TW202406747A - 乾膜、發光型電子構件及發光型電子構件的製造方法 - Google Patents

乾膜、發光型電子構件及發光型電子構件的製造方法 Download PDF

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Publication number
TW202406747A
TW202406747A TW112128745A TW112128745A TW202406747A TW 202406747 A TW202406747 A TW 202406747A TW 112128745 A TW112128745 A TW 112128745A TW 112128745 A TW112128745 A TW 112128745A TW 202406747 A TW202406747 A TW 202406747A
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TW
Taiwan
Prior art keywords
light
resin layer
absorbing resin
dry film
emitting
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TW112128745A
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English (en)
Chinese (zh)
Inventor
片桐航
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日商信越聚合物股份有限公司
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Application filed by 日商信越聚合物股份有限公司 filed Critical 日商信越聚合物股份有限公司
Publication of TW202406747A publication Critical patent/TW202406747A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Epoxy Resins (AREA)
TW112128745A 2022-08-01 2023-08-01 乾膜、發光型電子構件及發光型電子構件的製造方法 TW202406747A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022122618A JP2024019873A (ja) 2022-08-01 2022-08-01 ドライフィルム、発光型電子部品、及び発光型電子部品の製造方法
JP2022-122618 2022-08-01

Publications (1)

Publication Number Publication Date
TW202406747A true TW202406747A (zh) 2024-02-16

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ID=89666617

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TW112128745A TW202406747A (zh) 2022-08-01 2023-08-01 乾膜、發光型電子構件及發光型電子構件的製造方法

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JP (1) JP2024019873A (ja)
CN (1) CN117497669A (ja)
TW (1) TW202406747A (ja)

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Publication number Publication date
JP2024019873A (ja) 2024-02-14
CN117497669A (zh) 2024-02-02

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