TW202407473A - 在氧化鹵素供給環境中有機金屬阻劑之基於氣體的顯影 - Google Patents

在氧化鹵素供給環境中有機金屬阻劑之基於氣體的顯影 Download PDF

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Publication number
TW202407473A
TW202407473A TW112120807A TW112120807A TW202407473A TW 202407473 A TW202407473 A TW 202407473A TW 112120807 A TW112120807 A TW 112120807A TW 112120807 A TW112120807 A TW 112120807A TW 202407473 A TW202407473 A TW 202407473A
Authority
TW
Taiwan
Prior art keywords
development
halide
tin
carbon
composition
Prior art date
Application number
TW112120807A
Other languages
English (en)
Chinese (zh)
Inventor
彼特 德 謝佩
布萊恩Ｊ 卡迪諾
Original Assignee
美商英培雅股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商英培雅股份有限公司 filed Critical 美商英培雅股份有限公司
Publication of TW202407473A publication Critical patent/TW202407473A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW112120807A 2022-06-06 2023-06-05 在氧化鹵素供給環境中有機金屬阻劑之基於氣體的顯影 TW202407473A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263349187P 2022-06-06 2022-06-06
US63/349,187 2022-06-06

Publications (1)

Publication Number Publication Date
TW202407473A true TW202407473A (zh) 2024-02-16

Family

ID=89118795

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112120807A TW202407473A (zh) 2022-06-06 2023-06-05 在氧化鹵素供給環境中有機金屬阻劑之基於氣體的顯影

Country Status (6)

Country Link
US (1) US20230408916A1 (enExample)
EP (1) EP4537162A4 (enExample)
JP (1) JP2025519455A (enExample)
KR (1) KR20250020467A (enExample)
TW (1) TW202407473A (enExample)
WO (1) WO2023239628A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250271755A1 (en) * 2024-02-28 2025-08-28 Inpria Corporation Controlled environment processing, rest steps, and baking processes for metal oxide-based resist patterning

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260059663A (ko) * 2015-10-13 2026-04-30 인프리아 코포레이션 유기주석 옥사이드 하이드록사이드 패터닝 조성물, 전구체 및 패터닝
CN113227909B (zh) * 2018-12-20 2025-07-04 朗姆研究公司 抗蚀剂的干式显影
TWI837391B (zh) * 2019-06-26 2024-04-01 美商蘭姆研究公司 利用鹵化物化學品的光阻顯影
EP4651192A3 (en) * 2020-01-15 2026-03-04 Lam Research Corporation Underlayer for photoresist adhesion and dose reduction
EP4115242A4 (en) * 2020-03-02 2024-03-13 Inpria Corporation PROCESSING ENVIRONMENT FOR THE FORMATION OF INORGANIC RESERVE PATTERNS
JP7774611B2 (ja) * 2020-07-17 2025-11-21 ラム リサーチ コーポレーション 被膜を形成するための方法

Also Published As

Publication number Publication date
US20230408916A1 (en) 2023-12-21
WO2023239628A1 (en) 2023-12-14
EP4537162A4 (en) 2026-04-29
EP4537162A1 (en) 2025-04-16
KR20250020467A (ko) 2025-02-11
JP2025519455A (ja) 2025-06-26

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