TW202410077A - 導電性膜 - Google Patents

導電性膜 Download PDF

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Publication number
TW202410077A
TW202410077A TW112123831A TW112123831A TW202410077A TW 202410077 A TW202410077 A TW 202410077A TW 112123831 A TW112123831 A TW 112123831A TW 112123831 A TW112123831 A TW 112123831A TW 202410077 A TW202410077 A TW 202410077A
Authority
TW
Taiwan
Prior art keywords
layer
inorganic layer
inorganic
organic resin
copper layer
Prior art date
Application number
TW112123831A
Other languages
English (en)
Chinese (zh)
Inventor
竹下翔也
曽根大希
竹安智宏
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202410077A publication Critical patent/TW202410077A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
TW112123831A 2022-07-01 2023-06-27 導電性膜 TW202410077A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022-107319 2022-07-01
JP2022107319 2022-07-01
JP2023002266 2023-01-11
JP2023-002266 2023-01-11

Publications (1)

Publication Number Publication Date
TW202410077A true TW202410077A (zh) 2024-03-01

Family

ID=89382632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112123831A TW202410077A (zh) 2022-07-01 2023-06-27 導電性膜

Country Status (2)

Country Link
TW (1) TW202410077A (fr)
WO (1) WO2024004405A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09201900A (ja) * 1995-11-24 1997-08-05 Mitsui Toatsu Chem Inc 積層体
JPH1034797A (ja) * 1996-07-29 1998-02-10 Mitsui Petrochem Ind Ltd 透明導電性積層体およびその製造方法
JPH11268183A (ja) * 1998-03-19 1999-10-05 Mitsui Chem Inc ポリイミド−金属積層体およびその製造方法
CN107210092B (zh) * 2015-03-04 2019-06-18 株式会社钟化 带导电层的基板、触摸面板用带透明电极的基板及它们的制造方法
JP6601137B2 (ja) * 2015-10-16 2019-11-06 住友金属鉱山株式会社 積層体基板、積層体基板の製造方法、導電性基板、及び導電性基板の製造方法

Also Published As

Publication number Publication date
WO2024004405A1 (fr) 2024-01-04

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