料、聚合物材料或類似材料),且可使用任何合適的沉積方法來形成。
在一些實施例中,導電連接件114延伸穿過阻焊層112中的開口且接觸接合接墊110。導電連接件114可為球柵陣列(ball grid array,BGA)連接件、焊料球、金屬柱、受控塌陷晶片連接(controlled collapse chip connection,C4)凸塊、微凸塊、無電鍍鎳鈀-浸金(electroless nickel-electroless palladium-immersion gold technique,ENEPIG)技術形成的凸塊或類似結構。在示出的實施例中,導電連接件114包括焊料球。
在一些實施例中,在重佈線結構108上形成接合接墊116及阻焊層118。接合接墊116可為重佈線結構108的一部分,且可與重佈線結構108的其他導電特徵一起形成。阻焊層118可包含合適的絕緣材料(例如介電材料、聚合物材料或類似材料),且可使用任何合適的沉積方法來形成。
在一些實施例中,封裝組件200是晶圓級(wafer-level)封裝組件。封裝組件200具有面對封裝基底100的表面200a(例如,底表面)及與表面200a相對的表面200b(例如,頂表面)。在示出的實施例中,封裝組件200包括多個積體電路晶粒220,所述多個積體電路晶粒220接合至中介層210並被包封體228包封。中介層210可具有基底(未示出)、位於所述基底的表面上的內連線結構(未示出)及穿透所述基底的導通孔(未示出)。基底可為經摻雜或未經摻雜的矽基底或者絕緣體上半導體(SOI)基底的有效層。基底可包含:其他半導體材料,例如鍺;化合物半導體,包括碳化矽、砷化鎵、磷化鎵、磷化銦、砷化銦及/或銻化銦;合金半導體,包括SiGe、GaAsP、AlInAs、AlGaAs、GaInAs、GaInP及/或GaInAsP;或者其組合。亦可使用例如多層式基底(multi-layered substrate)或梯度基底(gradient substrate)等其他基底。重佈線結構及導通孔可使用與重佈線結構106、108及導通孔104相似的材料及方法來形成,且不再對其予以贅述。
中介層210可分別在積體電路晶粒220的最外表面處具有導電連接件212、214。導電連接件212、214可包括凸塊下金屬(underbump metallization,UBM)及位於UBM之上的焊料區。UBM可為導電柱、接墊或類似結構。在一些實施例中,可藉由在內連線結構之上形成晶種層來形成UBM。晶種層可為金屬層,所述金屬層可為單層或包括由不同材料形成的多個子層的複合層。在一些實施例中,晶種層包括鈦層及位於所述鈦層之上的銅層。可使用例如物理氣相沉積(physical vapor deposition,PVD)或類似製程來形成晶種層。然後在晶種層上形成光阻且對所述光阻進行圖案化。可藉由旋轉塗佈或類似製程形成光阻,且可將所述光阻暴露於光以用於圖案化。光阻的圖案對應於UBM。所述圖案化會形成穿過光阻的開口以暴露出晶種層。然後在光阻的開口中及晶種層的被暴露出的部分上形成導電材料。可藉由鍍覆(例如電鍍(electroplating)或無電鍍覆(electroless plating))或者類似製程形成導電材料。導電材料可包括金屬,例如銅、鈦、鎢、鋁或類似金屬。然後,移除光阻以及晶種層的上面未形成導電材料的部分。可藉由例如使用氧電漿或類似材料的可接受的灰化製程(ashing process)或剝除製程(stripping process)移除光阻。一旦光阻被移除,便例如藉由使用可接受的蝕刻製程移除晶種層的被暴露出的部分。晶種層的剩餘部分與導電材料形成UBM。
積體電路晶粒220是相同或不同的。每一積體電路晶粒220可為邏輯晶粒(例如,中央處理單元(central processing unit,CPU)、圖形處理單元(graphics processing unit,GPU)、系統晶片(system-on-a-chip,SoC)、應用處理器(application processor,AP)、微控制器等)、記憶體晶粒(例如,動態隨機存取記憶體(dynamic random access memory,DRAM)晶粒、靜態隨機存取記憶體(static random access memory,SRAM)晶粒等)、電源管理晶粒(例如,電源管理積體電路(power management integrated circuit,PMIC)晶粒)、射頻(radio frequency,RF)晶粒、感測器晶粒、微機電系統(micro-electro-mechanical-system,MEMS)晶粒、訊號處理晶粒(例如,數位訊號處理(digital signal processing,DSP)晶粒)、前端晶粒(例如,類比前端(analog front-end,AFE)晶粒)、類似晶粒或其組合。積體電路晶粒220可包括半導體基底(未示出)、裝置層(未示出)及內連線結構(未示出)。半導體基底可為經摻雜或未經摻雜的矽基底或者絕緣體上半導體(SOI)基底的有效層。半導體基底可包含:其他半導體材料,例如鍺;化合物半導體,包括碳化矽、砷化鎵、磷化鎵、磷化銦、砷化銦及/或銻化銦;合金半導體,包括SiGe、GaAsP、AlInAs、AlGaAs、GaInAs、GaInP及/或GaInAsP;或者其組合。亦可使用例如多層式基底或梯度基底等其他基底。
裝置層可包括主動裝置(例如,電晶體、二極體等)、電容器、電阻器、類似裝置或其組合以及環繞並覆蓋所述裝置的層間介電質(inter-layer dielectric,ILD)。ILD可包括由例如磷矽酸鹽玻璃(phospho-silicate glass,PSG)、硼矽酸鹽玻璃(boro-silicate glass,BSG)、摻雜硼的磷矽酸鹽玻璃(boron-doped phospho-silicate glass,BPSG)、未經摻雜的矽酸鹽玻璃(undoped silicate glass,USG)或類似材料等材料形成的一或多個介電層。導電插塞(未單獨示出)可延伸穿過ILD,以電性耦合至及實體耦合至裝置。舉例而言,當裝置是電晶體時,導電插塞耦合至電晶體的閘極以及源極及汲極區。導電插塞可由鎢、鈷、鎳、銅、銀、金、鋁、類似材料或其組合形成。
在裝置層之上具有內連線結構,且所述內連線結構用於將半導體基底的裝置電性連接以形成積體電路。內連線結構可位於ILD及導電插塞之上。內連線結構可包括一或多個介電層及介電層中的相應金屬化層。用於介電層的可接受的介電材料包括低介電常數介電材料,例如PSG、BSG、BPSG、USG或類似材料。用於介電層的可接受的介電材料更包括:氧化物,例如氧化矽或氧化鋁;氮化物,例如氮化矽;碳化物,例如碳化矽;類似材料;或其組合,例如氮氧化矽、碳氧化矽、碳氮化矽、碳氮氧化矽或類似材料。亦可使用其他介電材料,例如聚合物(例如聚苯並噁唑(polybenzoxazole,PBO)、聚醯亞胺、苯並環丁烯(benzocyclobutene,BCB)系聚合物或類似材料)。金屬化層可包括導通孔及/或導電線,以將半導體基底的裝置內連。金屬化層可由例如金屬(例如銅、鈷、鋁、金、其組合或類似材料)等導電材料形成。內連線結構可藉由鑲嵌製程(例如單鑲嵌製程、雙鑲嵌製程或類似製程)形成。
在一些實施例中,積體電路晶粒220在最外表面處包括多個導電連接件222。導電連接件222相似於上述的導電連接件212、214,且不再對其予以贅述。在示出的實施例中,導電連接件222包括UBM及位於UBM之上的焊料區。在一些實施例中,導電連接件222與相應的導電連接件214實體接觸,使得導電連接件222的焊料區與相應的導電連接件214實體接觸,且在它們之間形成焊料接頭224。焊料接頭224將積體電路晶粒220電性耦合且機械耦合至中介層210。
在一些實施例中,在焊料接頭224周圍且在積體電路晶粒220與中介層210之間的間隙中形成底部填充膠226。底部填充膠226可減小應力並保護焊料接頭224。底部填充膠226可由底部填充材料(例如模製化合物、環氧樹脂或類似材料)形成。可在積體電路晶粒220貼合至中介層210之後藉由毛細流動製程(capillary flow process)形成底部填充膠226,或者可在積體電路晶粒220貼合至中介層210之前藉由合適的沉積方法形成底部填充膠226。可以液體或半液體形式施加底部填充膠226且隨後對底部填充膠226進行固化。在一些實施例中,底部填充膠226沿著積體電路晶粒220的側壁延伸。然而,本揭露不限於此。在替代性實施例中,省略底部填充膠226。
包封體228可包封積體電路晶粒220及底部填充膠226。包封體228可為模製化合物、環氧樹脂或類似材料。包封體228中可不包括填料。可藉由壓縮模製、轉移模製或類似製程施加包封體228,且在中介層210之上形成包封體228,使得積體電路晶粒220被掩埋或被覆蓋。可以液體或半液體形式施加包封體228且隨後對包封體228進行固化。在一些實施例中,包封體228的側壁與中介層210的側壁實質上齊平。在替代性實施例中,封裝組件200具有其他合適的結構。
在一些實施例中,在封裝組件200上設置熱介面材料(thermal interface material,TIM)層232。TIM層232可包含具有高熱導率的熱介面材料。TIM層232的材料可為聚合物。在一些實施例中,TIM層232包括具有導熱填料的聚合物。導熱填料可將TIM層232的有效熱導率(effective thermal conductivity)增加至約10瓦/米開爾文至約50瓦/米開爾文或大於50瓦/米開爾文。適用的導熱填料材料可包括氧化鋁、氮化硼、氮化鋁、鋁、銅、銀、銦、其組合或類似材料。在其他實施例中,TIM層232包括其他材料,例如包括銀、銦膏或類似物的金屬系材料或焊料系材料。在又一些實施例中,TIM層232包括膜系材料或片系材料,例如包括合成奈米碳管(carbon nanotube,CNT)的片系材料或具有垂直定向的石墨填料的導熱片。TIM層232可具有單層結構或多層結構。TIM層232可藉由疊層製程、分配製程、類似製程、其組合或任何其他合適的製程形成在封裝組件200的表面200b(例如,最外表面)上。在一些實施例中,TIM層232的側壁與封裝組件200的側壁實質上齊平。舉例而言,TIM層232的側壁與包封體228的側壁及中介層210的側壁實質上齊平。封裝組件200可具有厚度T1,且TIM層232可具有厚度T2。在一些實施例中,厚度T1與厚度T2的總厚度T介於50微米至150微米的範圍內。舉例而言,總厚度T是自封裝基底100的表面100a至TIM層232的表面層232a量測。
在一些實施例中,使用例如拾取及放置工具(pick-and-place tool)將封裝組件200放置於封裝基底100的表面100a上。在將封裝組件200放置於封裝基底100上之後,導電連接件212與相應的導電連接件114實體接觸,使得導電連接件212的焊料區與相應的導電連接件114實體接觸。在一些實施例中,在將封裝組件200放置於封裝基底100上之後,實行迴焊製程以將封裝組件200機械貼合至且電性貼合至封裝基底100。迴焊製程將導電連接件212的焊料區與導電連接件114的相應焊料材料熔化並合併成焊料接頭230。焊料接頭230將封裝組件200電性耦合且機械耦合至封裝基底100。
在一些實施例中,在焊料接頭230周圍且在封裝組件200與封裝基底100之間的間隙中形成底部填充膠240。底部填充膠240可減小應力並保護焊料接頭230。底部填充膠240可由底部填充材料(例如模製化合物、環氧樹脂或類似材料)形成。可在封裝組件200貼合至封裝基底100之後藉由毛細流動製程形成底部填充膠240,或者可在封裝組件200貼合至封裝基底100之前藉由合適的沉積方法形成底部填充膠240。可以液體或半液體形式施加底部填充膠240且隨後對底部填充膠240進行固化。在一些實施例中,底部填充膠240沿著封裝組件200的側壁延伸。舉例而言,底部填充膠240沿著中介層210的側壁及包封體228的側壁延伸。
在一些實施例中,在封裝基底100上封裝組件200旁邊形成多個被動裝置250。舉例而言,如圖2A所示,被動裝置250被形成為環繞封裝組件200。然而,本揭露不限於此。被動裝置250可具有任何其他合適的佈置。被動裝置250可為電容器、電阻器或電感器。被動裝置250可作為封裝組件200接合至封裝基底100。舉例而言,被動裝置250的導電連接件252包括UBM及位於UBM之上的焊料區。舉例而言,導電連接件252的焊料區與相應的導電連接件(例如,導電連接件114)實體接觸,且藉由迴焊製程與導電連接件114的相應焊料材料合併成焊料接頭254。在一些實施例中,如圖1A所示,被動裝置250與底部填充膠240的邊緣240a分隔開。
參照圖1B,在封裝基底100的表面100a上形成黏合層300及至少一個黏合圖案310。在一些實施例中,將黏合層300形成為環繞封裝組件200及被動裝置250,且在黏合層300與封裝組件200之間形成黏合圖案310。舉例而言,黏合層300沿著封裝組件200的周邊形成,且黏合圖案310形成於封裝組件200的相對側處。在一些實施例中,黏合圖案310與底部填充膠240的邊緣240a分隔開,且黏合圖案310設置於黏合層300與被動裝置250之間。在一些實施例中,如圖1B所示,被動裝置250與黏合圖案310之間的距離d1小於被動裝置250與黏合層300之間的距離d2。在黏合層300與黏合圖案310之間形成距離d3。在一些實施例中,距離d1、d2及d3分別大於0。換言之,黏合圖案310分別與黏合層300及被動裝置250在實體上分隔開而不進行接觸。在一些實施例中,選擇黏合圖案310與黏合層300之間的距離d3,且因此當黏合層300被散熱蓋320按壓進行接合時,黏合圖案310與黏合層300保持分隔開。在一些實施例中,黏合層300及黏合圖案310形成於封裝基底100的阻焊層112上。黏合層300及黏合圖案310與封裝基底100(例如,封裝基底100的阻焊層112)直接接觸。
如圖2A所示,自俯視圖觀察,黏合圖案310可設置於封裝組件200的相對側處,同時黏合層300被形成為環繞封裝組件200。舉例而言,黏合層300設置於封裝組件200的第一側至第四側處,且黏合圖案310設置於彼此相對的第一側與第三側處。然而,本揭露不限於此。根據需要,黏合圖案310可設置於封裝組件200的一個側、兩個側、三個側或四個側處。黏合圖案310可具有與封裝組件200的側邊的長度實質上相同的長度。然而,本揭露不限於此。黏合圖案310可具有大於或小於封裝組件200的側邊的長度的任何合適的長度。在一些實施例中,黏合圖案310是條形狀、矩形形狀、支柱形狀或壁形狀。在替代性實施例中,黏合圖案310是如圖3A所示的島形狀、如圖3B所示的環形狀、如圖3C所示的C形狀、類似形狀或其組合,或者具有任何其他合適的形狀。在如圖3A所示的實施例中,黏合圖案310被佈置成環繞封裝組件200。黏合圖案310以恆定距離或非恆定距離分隔開。在一些實施例中,黏合層300被示出為環且具有至少一個通氣口(vent)302。然而,本揭露不限於此。黏合層300可具有其他合適的形狀。
在替代性實施例中,如圖3D所示,黏合圖案310沿著彼此不同的至少兩條路徑312a、312b佈置。舉例而言,第一路徑312a是沿著封裝組件200的周邊,且第二路徑312b是沿著封裝組件200的周邊且位於第一路徑312a與封裝組件200之間。在此種實施例中,黏合圖案310在不同位置處支撐將接合的散熱蓋320。黏合圖案310可具有任何合適的形狀及佈置。舉例而言,沿著第一路徑312a的黏合圖案310位於封裝組件200的一個側、兩個側、三個側或四個側處,且相似地,沿著第一路徑的黏合圖案310位於封裝組件200的一個側、兩個側、三個側或四個側處。黏合圖案310在相同路徑(例如,第一路徑312a或第二路徑312b)或在不同路徑(例如,第一路徑312a與第二路徑312b)上的寬度W1可實質上相同或不同。在此種實施例中,在接合至散熱蓋320之後,不同路徑(例如,第一路徑312a與第二路徑312b)中的黏合圖案310可合併成一個或者保持分隔開。
黏合圖案310及黏合層300可分別具有黏合材料。黏合圖案310及黏合層300的黏合材料包括環氧系材料、矽酮系材料、金屬系材料、其組合或類似材料。黏合圖案310的黏合材料可與黏合層300實質上相同或不同。黏合圖案310的黏合材料可不同於底部填充膠240。黏合層300亦被稱為晶粒貼合膜(die attach film),所述晶粒貼合膜用於對蓋進行黏合。黏合圖案310亦可被稱為支撐圖案或增強圖案。黏合圖案310及黏合層300可藉由分配方法或任何其他合適的製程形成。在一些實施例中,黏合圖案310及黏合層300在形成TIM層232之後或形成TIM層232之前形成。在一些實施例中,如圖1B所示,黏合圖案310的高度H1大於或實質上等於封裝組件200與TIM層232的總厚度T,以確保黏合圖案310接觸圖1C所示散熱蓋320。黏合層300的高度H2小於黏合圖案310的高度H1,且亦小於封裝組件200與TIM層232的總厚度T,即例如H1>T>H2。在一些實施例中,高度H1介於1毫米至1.5毫米的範圍內,且高度H1與總厚度T之間的高度差介於0.2毫米至0.6毫米的範圍內。高度H2例如介於0.5毫米至0.8毫米的範圍內。在一些實施例中,黏合圖案310的寬度W1大於黏合層300的寬度W2。然而,本揭露不限於此。黏合圖案310的寬度W1可實質上等於或小於黏合層300的寬度W2。
參照圖1C,藉由黏合層300及黏合圖案310將散熱蓋320貼合至封裝基底100的表面100a,以覆蓋並環繞封裝組件200。散熱蓋320可藉由黏合層300及黏合圖案310貼合至封裝基底100的阻焊層112。在一些實施例中,在散熱蓋320貼合至黏合層300之後,實行固化製程。在一些實施例中,在約120℃與180℃之間的溫度下對黏合層300及黏合圖案310實行固化製程達一段時間。然而,在固化步驟期間可使用任何合適的溫度及持續時間。在一些實施例中,只要在放置散熱蓋320之前,就在形成黏合層300及黏合圖案310之後或形成黏合層300及黏合圖案310之前形成TIM層232。
在一些實施例中,散熱蓋320包含高熱導率材料(例如金屬、金屬合金或類似材料)。散熱蓋320可包括第一部分322及在實體上連接至第一部分322的第二部分324。第一部分322是垂直延伸的部分且是例如壁形狀。舉例而言,第二部分324是水平延伸的部分且是板形狀,且第二部分324與第一部分322一體形成。在散熱蓋320貼合至封裝基底100之後,散熱蓋320的第一部分322與黏合層300直接接觸,且環繞其上具有TIM層232的封裝組件200、被動裝置250及黏合圖案310。散熱蓋320的第二部分324覆蓋具有TIM層232的封裝組件200、被動裝置250及黏合圖案310。
在一些實施例中,在將散熱蓋320貼合至封裝基底100之後,散熱蓋320的第二部分324與黏合圖案310及TIM層232直接接觸。黏合圖案310具有第一表面310a及與第一表面310a相對的第二表面310b。在一些實施例中,黏合圖案310的第一表面310a面對封裝基底100的表面100a(例如,阻焊層112)並與封裝基底100的表面100a直接接觸,且黏合圖案310的第二表面310b面對散熱蓋320(例如,散熱蓋320的第二部分324)並與散熱蓋320直接接觸。換言之,黏合圖案310設置於散熱蓋320與封裝基底100之間且在實體上連接散熱蓋320與封裝基底100,從而為散熱蓋320提供黏合性及支撐。在一些實施例中,如圖1C所示,黏合圖案310的第二表面310b與TIM層232的表面層232a實質上共面。亦即,由於黏合圖案310被散熱蓋320按壓,因此黏合圖案310的高度H1’實質上等於封裝組件200與TIM層232的總厚度T。在一些實施例中,黏合圖案310為散熱蓋320提供支撐,且因此確保散熱蓋320接觸TIM層232。舉例而言,TIM層232的表面層232a完全與散熱蓋320直接接觸。在此種實施例中,TIM層232的覆蓋率(例如,與散熱蓋320的接觸面積佔TIM層232的表面層232a的總面積的百分比)大,例如大於95%。因此,散熱蓋320為封裝組件200提供良好的散熱。
參照圖1C及圖2B,在黏合散熱蓋320之後,黏合層300的高度降低至H2’,且黏合層300的寬度W2’增加。在一些實施例中,黏合圖案310的頂部部分(例如,與散熱蓋320直接接觸的部分)的寬度W1”大於黏合圖案310的其他部分的寬度W1’。隨著黏合圖案310變得更靠近散熱蓋320,黏合圖案310的寬度W1”可增加。寬度W1’可實質上是恆定的。在一些實施例中,寬度W1’與黏合圖案310在接合至散熱蓋320之前的寬度W1實質上相同,且寬度W1”大於寬度W1。在此種實施例中,黏合圖案310的頂部部分具有彎曲(凹入或凸出)的側壁或傾斜的側壁。黏合層300的寬度W2’可與散熱蓋320的第一部分322的寬度實質上相同。舉例而言,黏合層300的側壁與散熱蓋320的第一部分322的側壁實質上齊平。然而,本揭露不限於此。黏合圖案310及/或黏合層300的寬度W1’、W1”、W2’可基於要求進行調整。
在一些實施例中,如圖1C所示,黏合層300與黏合圖案310之間的距離d3小於圖1B所示距離d3,且黏合層300與被動裝置250之間的距離d2亦小於圖1B所示距離d3。在一些實施例中,距離d1、d2及d3分別大於0。換言之,在接合散熱蓋320之後,黏合圖案310保持分別與黏合層300及被動裝置250實體上分隔開而不進行接觸。
在一些實施例中,在形成散熱蓋320之後,導電連接件120延伸穿過阻焊層118中的開口且接觸接合接墊116。接合接墊116藉由形成於阻焊層118中的開口暴露出。導電連接件120可為球柵陣列(BGA)連接件、焊料球、金屬柱、受控塌陷晶片連接(C4)凸塊、微凸塊、無電鍍鎳鈀-浸金(ENEPIG)技術形成的凸塊或類似結構。在示出的實施例中,導電連接件120包括焊料球。
在其中不存在黏合圖案310的替代性實施例中,封裝組件200的彎折(例如,翹曲)在高溫(例如固化溫度)下發生,此會降低散熱蓋320與TIM層232之間的黏合。因此,發生TIM層232的分層,且TIM層232的覆蓋率低。相比之下,在一些實施例中,黏合圖案310會增加散熱蓋320與封裝基底100之間的黏合,並為散熱蓋320提供支撐,且因此防止出現TIM層232的分層並提高TIM層232的覆蓋率(例如,大於95%或98%)。因此,散熱蓋320可藉由TIM層232為封裝組件200提供良好的散熱(例如,低熱阻),且改善封裝組件200的效能。另外,可消除封裝基底100與封裝組件200的凹入形狀的翹曲。此外,由於可在不接觸封裝組件200及被動裝置250(例如,不擴散(bleeding)至封裝組件200及被動裝置250上)的情況下對黏合圖案310進行設計或控制,且因此對封裝組件200及被動裝置250而言實質上沒有影響。
在一些實施例中,黏合圖案310設置於被動裝置250與黏合層300之間。然而,本揭露不限於此。在替代性實施例中,如圖4所示,黏合圖案310設置於封裝組件200與被動裝置250之間。在一些實施例中,封裝組件200與黏合圖案310之間的距離d1小於封裝組件200與被動裝置250之間的距離d2。舉例而言,距離d1亦是黏合圖案310與包封體228之間的距離。在黏合圖案310與被動裝置250之間形成距離d3。在一些實施例中,距離d1、d2及d3分別大於0。換言之,黏合圖案310分別與封裝組件200及被動裝置250在實體上分隔開而不進行接觸。在一些實施例中,黏合圖案310與底部填充膠240在實體上分隔開。舉例而言,被動裝置250設置於黏合圖案310與黏合層300之間。
在一些實施例中,如圖5所示,黏合圖案310在被動裝置250與封裝組件200之間設置於底部填充膠240上。因此,可減小半導體裝置的總尺寸(例如,總寬度),且另外,由於底部填充膠240用作黏合圖案310的增高墊(booster),可減小黏合圖案310的總使用量。在一些實施例中,黏合圖案310至少覆蓋底部填充膠240的邊緣240a。舉例而言,黏合圖案310與底部填充膠240的邊緣240a直接接觸。於黏合圖案310與底部填充膠240之間可存在介面。在一些實施例中,封裝組件200與黏合圖案310之間的距離d1小於封裝組件200與被動裝置250之間的距離d2,且因此黏合圖案310設置於封裝組件200與被動裝置250之間。在黏合圖案310與被動裝置250之間形成距離d3。距離d1、d2及d3分別大於0。換言之,黏合圖案310分別與封裝組件200及被動裝置250在實體上分隔開而不進行接觸。在一些實施例中,黏合圖案310部分地設置於底部填充膠240上且部分地設置於封裝基底100上。然而,本揭露不限於此。在替代性實施例中,黏合圖案310完全設置於底部填充膠240上,而不接觸封裝基底100。
在以上實施例中,封裝組件200被示為晶圓上晶片(Chip-on-Wafer,CoW)封裝,即晶片(例如,積體電路晶粒220)接合至晶圓(例如,中介層210)。然而,本揭露不限於此。封裝組件200可為任何合適的三維積體電路裝置。舉例而言,如圖6所示,封裝組件200’是積體扇出型(integrated fan-out,InFO)-局域矽內連線(local silicon interconnect,LSI)。在此種實施例中,積體電路晶粒220藉由位於其之間及位於其之下的橋接晶粒260(例如,矽內連線)電性連接,且然後將形成的封裝組件接合至RDL結構211。舉例而言,橋接晶粒260被底部填充膠262環繞,且橋接晶粒260及底部填充膠262被其中具有穿孔272的包封體270環繞。然後,橋接晶粒260及穿孔272進一步電性連接至RDL結構211,積體電路晶粒220電性連接至RDL結構211。在一些實施例中,如圖6所示,黏合圖案310被形成為環繞接合至封裝基底100的封裝組件200’,且因此所形成的半導體裝置具有如上所述得到改善的散熱。
根據一些實施例,一種半導體裝置包括封裝基底、封裝組件、蓋及至少一個黏合圖案。封裝組件接合至封裝基底。蓋包括第一部分及第二部分,所述第一部分藉由黏合層黏合至封裝基底,所述第二部分連接至所述第一部分並覆蓋封裝組件。黏合圖案黏合至封裝基底及蓋的第二部分之間並設置於封裝基底與蓋的第二部分之間。
在一些實施例,其中所述至少一個黏合圖案的材料與所述黏合層的材料實質上相同。
在一些實施例,其中所述至少一個黏合圖案的材料包括環氧系材料、矽酮系材料、金屬系材料或其組合。
在一些實施例,其中所述至少一個黏合圖案具有與所述蓋直接接觸的部分,且所述部分的寬度隨著所述部分變得更靠近所述蓋而增加。
在一些實施例,更包括位於所述封裝組件與所述蓋的所述第二部分之間的熱介面材料(TIM)層。
在一些實施例,其中所述至少一個黏合圖案的厚度與所述熱介面材料層和所述封裝組件的總厚度實質上相同。
在一些實施例,更包括位於所述封裝組件與所述封裝基底之間的底部填充膠,其中所述至少一個黏合圖案與所述底部填充膠分隔開。
根據一些實施例,一種半導體裝置包括封裝基底、封裝組件及至少一個黏合圖案。封裝組件上具有熱介面材料(TIM)層。黏合圖案具有面對封裝基底的第一表面及與所述第一表面相對的第二表面,且所述至少一個黏合圖案的第二表面與TIM層的表面實質上共面。
在一些實施例,其中所述至少一個黏合圖案包括多個黏合圖案,且所述黏合圖案設置於所述封裝組件的相對側處。
在一些實施例,其中所述至少一個黏合圖案包括多個黏合圖案,且所述黏合圖案被佈置成環繞所述封裝組件。
在一些實施例,其中所述至少一個黏合圖案的厚度與所述封裝組件和所述熱介面材料層的總厚度實質上相同。
在一些實施例,更包括接合至所述封裝基底的至少一個被動裝置,其中所述至少一個黏合圖案設置於所述至少一個被動裝置與所述封裝組件之間。
在一些實施例,更包括接合至所述封裝基底的至少一個被動裝置,其中所述至少一個被動裝置設置於所述至少一個黏合圖案與所述封裝組件之間。
在一些實施例,更包括蓋,所述蓋覆蓋所述封裝組件且與所述熱介面材料層直接接觸。
在一些實施例,其中所述至少一個黏合圖案與所述蓋及所述封裝基底直接接觸。
根據一些實施例,一種半導體裝置包括封裝基底、封裝組件、底部填充膠及至少一個黏合圖案。封裝組件接合至封裝基底。底部填充膠設置於封裝基底與封裝組件之間。黏合圖案不同於底部填充膠,且所述至少一個黏合圖案設置於底部填充膠上且與底部填充膠直接接觸。
在一些實施例,更包括蓋及熱介面材料層,所述熱介面材料層設置於所述蓋與所述封裝組件之間且與所述蓋及所述封裝組件直接接觸。
在一些實施例,其中所述至少一個黏合圖案與所述蓋直接接觸。
在一些實施例,其中所述至少一個黏合圖案在所述封裝組件的側壁上覆蓋所述底部填充膠的邊緣。
在一些實施例,其中所述至少一個黏合圖案與所述封裝組件的側壁分隔開一距離。
以上概述了若干實施例的特徵,以使熟習此項技術者可更佳地理解本揭露的各態樣。熟習此項技術者應理解,他們可容易地使用本揭露作為設計或修改其他製程及結構的基礎來施行與本文中所介紹的實施例相同的目的及/或達成與本文中所介紹的實施例相同的優點。熟習此項技術者亦應認識到,此種等效構造並不背離本揭露的精神及範圍,而且他們可在不背離本揭露的精神及範圍的條件下對其作出各種改變、代替及變更。
100:封裝基底
100a、200a、200b:表面
102:基底芯
104:導通孔
106、108:重佈線結構
110、116:接合接墊
112、118:阻焊層
114、120、212、214、222、252:導電連接件
200、200’:封裝組件
210:中介層
211:RDL結構
220:積體電路晶粒
224、230、254:焊料接頭
226、240、262:底部填充膠
228、270:包封體
232:熱介面材料(TIM)層
232a:表面層
240a:邊緣
250:被動裝置
260:橋接晶粒
272:穿孔
300:黏合層
302:通氣口
310:黏合圖案
310a:第一表面
310b:第二表面
312a、312b:路徑
320:散熱蓋
322:第一部分
324:第二部分
d1、d2、d3:距離
H1、H2、H2’:高度
T:總厚度
T1、T2:厚度
W1、W1’、W1”、W2、W2’:寬度
結合附圖閱讀以下詳細說明,會最佳地理解本揭露的態樣。應注意,根據本行業中的標準慣例,各種特徵並非按比例繪製。事實上,為使論述清晰起見,可任意增大或減小各種特徵的尺寸。
圖1A至圖1C是根據一些實施例在形成半導體裝置的方法中的各個階段的示意性剖面圖。
圖2A示出根據本揭露一些實施例的圖1B所示半導體裝置的俯視圖。
圖2B示出根據本揭露一些實施例的圖1C所示半導體裝置的俯視圖。
圖3A至圖3D分別示出根據本揭露一些實施例的半導體裝置的俯視圖。
圖4是根據一些實施例的半導體裝置的剖面圖。
圖5是根據一些實施例的半導體裝置的剖面圖。
圖6是根據一些實施例的半導體裝置的剖面圖。
100:封裝基底
102:基底芯
104:導通孔
106、108:重佈線結構
112、118:阻焊層
116:接合接墊
120、252:導電連接件
200:封裝組件
210:中介層
220:積體電路晶粒
228:包封體
232:熱介面材料(TIM)層
232a:表面層
240:底部填充膠
240a:邊緣
250:被動裝置
254:焊料接頭
300:黏合層
310:黏合圖案
310a:第一表面
310b:第二表面
320:散熱蓋
322:第一部分
324:第二部分
d1、d2、d3:距離
H1’、H2’:高度
T:總厚度
T1、T2:厚度
W1’、W1”、W2’:寬度
Claims (1)
- 一種半導體裝置,包括: 封裝基底; 封裝組件,接合至所述封裝基底; 蓋,包括第一部分及第二部分,所述第一部分藉由黏合層黏合至所述封裝基底,所述第二部分連接至所述第一部分並覆蓋所述封裝組件;以及 至少一個黏合圖案,其中所述至少一個黏合圖案黏合至所述封裝基底與所述蓋的所述第二部分之間並設置於所述封裝基底與所述蓋的所述第二部分之間。
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US17/900,785 US20240071857A1 (en) | 2022-08-31 | 2022-08-31 | Semiconductor device |
US17/900,785 | 2022-08-31 |
Publications (1)
Publication Number | Publication Date |
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TW202412212A true TW202412212A (zh) | 2024-03-16 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW112105116A TW202412212A (zh) | 2022-08-31 | 2023-02-14 | 半導體裝置 |
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US (1) | US20240071857A1 (zh) |
TW (1) | TW202412212A (zh) |
-
2022
- 2022-08-31 US US17/900,785 patent/US20240071857A1/en active Pending
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2023
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US20240071857A1 (en) | 2024-02-29 |
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